On Fri, Aug 22, 2008 at 12:51 AM, John R Pierce <[EMAIL PROTECTED]> wrote:
> Ken Kriesel wrote: > > A hot chip and a cool heat sink are both consistent with a poor thermal > > connection between them (paste misapplied or missing). Apply fresh paste > > and don't remove the heat sink afterward to see how it spread; if you do > > that you'll need to wipe it clean and start again. > > > > > chances are pretty good the Dell uses a 'thermal pad' rather than heat > sink paste. these pads are reasonably efficient and harder to > misinstall than goo. > > What would the symptoms be if the pad was missing? -- Esse Quam Videre To Be, rather than to Seem _______________________________________________ Prime mailing list [email protected] http://hogranch.com/mailman/listinfo/prime
