We have done BGAs for a while.  About a year ago we were struck with black 
pad.  Firstly, I can't help wondering if there is some connection, directly 
or indirectly, with the RoHS-mandated changes.  ENIG has been around for a 
while, but was not in as prevalent usage.  And the specs surrounding how to 
do it reliably seem to be in a state of flux.  Secondly, it preferentially 
attacks specific pads repeatedly on multiple boards, while rarely attacking 
adjacent pads of the same size and shape on the same boards.  This implies a 
dependency on how the board is designed, which means I want to know how to 
make it stop if I can.  We had two different PCB designs in the same product 
using the same layer stackup, layer thicknesses, trace widths and spacing, 
BGA pitch, plane structure, processes, etc.  They were both fabricated by 
the same fabrication house and assembled by the same assembly house in the 
same general timeframe.  Black Pad hit multiple pads on nearly every board 
of one design over both runs, but never hit any pads of any board of the 
other design over both runs.  I find that interesting.

I wonder what other problems will shake out in the next couple years.

Jeff

----- Original Message ----- 
From: <[EMAIL PROTECTED]>
To: <[EMAIL PROTECTED]>; <[email protected]>
Sent: Monday, August 13, 2007 1:56 PM
Subject: RE: [PEDA] Black Pad


> So...  what do you find so interesting about the issue, Jeff?
>
> Has there been a technical detail that's been found recently to bring
> the question into more focus for board houses and/or their customers? Or
> perhaps it's something else?
>
> Regards,
>
> aj
>
>>-----Original Message-----
>>From: [EMAIL PROTECTED]
>>[mailto:[EMAIL PROTECTED] On Behalf Of Jeff Condit
>>Sent: Sunday, August 12, 2007 8:08 PM
>>To: Protel EDA Forum
>>Subject: [PEDA] Black Pad
>>
>>Are you all familiar with "Black Pad"?  I've been looking into
>>it and its interesting.
>>
>>Jeff
>>
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