This process as written below should be captured into the geda wiki. I
do think the cost of the components is a hudge cost driver for a pcb
assembly!
However, the shop I primarily use for complex hierarchical boards with
bga's of over 1000 pins has no problem with the hierarchical refdes.
They ca
> They won't get my business again, as this crap is costing me a great
> deal of time -
I wrote the message below for a different list last year,
when someone wanted to know why getting a board built
by a CM cost so much more than the parts cost when bought
from DigiKey. It will give you lots to
Gang,
I've now finished my third board with gschem/gaf + PCB. I post
these pictures as an encouragement to others. I was was discouraged
at times learning the tools but with the help and support available
I finally pushed out some good stuff. I've posted pictures of two
of them for y
Ooops... wrong destination. Sorry...
On Thu, 17 Jul 2008 21:11:25 +0200
Levente Kovacs <[EMAIL PROTECTED]>
wrote:
> Szia Zsuzsi,
>
>
> Itt találhatsz információkat a mikro-csodák múzeumáról, amiről még
> vasárnap meséltem. Ha van kedved, elmehetnénk megnézni, érdemes.
>
> http://www.korona-et
Szia Zsuzsi,
Itt találhatsz információkat a mikro-csodák múzeumáról, amiről még
vasárnap meséltem. Ha van kedved, elmehetnénk megnézni, érdemes.
http://www.korona-etterem.hu/mikro/
Van kedved?
Jólegyél!
Levente
--
Levente Kovacs
http://logonex.eu
___
> It's been a while since I've been on gEDA. I can't find any documentation
> on creating footprints for PCB.
You gotta see the PCB footprint creation document ...
in pdf:
http://www.brorson.com/gEDA/land_patterns_20070818.pdf
and odf:
http://www.brorson.com/gEDA/land_patterns_20070818.odf
Phi
> On Thu, Jul 17, 2008 at 12:56 PM, Gary L. Roach
> <[EMAIL PROTECTED]>
> wrote:
>
>> Hi,
>>
>> How do I include heat sinks into the pcb layout. I have a schematic (in
>> gschem) that needs heat sinks on 2 components. One a TO220 and one a GBJ
>> case. I am developing the footprint for the GBJ cas
Hi Teodor,
On Thu, 2008-07-17 at 14:53 +0300, Robas, Teodor wrote:
>
> Bert Timmerman wrote:
> > Hi Kai-Martin, Teodor and all,
> >
> > On Wed, 2008-07-16 at 23:38 +, Kai-Martin Knaak wrote:
> >
> > > On Tue, 15 Jul 2008 16:14:05 +0300, Robas, Teodor wrote:
> > >
> > >
> > > > The
On Wed, 2008-07-16 at 12:49 -0700, Steve Meier wrote:
> I have found they need a little education and then seem fine with it.
>
> There is no shortage of assembly shops and so they tend to be willing to
> work with their customers.
These guys have told me to...
re-number the schematic list to sh
On Thu, Jul 17, 2008 at 12:56 PM, Gary L. Roach <[EMAIL PROTECTED]>
wrote:
> Hi,
>
> How do I include heat sinks into the pcb layout. I have a schematic (in
> gschem) that needs heat sinks on 2 components. One a TO220 and one a GBJ
> case. I am developing the footprint for the GBJ case but the pr
Hi,
How do I include heat sinks into the pcb layout. I have a schematic (in
gschem) that needs heat sinks on 2 components. One a TO220 and one a GBJ
case. I am developing the footprint for the GBJ case but the process is
complicated by the fact that the component can either be mounted
vertica
This might be one of the advantages for living in silicon valley.
Competition probably drives the non-capable out.
Bob Paddock wrote:
> On Wed, Jul 16, 2008 at 3:51 PM, Steve Meier <[EMAIL PROTECTED]> wrote:
>
>> Also, if you layed out a section and then duplicated it to make exact
>> copies t
Bert Timmerman wrote:
Hi Kai-Martin, Teodor and all,
On Wed, 2008-07-16 at 23:38 +, Kai-Martin Knaak wrote:
On Tue, 15 Jul 2008 16:14:05 +0300, Robas, Teodor wrote:
The following is a list of improvements I would like too see/have/maybe
implement.
1. Footprint alternatives.
On Wed, Jul 16, 2008 at 3:51 PM, Steve Meier <[EMAIL PROTECTED]> wrote:
> Also, if you layed out a section and then duplicated it to make exact
> copies their task should be easier not harder.
I've been on the other end of this at a CM. Make sure your
designators are unique
through out a board or
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