Jeff, Andrew,
The one time I had an issue with it, or something very similar, was
with my current employer. It was actually being caused by semi-cured tented
soldermask in our vias. The center of the filled vias was not completely curing
due to the thickness in the holes and the UV/heat not completely curing it.
Then in the warm/hot Au bath it was leeching and contaminating the Au pads.
Sincerely,
Brad Velander
Senior PCB Designer
Northern Airborne Technology
#14 - 1925 Kirschner Road,
Kelowna, BC, V1Y 4N7.
tel (250) 763-2232 ext. 225
fax (250) 762-3374
-----Original Message-----
From: [EMAIL PROTECTED] [mailto:[EMAIL PROTECTED]
Sent: Monday, August 13, 2007 5:40 AM
To: [EMAIL PROTECTED]; [email protected]
Subject: Re: [PEDA] Black Pad
Boils down to Au delamination due to corroded pads (NiO), doesn't it? I
read a tidbit but not much else
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