Mike,

Based on customer requirements I need 3 ground planes.

They all share the same net name however (as they must):

The IC's and connectors, etc. hit all three planes
Filter Caps only connect to the inner most ground plane
and any signal that must pass through  the "core power/ground" pair
must have a return ground via that only connects to the 2 outer most
ground planes.

By Manipulating the plane clearences by say a mil I get a separate Dcode
for the desired pads and can modify the gerbers to thermals where
required.

I have been meeting these requirements for many years and their boards
always work so who am I to question their reasons.

Regards,

Jim McGrath
CAD Connections, Inc.


Michael Reagan wrote:

> > > I recall you once emailing me with some details of a PCB that you had
> > > designed, in which you wanted various pads to connect to different Power
> > > Plane layers in different ways (Direct Connect, Thermal Relief
> > Connect, or
> > > No Connect). Although I didn't respond to you soon afterwards, I did
> > > eventually send you a response in which I suggested that you
> > could specify
> > > the pads concerned to Direct Connect to the Power Plane layers,
> > and then add
> > > primitives (arcs or single layer pads) to each Power Plane layer as
> > > appropriate to effectively change each connection between each
> > pad and each
> > > Power Plane layer to whatever you required (i.e. Thermal Relief
> > Connect or
> > > No Connect).
>
> Jim
> Why would you want to do this? if I may ask
>
> Mike Reagan
> EDSI
> Frederick Md
>

* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
* To post a message: mailto:[EMAIL PROTECTED]
*
* To leave this list visit:
* http://www.techservinc.com/protelusers/subscrib.html
*                      - or email -
* mailto:[EMAIL PROTECTED]?body=leave%20proteledaforum
*
* Contact the list manager:
* mailto:[EMAIL PROTECTED]
*
* Browse or Search previous postings:
* http://www.mail-archive.com/[email protected]
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *

Reply via email to