Yes. Unless you're grinding it away with a dremel (which I wouldn't recommend as far as chemical dust is concerned), nibbling away with sidecutters would be trying to force the 2 ends of the component apart. That may be stressing the pads they're soldered to, leading to a possible pad lifting at some stage.
Any of the methods mentioned that heat both ends at the same time - allowing the component to be wiped off the board - would have to be the best, stress-wise. On 6/11/2016, at 3:00 PM, Scott Stobbe wrote: > For through hole parts sure, but I would not recommend that on SMD parts, > the copper foil of a little pad is pretty easy to tear off and it's a royal > pain if you have to mount a device missing some of its landing pads. > > On Sat, Nov 5, 2016 at 4:37 PM, Tom Miller <tmiller11...@verizon.net> wrote: > >> I usually nibble away at the center of the part until it is two separate >> pieces. Then unsolder each piece. Clean the pads off with wick then install >> the new part. >> >> Use a good sharp pair of flush cut side cutters. >> >> Tom >> >> _______________________________________________ time-nuts mailing list -- time-nuts@febo.com To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts and follow the instructions there.
