Ah...good point...back to the drawing board... >-----Original Message----- >From: [EMAIL PROTECTED] >[mailto:[EMAIL PROTECTED] On Behalf Of Gerhard Fiedler >Sent: Tuesday, October 02, 2007 11:47 AM >To: Protel EDA Discussion List >Subject: Re: [PEDA] Mixing Surface mount and through hole in >one PCBcomponent. > >On 2007-10-02 09:38:27, [EMAIL PROTECTED] wrote: > >> This means that one could create a component incorporating both >> rule-based thru-hole pads and surface mount features (not >single-layer >> pads...) that functionally act as surface mount pads, then >what's the >> harm? > >Difference is probably that the paste and solder masks have to >be defined manually for these fake pads, and that the >expansion settings for these masks don't work on them. > >Gerhard > > >____________________________________________________________ >You are subscribed to the PEDA discussion forum > >To Post messages: >mailto:[email protected] > >Unsubscribe and Other Options: >http://techservinc.com/mailman/listinfo/peda_techservinc.com > >Browse or Search Old Archives (2001-2004): >http://www.mail-archive.com/[EMAIL PROTECTED] > >Browse or Search Current Archives (2004-Current): >http://www.mail-archive.com/[email protected] > >
____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[EMAIL PROTECTED] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
