Add Device Tree binding constants for Qualcomm Thermal Mitigation Device (TMD) types used by remoteproc-backed thermal cooling devices.
Qualcomm remote processors expose thermal mitigation endpoints through QMI. These endpoints can be registered with the thermal framework via the `#cooling-cells` property on the remoteproc node. The QMI TMD protocol identifies devices using string names (for example, "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with `#cooling-cells = <3>` requires numeric device id in the form: <&phandle device_id min_state max_state> Define common TMD device index constants shared across currently supported platforms. If a future target requires a different mapping, additional target-specific constants can be introduced while preserving existing DT ABI. Signed-off-by: Gaurav Kohli <[email protected]> --- MAINTAINERS | 1 + include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++ 2 files changed, 21 insertions(+) diff --git a/MAINTAINERS b/MAINTAINERS index 57656ec0e9d5..ffd85fd1dd80 100644 --- a/MAINTAINERS +++ b/MAINTAINERS @@ -3410,6 +3410,7 @@ F: drivers/firmware/qcom/ F: drivers/soc/qcom/ F: drivers/watchdog/gunyah_wdt.c F: include/dt-bindings/arm/qcom,ids.h +F: include/dt-bindings/firmware/qcom,qmi-tmd.h F: include/dt-bindings/firmware/qcom,scm.h F: include/dt-bindings/soc/qcom* F: include/linux/firmware/qcom diff --git a/include/dt-bindings/firmware/qcom,qmi-tmd.h b/include/dt-bindings/firmware/qcom,qmi-tmd.h new file mode 100644 index 000000000000..73efecef0f3c --- /dev/null +++ b/include/dt-bindings/firmware/qcom,qmi-tmd.h @@ -0,0 +1,20 @@ +/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */ +/* + * Qualcomm QMI TMD (Thermal Mitigation Device) cooling device indices + * + * These indices are used in device tree cooling-maps to reference + * specific TMD devices provided by remote processors via QMI. + * + * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries. + */ +#ifndef _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H +#define _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H + +/* CDSP thermal mitigation device id */ +#define QCOM_CDSP_TMD_CDSP_SW 0 + +/* Modem thermal mitigation device id */ +#define QCOM_MODEM_TMD_PA 0 +#define QCOM_MODEM_TMD_MODEM 1 + +#endif /* _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H */ -- 2.34.1
