On 7/3/2026 1:23 PM, Konrad Dybcio wrote:
On 7/3/26 7:03 AM, Gaurav Kohli wrote:
Add Device Tree binding constants for Qualcomm Thermal Mitigation
Device (TMD) types used by remoteproc-backed thermal cooling devices.
Qualcomm remote processors expose thermal mitigation endpoints
through QMI. These endpoints can be registered with the thermal
framework via the `#cooling-cells` property on the remoteproc node.
The QMI TMD protocol identifies devices using string names (for example,
"pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with
`#cooling-cells = <3>` requires numeric device id in the form:
<&phandle device_id min_state max_state>
Define common TMD device index constants shared across currently
supported platforms. If a future target requires a different mapping,
additional target-specific constants can be introduced while preserving
existing DT ABI.
Signed-off-by: Gaurav Kohli <[email protected]>
---
MAINTAINERS | 1 +
include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++
2 files changed, 21 insertions(+)
diff --git a/MAINTAINERS b/MAINTAINERS
index 57656ec0e9d5..ffd85fd1dd80 100644
--- a/MAINTAINERS
+++ b/MAINTAINERS
@@ -3410,6 +3410,7 @@ F: drivers/firmware/qcom/
F: drivers/soc/qcom/
F: drivers/watchdog/gunyah_wdt.c
F: include/dt-bindings/arm/qcom,ids.h
+F: include/dt-bindings/firmware/qcom,qmi-tmd.h
F: include/dt-bindings/firmware/qcom,scm.h
F: include/dt-bindings/soc/qcom*
F: include/linux/firmware/qcom
diff --git a/include/dt-bindings/firmware/qcom,qmi-tmd.h
b/include/dt-bindings/firmware/qcom,qmi-tmd.h
new file mode 100644
index 000000000000..73efecef0f3c
--- /dev/null
+++ b/include/dt-bindings/firmware/qcom,qmi-tmd.h
@@ -0,0 +1,20 @@
+/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */
+/*
+ * Qualcomm QMI TMD (Thermal Mitigation Device) cooling device indices
+ *
+ * These indices are used in device tree cooling-maps to reference
+ * specific TMD devices provided by remote processors via QMI.
+ *
+ * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries.
+ */
+#ifndef _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H
+#define _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H
+
+/* CDSP thermal mitigation device id */
+#define QCOM_CDSP_TMD_CDSP_SW 0
+
+/* Modem thermal mitigation device id */
+#define QCOM_MODEM_TMD_PA 0
+#define QCOM_MODEM_TMD_MODEM 1
What about the dozens other ones that Dmitry's laptop reports?Ri
Thanks for the review, Konrad.
We are only defining constants for the TMD devices that are actually
used for thermal mitigation on the platforms supported by this series.
More constants can be added as needed.
https://lore.kernel.org/linux-arm-msm/4gs664zboaqgpok33x7bgorfmhh3f2fahjkt4jjl6fbzpwixnm@hxzz2xeogd4k/
Konrad
