After doing research, I see that from: http://www.fda.gov/ICECI/Inspections/InspectionGuides/InspectionTechnicalGuides/ucm072859.htm
The more active the flux the easier a solder connection can be made and the > fewer rejects that occur. However, if not properly removed after soldering, > active fluxes can lead to corrosion and electrical failures. What is the best way to remove the flux? If it's a chemical, do I just wipe down that one side of the pcb board that is flat and leave the other side alone? Thanks, -Darin On Saturday, October 11, 2014 2:03:52 PM UTC-5, johnk wrote: > > > "I don't know why the FET was replaced. Either it was bad "out-of-box", > or the assembler ..." > > Or it was just a late-arriving component and no problem at all. > > AND, way back at the beginning..."otherwise the life of the clock will > not be as long as it will without the heat." > > Whilst in general terms less heat = greater life, if it is running within > design specs the tubes will go first. [NOTE - as many have said so far..... > hard facts ie numbers are needed] > > John K > > > > > -- You received this message because you are subscribed to the Google Groups "neonixie-l" group. To unsubscribe from this group and stop receiving emails from it, send an email to neonixie-l+unsubscr...@googlegroups.com. To post to this group, send an email to neonixie-l@googlegroups.com. To view this discussion on the web, visit https://groups.google.com/d/msgid/neonixie-l/5d447488-b841-4ee5-bc31-878ecb4d4f6f%40googlegroups.com. For more options, visit https://groups.google.com/d/optout.
