Ivan,
Instead of poring a copper plane that is solid, use one that is
cross hatched. You will have less issues with solder mask adhesion, which
would be more concern than warping. (Solder mask adheres to the substrate
better than it does to the copper).
Regards,
Ted
-----Original Message-----
From: Bagotronix Tech Support [mailto:[EMAIL PROTECTED]]
Sent: Tuesday, May 14, 2002 10:51 AM
To: Protel EDA Forum
Subject: [PEDA] board warp question
Hello, all:
I have a double sided PCB about 4 x 4 in. square, supported by mounting
holes, 1 in each corner. I want to pour a polygon ground plane on the top
side. The plane will cover probably about 80% of the board area. There
will be no plane on the bottom side. Am I going to have a problem with
board warp with this?
Thanks to those who responded to my "round board" questions.
Best regards,
Ivan Baggett
Bagotronix Inc.
website: www.bagotronix.com
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