Jim,
I can understand the "who am I to ask" answer. I know how to respond.
Jim,
What I might try is placing mini split planes around the pads on layer you
dot want to connect, The end result is the same as placing pads on the same
layers.
A third choice is to make the caps and Ics in the library with the gnd pads
associated with them , that way when you move the component and the
properties stay with them. I like that idea better actually
Their gnd scheme sounds interesting for keeping dirty power from cleaner
power.
Mike Reagan
EDSI
> -----Original Message-----
> From: Jim McGrath [mailto:[EMAIL PROTECTED]]
> Sent: Friday, June 15, 2001 4:45 PM
> To: Protel EDA Forum
> Subject: Re: [PEDA] sugestions for improving Protel
>
>
> Mike,
>
> Based on customer requirements I need 3 ground planes.
>
> They all share the same net name however (as they must):
>
> The IC's and connectors, etc. hit all three planes
> Filter Caps only connect to the inner most ground plane
> and any signal that must pass through the "core power/ground" pair
> must have a return ground via that only connects to the 2 outer most
> ground planes.
>
> By Manipulating the plane clearences by say a mil I get a separate Dcode
> for the desired pads and can modify the gerbers to thermals where
> required.
>
> I have been meeting these requirements for many years and their boards
> always work so who am I to question their reasons.
>
> Regards,
>
> Jim McGrath
> CAD Connections, Inc.
>
>
> Michael Reagan wrote:
>
> > > > I recall you once emailing me with some details of a PCB
> that you had
> > > > designed, in which you wanted various pads to connect to
> different Power
> > > > Plane layers in different ways (Direct Connect, Thermal Relief
> > > Connect, or
> > > > No Connect). Although I didn't respond to you soon afterwards, I did
> > > > eventually send you a response in which I suggested that you
> > > could specify
> > > > the pads concerned to Direct Connect to the Power Plane layers,
> > > and then add
> > > > primitives (arcs or single layer pads) to each Power Plane layer as
> > > > appropriate to effectively change each connection between each
> > > pad and each
> > > > Power Plane layer to whatever you required (i.e. Thermal Relief
> > > Connect or
> > > > No Connect).
> >
> > Jim
> > Why would you want to do this? if I may ask
> >
> > Mike Reagan
> > EDSI
> > Frederick Md
> >
>
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