Ken Kriesel wrote: > A hot chip and a cool heat sink are both consistent with a poor thermal > connection between them (paste misapplied or missing). Apply fresh paste > and don't remove the heat sink afterward to see how it spread; if you do > that you'll need to wipe it clean and start again. >
chances are pretty good the Dell uses a 'thermal pad' rather than heat sink paste. these pads are reasonably efficient and harder to misinstall than goo. _______________________________________________ Prime mailing list [email protected] http://hogranch.com/mailman/listinfo/prime
