On Fri, Jul 03, 2026 at 10:33:04AM +0530, Gaurav Kohli wrote: > Add Device Tree binding constants for Qualcomm Thermal Mitigation > Device (TMD) types used by remoteproc-backed thermal cooling devices. > > Qualcomm remote processors expose thermal mitigation endpoints > through QMI. These endpoints can be registered with the thermal > framework via the `#cooling-cells` property on the remoteproc node. > > The QMI TMD protocol identifies devices using string names (for example, > "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with > `#cooling-cells = <3>` requires numeric device id in the form: > > <&phandle device_id min_state max_state> > > Define common TMD device index constants shared across currently > supported platforms. If a future target requires a different mapping, > additional target-specific constants can be introduced while preserving > existing DT ABI. > > Signed-off-by: Gaurav Kohli <[email protected]> > --- > MAINTAINERS | 1 + > include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++
As explained many times: Header file is not a separate commit. You need binding using this. > 2 files changed, 21 insertions(+) > > diff --git a/MAINTAINERS b/MAINTAINERS > index 57656ec0e9d5..ffd85fd1dd80 100644 > --- a/MAINTAINERS > +++ b/MAINTAINERS > @@ -3410,6 +3410,7 @@ F: drivers/firmware/qcom/ > F: drivers/soc/qcom/ > F: drivers/watchdog/gunyah_wdt.c > F: include/dt-bindings/arm/qcom,ids.h > +F: include/dt-bindings/firmware/qcom,qmi-tmd.h > F: include/dt-bindings/firmware/qcom,scm.h > F: include/dt-bindings/soc/qcom* > F: include/linux/firmware/qcom > diff --git a/include/dt-bindings/firmware/qcom,qmi-tmd.h > b/include/dt-bindings/firmware/qcom,qmi-tmd.h > new file mode 100644 > index 000000000000..73efecef0f3c > --- /dev/null > +++ b/include/dt-bindings/firmware/qcom,qmi-tmd.h > @@ -0,0 +1,20 @@ > +/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */ > +/* > + * Qualcomm QMI TMD (Thermal Mitigation Device) cooling device indices > + * > + * These indices are used in device tree cooling-maps to reference > + * specific TMD devices provided by remote processors via QMI. > + * > + * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries. > + */ > +#ifndef _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H > +#define _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H > + > +/* CDSP thermal mitigation device id */ > +#define QCOM_CDSP_TMD_CDSP_SW 0 QCOM_TMD_CDSP > + > +/* Modem thermal mitigation device id */ > +#define QCOM_MODEM_TMD_PA 0 QCOM_TMD_MODEM_PA > +#define QCOM_MODEM_TMD_MODEM 1 QCOM_TMD_MODEM Best regards, Krzysztof
