On 9/10/05, Jack Carroll <[EMAIL PROTECTED]> wrote: > Those are all good choices of heat sink manufacturers. I've > designed in parts from most of them. Wakefield and Aavid, in particular, > have good design notes and tutorials. > I'd suggest individual heat sinks for the two chips. That would > avoid a bunch of problems in maintaining coplanarity between the contact > surfaces of two different parts. It would also give us a better shot at > finding off-the-shelf heat sinks. Of course, it does mean we'd have to > account for flow shadowing.
Coplanarity is a concern, and one thing we should do early on is find out the component heights (thicknesses) of those two chips. > Presumably, the data sheets for the two ICs have some > recommendations on mounting methods and heat sink attachment methods? Yup... let's find those datasheets. :) _______________________________________________ Open-graphics mailing list [email protected] http://lists.duskglow.com/mailman/listinfo/open-graphics List service provided by Duskglow Consulting, LLC (www.duskglow.com)
