If thermal bank with 4 sensors, thermal driver should read TEMP_MSR3.
However, currently thermal driver would not read TEMP_MSR3 since mt8173
thermal driver only use 3 sensors on each thermal bank at the same time,
so this patch would not effect temperature.
Only if mt mt8173 thermal driver use 4
sensors on any thermal bank, would
read third sensor two times, and lose fourth sensor of vale.
cc: sta...@vger.kernel.org
Fixes: b7cf0053738c ("thermal: Add Mediatek thermal driver for mt2701.")
Reviewed-by: Matthias Brugger
Signed-off-by: Dawei Chien
---
drivers/thermal/mtk_the
Hi, Matthias,
On Thu, 2017-02-09 at 22:25 +0100, Matthias Brugger wrote:
>
> On 02/08/2017 06:31 AM, Dawei Chien wrote:
> > Thermal driver should read TEMP_MSR3 if thermal bank with 4 sensors.
> > However, Currently thermal driver don't need read TEMP_MSR3 since
> >
Thermal driver should read TEMP_MSR3 if thermal bank with 4 sensors.
However, Currently thermal driver don't need read TEMP_MSR3 since
thermal controller only use 3 sensors for each thermal bank.
Signed-off-by: Dawei Chien
---
drivers/thermal/mtk_thermal.c | 2 +-
1 file changed, 1 inse
On Mon, 2017-01-16 at 11:44 +0800, Dawei Chien wrote:
> On Fri, 2017-01-13 at 16:27 +0100, Matthias Brugger wrote:
> >
> > On 13/01/17 09:42, Erin Lo wrote:
> > > From: Dawei Chien
> > >
> > > Add thermal controller device nodes for MT2701.
> >
On Fri, 2017-01-13 at 16:27 +0100, Matthias Brugger wrote:
>
> On 13/01/17 09:42, Erin Lo wrote:
> > From: Dawei Chien
> >
> > Add thermal controller device nodes for MT2701.
> >
> > Signed-off-by: Dawei Chien
> > Signed-off-by: Erin Lo
>
From: "dawei.ch...@mediatek.com"
Add this for supporting thermal calibration by e-fuse data.
Signed-off-by: Dawei Chien
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi | 7 +++
1 file changed, 7 insertions(+)
diff --git a/arch/arm64/boot/dts/mediatek/mt8173.dtsi
b/arch/arm6
On Tue, 2016-09-06 at 11:28 +0800, Dawei Chien wrote:
> Dear Rui,
>
> On Tue, 2016-09-06 at 08:30 +0800, Zhang Rui wrote:
> > On 二, 2016-09-06 at 08:24 +0800, Zhang Rui wrote:
> > > On 四, 2016-08-18 at 11:50 +0800, Dawei Chien wrote:
> > > >
> > >
Dear Rui,
On Tue, 2016-09-06 at 08:30 +0800, Zhang Rui wrote:
> On 二, 2016-09-06 at 08:24 +0800, Zhang Rui wrote:
> > On 四, 2016-08-18 at 11:50 +0800, Dawei Chien wrote:
> > >
> > > This adds the thermal controller and auxadc nodes
> > > to the Mediatek MT270
name could be used for both MT2701/MT8173.
2. Add flexible array member to instead of normal array since
thermal bank has different array size between MT2701 to MT8173.
Dawei Chien (3):
dt-bindings: thermal: Add binding document for Mediatek thermal
controller
thermal: Add Mediatek
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2701.
Signed-off-by: Dawei Chien
---
.../bindings/thermal/mediatek-thermal.txt |4 +++-
1 file changed, 3 insertions(+), 1 deletion(-)
diff --git a/Documentation/devicetree
This adds the thermal controller and auxadc nodes
to the Mediatek MT2701 dtsi file.
Signed-off-by: Dawei Chien
---
This patch depned on:
https://patchwork.kernel.org/patch/9249589/
---
arch/arm/boot/dts/mt2701.dtsi | 44 +
1 file changed, 44 insertions
This patch adds support for mt2701 chip to mtk_thermal,
and integrate both mt8173 and mt2701 on the same driver.
MT8173 has four banks and five sensors, and MT2701 has
only one bank and three sensors.
Signed-off-by: Dawei Chien
---
This patch dependents on "Add clock support for Mediatek M
Hi Matthias,
On Thu, 2016-08-11 at 17:51 +0200, Matthias Brugger wrote:
>
> On 07/07/16 11:06, Dawei Chien wrote:
> > This adds the thermal controller and auxadc nodes
> > to the Mediatek MT2701 dtsi file.
> >
> > Signed-off-by: Dawei Chien
> > ---
Hi Matthias,
On Thu, 2016-08-11 at 17:48 +0200, Matthias Brugger wrote:
>
> On 11/07/16 10:52, dawei chien wrote:
> > Dear Keerthy,
> >
> > On Thu, 2016-07-07 at 16:39 +0530, Keerthy wrote:
> >>
> >> On Thursday 07 July 2016 02:36 PM, Dawei Chien wrot
Dear Keerthy,
On Mon, 2016-07-11 at 16:56 +0800, dawei chien wrote:
> Dear Keerthy,
>
> On Thu, 2016-07-07 at 17:24 +0530, Keerthy wrote:
> > Hi Dawei Chien,
> >
> >
> > On Thursday 07 July 2016 02:36 PM, Dawei Chien wrote:
> > > This patch add
Dear Keerthy,
On Thu, 2016-07-07 at 17:39 +0530, Keerthy wrote:
>
> On Thursday 07 July 2016 02:36 PM, Dawei Chien wrote:
> > This adds the thermal controller and auxadc nodes
> > to the Mediatek MT2701 dtsi file.
> >
> > Signed-off-by: Dawei Chien
> > ---
Dear Keerthy,
On Thu, 2016-07-07 at 17:24 +0530, Keerthy wrote:
> Hi Dawei Chien,
>
>
> On Thursday 07 July 2016 02:36 PM, Dawei Chien wrote:
> > This patch adds support for mt2701 chip to mtk_thermal.c,
> > and integrate both mt8173 and mt2701 on the same driver.
>
Dear Keerthy,
On Thu, 2016-07-07 at 16:39 +0530, Keerthy wrote:
>
> On Thursday 07 July 2016 02:36 PM, Dawei Chien wrote:
> > This adds the device tree binding documentation for the mediatek thermal
> > controller found on Mediatek MT2701.
> >
> &
This patch adds support for mt2701 chip to mtk_thermal.c,
and integrate both mt8173 and mt2701 on the same driver.
MT8173 has four banks and five sensors, and MT2701 has
only one bank and three sensors.
Signed-off-by: Dawei Chien
---
drivers/thermal/mtk_thermal.c | 258
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2701.
Signed-off-by: Dawei Chien
---
.../bindings/thermal/mediatek-thermal.txt |2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/Documentation/devicetree
This series support for mt2701 chip to mtk_thermal.c,
and integrate both mt8173 and mt2701 on the same driver.
MT8173 has four banks and five sensors, and MT2701 has
only one bank and three sensors.
This adds the thermal controller and auxadc nodes
to the Mediatek MT2701 dtsi file.
Signed-off-by: Dawei Chien
---
This patch depned on:
https://patchwork.kernel.org/patch/9213545/
---
arch/arm/boot/dts/mt2701.dtsi | 43 +
1 file changed, 43 insertions
On Tue, 2016-03-15 at 16:10 +0800, Dawei Chien (錢大衛) wrote:
> This device node is for calculating dynamic power in mW.
> Since mt8173 has two clusters, there are two dynamic power
> coefficient as well.
>
> Signed-off-by: Dawei Chien
> ---
> This patch is base on patchse
On Tue, 2016-04-12 at 10:41 +0530, Viresh Kumar wrote:
> On 12-04-16, 10:32, dawei chien wrote:
> > On Tue, 2016-03-22 at 13:13 +0800, dawei chien wrote:
> > > On Tue, 2016-03-15 at 13:17 +0700, Viresh Kumar wrote:
> > > > Its Rafael, who is going to apply this one.
&
On Tue, 2016-03-22 at 13:13 +0800, dawei chien wrote:
> On Tue, 2016-03-15 at 13:17 +0700, Viresh Kumar wrote:
> > On 15-03-16, 12:53, dawei chien wrote:
> > > On Thu, 2015-12-17 at 09:52 +0800, Viresh Kumar wrote:
> > > > On 16-12-15, 21:29, Dawei Chien wrote:
&
On Tue, 2016-03-15 at 13:17 +0700, Viresh Kumar wrote:
> On 15-03-16, 12:53, dawei chien wrote:
> > On Thu, 2015-12-17 at 09:52 +0800, Viresh Kumar wrote:
> > > On 16-12-15, 21:29, Dawei Chien wrote:
> > > > Use Intelligent Power Allocation (IPA) technical to ad
This device node is for calculating dynamic power in mW.
Since mt8173 has two clusters, there are two dynamic power
coefficient as well.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/17/251
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi |4
MT8173 cpufreq driver select of_cpufreq_power_cooling_register registering
cooling devices with dynamic power coefficient.
Signed-off-by: Dawei Chien
Acked-by: Viresh Kumar
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/17/251
---
drivers/cpufreq/mt8173-cpufreq.c | 11
nes and dynamic power models
respectively
Change since V2:
1. Move dynamic/static power model in device tree
Change since V1:
1. Include mt8171.h and sort header file for mt8173.dtsi
Dawei Chien (3):
thermal: mediatek: Add cpu dynamic power cooling model.
arm64: dts: mt8173: Add thermal zon
This adds thermal zone node to Mediatek MT8173 dtsi file.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/30/239
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi | 43 ++
1 file changed, 43 insertions(+)
diff --git a/arch
On Thu, 2015-12-17 at 09:52 +0800, Viresh Kumar wrote:
> On 16-12-15, 21:29, Dawei Chien wrote:
> > Use Intelligent Power Allocation (IPA) technical to add dynamic power model
> > for binding CPU thermal zone. The power allocator governor allocates power
> > budget to co
Add this for supporting thermal calibration by e-fuse data.
Signed-off-by: Dawei Chien
---
Because MTK thermal/efuse patches hadn't landed on mainline, this patch
must base on following patchset:
https://lkml.org/lkml/2015/11/17/251
https://lkml.org/lkml/2015/11/19/169
https://lkml.org/lkml
MT8173 cpufreq driver select of_cpufreq_power_cooling_register registering
cooling devices with dynamic power coefficient.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/17/251
---
drivers/cpufreq/mt8173-cpufreq.c | 11 +--
1 file changed
This device node is for calculating dynamic power in mW.
Since mt8173 has two clusters, there are two dynamic power
coefficient as well.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/17/251
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi |4
d dynamic power models
respectively
Change since V2:
1. Move dynamic/static power model in device tree
Change since V1:
1. Include mt8171.h and sort header file for mt8173.dtsi
Dawei Chien (3):
thermal: mediatek: Add cpu dynamic power cooling model.
arm64: dts: mt8173: Add thermal zone nod
This adds thermal zone node to Mediatek MT8173 dtsi file.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/30/239
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi | 43 ++
1 file changed, 43 insertions(+)
diff --git a/arch
On Wed, 2015-12-16 at 19:22 +0800, Daniel Kurtz wrote:
> On Wed, Dec 16, 2015 at 6:09 PM, dawei chien wrote:
> > On Wed, 2015-12-16 at 16:34 +0800, Daniel Kurtz wrote:
> >> On Wed, Dec 16, 2015 at 11:59 AM, Dawei Chien
> >> wrote:
> >> >
> >>
On Wed, 2015-12-16 at 16:34 +0800, Daniel Kurtz wrote:
> On Wed, Dec 16, 2015 at 11:59 AM, Dawei Chien
> wrote:
> >
> > This adds thermal zone node to Mediatek MT8173 dtsi file.
> >
> > Signed-off-by: Dawei Chien
> > ---
> > This patch is base on patc
MT8173 cpufreq driver select of_cpufreq_power_cooling_register registering
cooling devices with dynamic power coefficient.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/17/251
---
drivers/cpufreq/mt8173-cpufreq.c | 11 +--
1 file changed
dynamic/static power model in device tree
Change since V1:
1. Include mt8171.h and sort header file for mt8173.dtsi
Dawei Chien (3):
thermal: mediatek: Add cpu dynamic power cooling model.
arm64: dts: mt8173: Add thermal zone node.
arm64: dts: mt8173: Add dynamic power node.
arch/arm64/bo
This device node is for calculating dynamic power in mW.
Since mt8173 has two clusters, there are two dynamic power
coefficient as well.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/17/251
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi |4
This adds thermal zone node to Mediatek MT8173 dtsi file.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/30/239
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi | 43 ++
1 file changed, 43 insertions(+)
diff --git a/arch
On Mon, 2015-11-30 at 16:04 +0530, Viresh Kumar wrote:
> On 30-11-15, 18:21, dawei chien wrote:
> > As far as I know, user or shell script has the right for using command
> > online/offline cpu.
>
> Right.
>
> > Either user by console or shell script co
On Mon, 2015-11-30 at 15:00 +0530, Viresh Kumar wrote:
> On 30-11-15, 17:26, dawei chien wrote:
> > On Mon, 2015-11-30 at 11:08 +0530, Viresh Kumar wrote:
> > > On 27-11-15, 17:32, Dawei Chien wrote:
> > > > MT8173 cpufreq driver use of_cpufreq_power_cooling_regist
On Mon, 2015-11-30 at 11:08 +0530, Viresh Kumar wrote:
> On 27-11-15, 17:32, Dawei Chien wrote:
> > MT8173 cpufreq driver use of_cpufreq_power_cooling_register registering
> > cooling devices with dynamic power coefficient.
> >
> > Signed-off-by: Dawei Chien
> &
This adds thermal zone node to Mediatek MT8173 dtsi file.
Signed-off-by: Dawei Chien
---
This patch is based on patchset:
https://lkml.org/lkml/2015/11/18/84
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi | 43 ++
1 file changed, 43 insertions(+)
diff --git a/arch
MT8173 cpufreq driver use of_cpufreq_power_cooling_register registering
cooling devices with dynamic power coefficient.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/17/251
---
drivers/cpufreq/mt8173-cpufreq.c | 28
1
2015/11/17/251
Change since V1:
1. Include mt8171.h and sort header file for mt8173.dtsi
Change since V2:
1. Move dynamic/static power model in device tree
Change since V3:
1. Remove static power model.
2. Split V3's device tree in two for thermal zones and dynamic power models
respectively.
This device node is for calculating dynamic power in mW.
Since mt8173 has two clusters, there are two dynamic power
coefficient as well.
Signed-off-by: Dawei Chien
---
This patch is base on patchset:
https://lkml.org/lkml/2015/11/17/251
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi |4
WRITE,
> + mt->thermal_base + TEMP_ADCWRITECTRL);
> +
> + for (i = 0; i < cfg->num_sensors; i++)
> + writel(sensor_mux_values[cfg->sensors[i]],
> + mt->thermal_base + sensing_points[i].adcpnp);
> +
On Fri, 2015-11-06 at 08:50 +0530, Viresh Kumar wrote:
> On 05-11-15, 19:09, dawei chien wrote:
> > Thank you for your kindly explaining, now I could understand what I
> > miss, I will send device tree binding on next version such like
> > following description.
> &g
On Wed, 2015-11-04 at 11:41 -0800, Eduardo Valentin wrote:
> On Thu, Oct 22, 2015 at 08:02:39PM +0800, Dawei Chien wrote:
> > Add thermal zone node to mt8173.dtsi.
> >
> > Signed-off-by: Dawei Chien
> > ---
> > This patch is base on
> > https://patchw
On Wed, 2015-11-04 at 11:40 -0800, Eduardo Valentin wrote:
> On Thu, Oct 22, 2015 at 08:02:38PM +0800, Dawei Chien wrote:
> > This power model is base on Intelligent Power Allocation (IPA)
> > technical, requires that the operating-points of the CPUs are
> > registered u
On Mon, 2015-11-02 at 17:40 +0530, Viresh Kumar wrote:
> On 02-11-15, 18:46, dawei chien wrote:
> > On Wed, 2015-10-28 at 21:14 +0530, Viresh Kumar wrote:
> > > Sorry for being extremely late in reviewing this stuff. You are
> > > already on v3 and I haven't rev
On Wed, 2015-10-28 at 21:09 +0530, Viresh Kumar wrote:
> On 22-10-15, 20:02, Dawei Chien wrote:
> > Add thermal zone node to mt8173.dtsi.
> >
> > Signed-off-by: Dawei Chien
> > ---
> > This patch is base on
> > https://patchwork.kernel.org/patch/7249821/
Hi Viresh,
On Wed, 2015-10-28 at 21:14 +0530, Viresh Kumar wrote:
> On 22-10-15, 20:02, Dawei Chien wrote:
> > Use Intelligent Power Allocation (IPA) technical to add static/dynamic
> > power model for binding CPU thermal zone.
> > The power allocator governor allocates po
This power model is base on Intelligent Power Allocation (IPA)
technical, requires that the operating-points of the CPUs are
registered using the kernel's opp library and the
`cpufreq_frequency_table` is assigned to the `struct device`
of the cpu MT8173.
Signed-off-by: Dawei.Chien
---
This patch
Add thermal zone node to mt8173.dtsi.
Signed-off-by: Dawei Chien
---
This patch is base on
https://patchwork.kernel.org/patch/7249821/
https://patchwork.kernel.org/patch/7249861/
https://patchwork.kernel.org/patch/7249891/
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi | 90
Use Intelligent Power Allocation (IPA) technical to add static/dynamic power
model for binding CPU thermal zone.
The power allocator governor allocates power budget to control CPU temperature.
Power Allocator governor is able to keep SOC temperature within a defined
temperature range to avoid SO
On Mon, 2015-10-12 at 18:26 +0100, Punit Agrawal wrote:
> Mark Rutland writes:
>
> > On Wed, Oct 07, 2015 at 08:22:40PM +0800, Dawei Chien wrote:
> >> From: "Dawei.Chien"
> >>
> >> This power model is base on Intelligent Power Allocation (IPA) t
From: "Dawei.Chien"
This power model is base on Intelligent Power Allocation (IPA) technical,
requires that the operating-points of the CPUs are registered using the
kernel's opp library and the `cpufreq_frequency_table` is assigned to the
`struct device` of the cpu MT8173.
Signed-off-by: Dawei.
Use Intelligent Power Allocation (IPA) technical to add static/dynamic power
model for binding CPU thermal zone.
The power allocator governor allocates power budget to control CPU temperature.
Power Allocator governor is able to keep SOC temperature within a defined
temperature range to avoid SO
From: "Dawei.Chien"
Add thermal zone node to mt8173.dtsi.
Signed-off-by: Dawei.Chien
---
This patch is base on
https://patchwork.kernel.org/patch/7249821/
https://patchwork.kernel.org/patch/7249861/
https://patchwork.kernel.org/patch/7249891/
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi | 44
Hi Daniel,
On Mon, 2015-09-07 at 12:05 +0800, Daniel Kurtz wrote:
> On Mon, Sep 7, 2015 at 12:00 PM, Daniel Kurtz wrote:
> > Hi Dawei,
> >
> > On Fri, Sep 4, 2015 at 5:01 PM, Dawei Chien
> > wrote:
> >> Add thermal zone node to mt8173.dtsi.
Hi Viresh,
On Mon, 2015-09-07 at 11:39 +0530, Viresh Kumar wrote:
> On 04-09-15, 17:01, Dawei Chien wrote:
> > Use Intelligent Power Allocation (IPA) technical to add
> > static/dynamic power model for binding CPU thermal zone.
> > The power allocator governor allocates po
Sorry, forgot to add Rafael and Viresh as reviewer.
On Fri, 2015-09-04 at 17:01 +0800, Dawei Chien wrote:
> Use Intelligent Power Allocation (IPA) technical to add
> static/dynamic power model for binding CPU thermal zone.
> The power allocator governor allocates power budget to cont
Use Intelligent Power Allocation (IPA) technical to add
static/dynamic power model for binding CPU thermal zone.
The power allocator governor allocates power budget to control
CPU temperature.
Signed-off-by: Dawei Chien
---
This patch is base on
https://patchwork.kernel.org/patch/7034601
Add thermal zone node to mt8173.dtsi.
Signed-off-by: Dawei Chien
---
This patch is base on following patches
https://patchwork.kernel.org/patch/6969581/
https://patchwork.kernel.org/patch/6969571/
https://patchwork.kernel.org/patch/6969381/
---
arch/arm64/boot/dts/mediatek/mt8173.dtsi | 44
Use Intelligent Power Allocation (IPA) technical to add
static/dynamic power model for binding CPU thermal zone.
The power allocator governor allocates power budget to control
CPU temperature.
Dawei.Chien (2):
thermal: mediatek: Add cpu power cooling model.
arm64: dts: mt8173: Add thermal zone
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