Gene Heskett wrote:
>   I would add that temporary storage of the 
> pasted board should be in an oxygen-free environment until the board comes 
> out to goto the pick-n-place station, then back into the same low oxygen 
> box while the reflow oven is warming up.
>   
I normally get my boards from the paste application to the P&P and into 
the oven
in 10 minutes or so.  But, sometimes when I got interrupted, I have let 
them sit for
several hours with no problem at all.
>  
> That seems like a needless method then, because it would take far more time 
> to do a board dot by dot than by the stencil method.
Yes, when everything it working right, it takes me more like 10 seconds 
to apply paste to
a small board.  Lift stencil, drop board into fixture, lower stencil, 
wipe paste in with metal
blade, lift stencil and remove board.  I have to get pictures of my 
super-simple fixture
for this.  An aluminum plate with a grid of tapped holes, and bars with 
a step on one edge
that are clamped to hold the board.  Stencil is attached with a piece of 
masking tape
to form a hinge.
>   I wouldn't fix what 
> isn't broken. :)  Except of course for one-offs while developing the next 
> design.  For that, I'd be tempted to try putting the dispenser head on an 
> XY plotter and stripping the locations to paste out of the eagle (or 
> whatever you use) files so that is largely automated.
For first article boards, I just do the whole board by hand.  Even if 
the stencil was
produced at the push of a button, I'd still have to set up the P&P 
machine, which
is time consuming.  I have to find all the parts, put them on feeders 
and put the
feeders in the right spot.  Programming is nearly automatic, I wrote a 
program
that gets the part and placement info from the CAD package and writes 
the file
for the P&P machine.

And, the WHOLE job of the solder flux is to take care of the oxidation 
problem!

Jon

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