Those are all good choices of heat sink manufacturers. I've
designed in parts from most of them. Wakefield and Aavid, in particular,
have good design notes and tutorials.
I'd suggest individual heat sinks for the two chips. That would
avoid a bunch of problems in maintaining coplanarity between the contact
surfaces of two different parts. It would also give us a better shot at
finding off-the-shelf heat sinks. Of course, it does mean we'd have to
account for flow shadowing.
Presumably, the data sheets for the two ICs have some
recommendations on mounting methods and heat sink attachment methods?
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