On Thu, Mar 8, 2012 at 12:07, Marco Shaw <marco.s...@gmail.com> wrote: > I'm possibly looking at testing bonding in a "single network fabric" > environment. > I was thinking of giving NIC1 IP1, NIC2 IP2, and then creating BOND0 with IP3. > Is this do-able? All of the IPs are going to be routed through the > same networking device. I'm planning on an active-passive setup, so > when I pull the network cable on NIC1, I'd expect IP3 to be service > from NIC2.
You're confusing: - Frame (Layer-2 -- e.g., Ethernet) high availability / load balancing, with - Network (Layer-3 -- e.g., IP) high availability / load balancing. Bonding handles the former, allowing more than one physical interface to service frames (such as Ethernet). There are different bonding modes, including not sharing MAC addresses, failing over with the same MAC address, sharing MAC addresses, etc..., using both layer 2 (e.g., IEEE802.3ad Link Aggregation, aka mode 4) and higher layer 3+ (e.g., ARP, which handles L2 MAC to L3 IP mapping, several approaches used in several modes), and other facilities to update layer-2 (e.g., Ethernet) switch tables with the appropriate addresses Bonding (usually Ethernet) options are somewhat akin to the various options for Network (usually IP) high availability / load balancing including not sharing the same IP address (e.g., Round Robin DNS), failing over with the same IP address (e.g., active-passive/RHCS), sharing IP address (e.g., Piranha/HA), etc... It's very important to understand how the two differ, as well as how they can both be used to reduce a single point of failure at various levels. E.g., use bonding to allow redundant network cards in a server, which have redundant links, possibly to redundant network switches, use IP solutions to allow redundant servers, etc... -- Bryan J Smith - Professional, Technical Annoyance http://www.linkedin.com/in/bjsmith _______________________________________________ rhelv5-list mailing list rhelv5-list@redhat.com https://www.redhat.com/mailman/listinfo/rhelv5-list
