>> Here's the serial number for my failing XO 1.5: >> SHC937011C5 > > Certainly an XO-1.5 B2, and I've two of those, and they are affected by > the two problems you described. We won't be fixing them. But if you > need your XO-1.5 B2 replaced (e.g. because it won't let you use wireless > after suspend), talk to Adam.
It is worth trying to improve the contact between the heat spreader and the processor. The temporary fix used with C1 units was the addition of two 10mm x 10mm x 2.75mm pieces of relatively stiff (and heat resistant) self-adhesive foam to the hear spreader directly over the processor and companion chip. The solution implemented for production changed the heat spreader to add another mounting point. Anytime the heat spreader is removed, the state of the thermal pads between the proc/companion chip and the spreader should be checked. If torn or missing, you can substitute a non-conductive thermal grease (or a new pad). If you don't do either of these, the performance of the laptops will be severely degraded. You might experience random problems, and the laptop lifetime will probably be compromised. Where did you obtain these laptops ? We absolutely do not recommend giving pre-production versions to kids... Regards, John _______________________________________________ Testing mailing list [email protected] http://lists.laptop.org/listinfo/testing
