On 7/3/2026 1:22 PM, Krzysztof Kozlowski wrote:
On Fri, Jul 03, 2026 at 10:33:04AM +0530, Gaurav Kohli wrote:
Add Device Tree binding constants for Qualcomm Thermal Mitigation
Device (TMD) types used by remoteproc-backed thermal cooling devices.
Qualcomm remote processors expose thermal mitigation endpoints
through QMI. These endpoints can be registered with the thermal
framework via the `#cooling-cells` property on the remoteproc node.
The QMI TMD protocol identifies devices using string names (for example,
"pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with
`#cooling-cells = <3>` requires numeric device id in the form:
<&phandle device_id min_state max_state>
Define common TMD device index constants shared across currently
supported platforms. If a future target requires a different mapping,
additional target-specific constants can be introduced while preserving
existing DT ABI.
Signed-off-by: Gaurav Kohli <[email protected]>
---
MAINTAINERS | 1 +
include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++
Why is it put into firmware? What part of firmware are you describing?
To me it looks like thermal thing and even you wrote: Thermal Mitigation Device
Ack, it looks better under thermal. Will move to
include/dt-bindings/thermal/qcom,qmi-tmd.h in the next version.
Best regards,
Krzysztof
