On Fri, 2008-08-22 at 09:46 -0400, Jon Strayer wrote: > On Fri, Aug 22, 2008 at 12:51 AM, John R Pierce <[EMAIL PROTECTED]> wrote: > > > Ken Kriesel wrote: > > > A hot chip and a cool heat sink are both consistent with a poor thermal > > > connection between them (paste misapplied or missing). Apply fresh paste > > > and don't remove the heat sink afterward to see how it spread; if you do > > > that you'll need to wipe it clean and start again. > > > > > > > > > chances are pretty good the Dell uses a 'thermal pad' rather than heat > > sink paste. these pads are reasonably efficient and harder to > > misinstall than goo. > > > > > What would the symptoms be if the pad was missing?
See above, substituting "pad" for "paste". Doh! Paul _______________________________________________ Prime mailing list Prime@hogranch.com http://hogranch.com/mailman/listinfo/prime
