On 2007-10-02 09:38:27, [EMAIL PROTECTED] wrote: > This means that one could create a component incorporating both > rule-based thru-hole pads and surface mount features (not single-layer > pads...) that functionally act as surface mount pads, then what's the > harm?
Difference is probably that the paste and solder masks have to be defined manually for these fake pads, and that the expansion settings for these masks don't work on them. Gerhard ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[EMAIL PROTECTED] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
