Further FACTS for you Marshall:
H2O2 will liberate O upon contact with many metals!
All surfaces were cleaned with separate SS brushes,
except the copper oxide test on a PC board. (using the
same brush, made plastic foam, if done after silver!)
35% H2O2 on solder (lead/tin) = very fast bubble formation
" silver bar 80% of speed
" Aluminum 60% "
" copper oxide 50% "
" pure copper 40% "
" Stainless steel 0. 1% "
" finely divided silver (evaporate Cs to a moist sludge
or apply to the sludge on the negative electrode)
Extremely rapid to the point of forming a mist and
evaporation of remaining H2O2 (boils off!). This
is clearly an exothermic reaction!
[email protected]
At 10:56 AM 6/19/2000, you wrote:
Maybe this is what is happening.
1. (FACT) Silver does not react with O2 under normal conditions.
2. (FACT) H2O2 will liberate O upon contact with some size/shapes of silver.
3. (FACT) CS particles are positive charged, O is highly negative charged.
4. (Maybe) the O particles neutralize the silver particle causing any clumps
of silver particles to no longer clump together, they separate, then the O's
find each other, make O2, which then bubbles off, and the silver particle is
now broken up into smaller particles, and positive again.
If that is the case, then H2O2 would be acting as a catalyst, and I believe
this would explain everything.
Marshall
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