Jon,
        I believe that the key to the 0.1% limitation is the fact that it must 
be a homogeneous part. i.e. one part that cannot be reduced to lesser 
sub-materials. A solderball on a BGA is not a homogeneous part. Basically I 
believe that no electrical component is a homogeneous part. I believe that a 
straight steel screw containing 0.1% lead content is a homogeneous part, a 
screw plated with something that contains 0.1% lead is not a homogeneous part 
because the plating can be removed and therefore is not homogeneous. Same would 
stand for a BGA. Unless there is something which has come along recently to 
change this since I last was looking at the issue(s).
        At least this is what I have come to understand about the 0.1% 
limitation. Otherwise there would be a lot of assemblies that could pass the 
0.1% lead rule with no special lead-free concerns because the lead would not 
make up 0.1% of the total weight. The key word of concern is the word 
"homogeneous".

Sincerely,
Brad Velander
Senior PCB Designer
Northern Airborne Technology
#14 - 1925 Kirschner Road,
Kelowna, BC, V1Y 4N7.
tel (250) 763-2329 ext. 225
fax (250) 762-3374



-----Original Message-----
From: Jon Elson [mailto:[EMAIL PROTECTED]
Sent: Thursday, December 08, 2005 11:23 AM
To: Protel EDA Discussion List
Subject: Re: [PEDA] Via Solder Thieving, heard of this?




Mira wrote:

>Due to these problems BGAs are the only parts that
>will remain leaded even on a PB-free board. 
>  
>
Can you do this and still comply with RoHS?  The last thing
I heard was that the .1% Pb content limit was PER COMPONENT,
not per entire assembly, as I had thought before.  Just taking a wild
guess, I can't see how 37/63 Pb-Sn solder balls could stay under .1%
lead content on a lot of BGA parts.  The rest of the BGA really doesn't
weigh very much.

Jon


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