Steve Shyvers wrote:
Thanks, Harry. I bow to your superior wisdom and knowledge, and, most of all, to your willingness to share it.
Regards, Steve
Nice to have someone so nice having the last word more often than not. It's always clear that Harry has taken more time in crafting his comments than most (including me). Thanks.
royce in SB
[EMAIL PROTECTED] wrote:
At 03:43 PM 7/10/03 -0700, you wrote:
Harry, would it be more correct to say that you were trying to break the
surface tension of the molten solder blob in order to make it run along the
joint?
Theoretically solders won't flow, or rather wet, because the flux has
broken down or was inadequate to begin with or a contaminate, usually an
oxide of some sort, has formed on the target surfaces. The idea of
scratching is to attempt to remove or at least displace some of that oxide
in order to encourage the solder to stick. The failure of scratching in
silver soldering is due to the high temps involved and the quick formation
of hard oxides or burnt contaminates. Another hopeless non-starter is
attempting to add a fluid flux to a joint at brazing temp.
Regards, Harry
