This is really a fascinating idea. I have noticed that there are water cooling kits made for computer CPU's. Some of the bigger CPU's run over 225 watts of power. I wonder how applicable one those CPU kits might be. They include a heat sink, pump and radiator.
73, Doug -- K0DXV

On 12/16/2014 11:10 AM, David Cutter wrote:
Hi Dick

Start from the LDMOS data sheet and work out the temperature you wish to keep within at the junction. Because water cooling is so good, you can choose either to run the device cooler than you would with air cooling to improve reliability, or stick to the same temperature and get more power / use a smaller cooling plate / use less water. There's a direct relationship between reliability and temperature, but it's not linear. Then use the temperature rise per W rating of the device to get to the surface temperature.

In work I did >10 years ago all devices were directly bolted to the liquid-cooled plate without an intermediate spreader, however, these LDMOS devices are so small (ie very high heat density) there is a good reason to spread the heat out first before cooling proper takes place, I'm somewhat hazy what thickness, but you must achieve good flatness of contact against the plate. Some very large devices eg IGBTs and rectifiers the size of your open hand are supplied curved and the bolting-down process achieves the flatness with the correct torque setting on the bolts. Then you do the same sums as you do with air cooling ie temperature rise v watts dissipated from the heat sink data.

Say you want to dissipate 1kW of heat continuously (eg in a data contest) then a small 2 pass model would give you around 90 to 100K rise at the surface of the plate with 1 US gallon per minute, whereas a 4 pass model would give you around 20K rise on a 152mm length plate. This of course assumes that the heat is being delivered into the plate evenly over the whole surface, ie using a spreader. Heat sink paste adds a little to the thermal gradient and is needed in very small amounts, evenly spread.

Do the sums several times with different criteria until you get to the one you feel comfortable with. If you live in a cold climate you can dump the heat into a small central heating radiator to keep the shack warm and no fans required just an aquarian pump to run it; if you live in a hot place, then put the radiator on the shade side of the house or even bury it. If water is abundant, eg river water or a pond, you can re-cycle it back to the source.

You can make your own water cooling plate, see here a small example cooling a dozen TO-220 devices:
https://www.youtube.com/watch?v=WGpau-raMho
Somebody here will check my sums I'm sure.
73
David
G3UNA

----- Original Message ----- From: "Richard Solomon" <w1...@earthlink.net>
To: <elecraft@mailman.qth.net>
Sent: Tuesday, December 16, 2014 4:44 PM
Subject: Re: [Elecraft] LDMOS for QRO [OT]


If one wanted to use one of these to cool an LDMOS VHF KW, where would
one find the design info to calculate which cold plate would provide sufficient
cooling ?

I envision a stack something like this:

LDMOS PC Board
Copper Heatsink (thickness need be determined)
Cold Plate
Aluminum Heat Sink (is this really necessary ?).

73 es HH, Dick, W1KSZ


On 12/14/2014 4:32 PM, David Cutter wrote:
I'm a little surprised that folks in this group haven't suggested liquid cooling for this modest application. Semiconductor cold plates have been around for a long time, are economical to use and in my view a much better solution than forced air cooling. They are compact, quiet, require far less cabinet space, keep junctions cooler and more stable than air could ever and enable higher reliability.

Look at Aavid for instance, whose devices I used on many occasions:
http://www.aavid.com/sites/default/files/products/liquid/pdf/liquid-cold-plate-datasheet-hicontact.pdf

If you play your cards right, you can cool the amplifier and the power supply on a short 4-pass plate. Put the heat somewhere convenient, not in your shack.

73

David
G3UNA


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