It seems to me like solder paste is going to separate under any pressure differential without some special design or consideration to keep the paste together.
On Sat, Aug 18, 2012 at 7:34 AM, andy pugh <bodge...@gmail.com> wrote: > On 18 August 2012 13:18, <ceen...@in-front.com> wrote: > > I found a high pressure pump (up to 40,000PSI) that may work with solder > paste. These are readily available on ebay as high pressure liquid > chromatography (HPLC) pumps. A description is here: > http://www.lcresources.com/resources/getstart/2b01.htm > > I suspect that some form of diaphragm pump would probably work better > with paste. > http://en.wikipedia.org/wiki/Diaphragm_pump > > -- > atp > If you can't fix it, you don't own it. > http://www.ifixit.com/Manifesto > > > ------------------------------------------------------------------------------ > Live Security Virtual Conference > Exclusive live event will cover all the ways today's security and > threat landscape has changed and how IT managers can respond. Discussions > will include endpoint security, mobile security and the latest in malware > threats. http://www.accelacomm.com/jaw/sfrnl04242012/114/50122263/ > _______________________________________________ > Emc-users mailing list > Emc-users@lists.sourceforge.net > https://lists.sourceforge.net/lists/listinfo/emc-users > ------------------------------------------------------------------------------ Live Security Virtual Conference Exclusive live event will cover all the ways today's security and threat landscape has changed and how IT managers can respond. Discussions will include endpoint security, mobile security and the latest in malware threats. http://www.accelacomm.com/jaw/sfrnl04242012/114/50122263/ _______________________________________________ Emc-users mailing list Emc-users@lists.sourceforge.net https://lists.sourceforge.net/lists/listinfo/emc-users
