Re: gEDA-user: windows testers wanted

2011-09-15 Thread joe tarantino
   Using HP G72 notebook, intel I3, Intel graphics

   On Thu, Sep 15, 2011 at 12:13 PM, DJ Delorie [1]d...@delorie.com wrote:

 We're trying to track down the zoom bug.  If you have access to a
 windows machine, please try this PCB snapshot:
  [2]ftp://ftp.delorie.com/pub/geda-windows/snapshots/pcb-20110915-dj
 .exe
 The key thing we're trying to find out is if the zoom bug is
 XP-specific and/or hardware-specific.  Please try zooming and report
 back:
 * Version of Windows (xp, vista, 7; 32 vs 64 bit) and mouse type

   Windows 7, 64 bit, Logitech optical mouse (LX3)

 * Whether Z/z keys work, and if you have to first click in the work
  area to get them to work

   Works fine without clicking first

 * Whether your mouse scroll wheel zooms (if you have a real scroll
 wheel)

   scrolls fine

 * If zoom/pan bars on your trackpad work (and if it's synaptics -
 we
  know that's broken)

   pans w/ right mouse button.   Has a synaptics pad, but no scroll
   bars so N/A.  Pad works like mouse (pan, etc. ok)

 * If zooming doesn't work, can you still zoom in via the menu
  (remember to click on the pcb after choosing this) and pan with the
  scrollbars?

   Zooms fine from menu
   One observation.  On first run after install, the board outline is
   centered well past the upper left corner of viewport.  Appears to be
   scaled correctly.  Only about 1 cm^2 was accessible until I zoomed and
   panned it to the center.
   Joe T

 Thanks!
 DJ
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References

   1. mailto:d...@delorie.com
   2. ftp://ftp.delorie.com/pub/geda-windows/snapshots/pcb-20110915-dj.exe
   3. mailto:geda-user@moria.seul.org
   4. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: coordinate systems [was: pcb crooked traces]

2010-10-15 Thread joe tarantino
   ...and pcb is the only CAD program I know of, that does like this
   I've run across other PC layout tools which do this.  Mechanical CAD
   tools usually have (by default) Y+ pointing up, but for some reason PC
   design tools occasionally have Y+ facing down.  I don't remember any of
   these tools justifying their (less common) choice of convention
   however. :)
   Joe T

   On Wed, Oct 13, 2010 at 3:35 AM, Armin Faltl [1]armin.fa...@aon.at
   wrote:

   Andrew Poelstra wrote:

 On Tue, Oct 12, 2010 at 10:12:41PM +0200, Armin Faltl wrote:

 Btw. while being a different topic, how about getting rid of the
 lefthanded
 coordinate system, when all numeric computations have to be checked
 anyway? This should make the cs consistent with trigonometric
 functions.

 What does lefthanded coordinate system mean?

 It means, that positive coordinate axes can be generated as follows:
 looking from Z+ to the center X+ moves into Y+ by a clockwise
 rotation (for lefthand). Z+ is your extended thumb, then form your
 fingers to a hook;
 the finger tips point into the direction of rotation around the
 thumb.
 With cyclic permutation look along:
   Z+: X - Y
   X+: Y - Z
   Y+: Z - X
 A lefthanded coordnate system is the mirror image of a righthanded
 one,
 the later being the norm for mathematical formulations, esp. vector
 notation of rotation.
 E.g. in polar coordinates P = P(r, phi) the angle phi has to be
 measured
 counterclockwise from the X-axis to make the transformation to
 cartesian coordinates look like:
   P = P(x, y) = P(r*cos(phi), r*sin(phi))
 with X+ pointing right an Y+ pointing up (and Z+ pointing out of
 screen).
 This is a convention. One can argue, to define the the sense of
 rotation clockwise
 and have Y+ look downward, but this is against the mathematical
 standard
 and pcb is the only CAD program I know of, that does like this.
 It's incompatible with any CAM file format, plotter language, OpenGL
 etc.
 Many raster devices and -image formats are lefthanded, probably the
 reason, why pcb is.
 Sorry for (partly) repeating myself.

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References

   1. mailto:armin.fa...@aon.at
   2. mailto:geda-user@moria.seul.org
   3. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: Color silk layers in pcb

2010-09-05 Thread joe tarantino
   On Sun, Sep 5, 2010 at 2:19 PM, Peter Clifton [1]pc...@cam.ac.uk
   wrote:

 On Sun, 2010-09-05 at 00:18 +0200, Levente Kovacs wrote:
  On Sat, 4 Sep 2010 11:24:38 +
  Ineiev [2]ine...@gmail.com wrote:
 
   Probably this patch may be used as a workaround.
 
  Why don't we just push this patch to HEAD? This works just great.
 One minor nit..
 I'd keep the non-copper / skip-drc ideas separate. We might (at
 some
 point) have DRC rules for non-copper layers (not that I can think of
 them at the moment, perhaps apart from silk layer(s)).
 Otherwise, seems good.
 Best regards,
 --
 Peter Clifton
 Electrical Engineering Division,
 Engineering Department,
 University of Cambridge,
 9, JJ Thomson Avenue,
 Cambridge
 CB3 0FA
 Tel: +44 (0)7729 980173 - (No signal in the lab!)
 Tel: +44 (0)1223 748328 - (Shared lab phone, ask for me)
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   If PCB had the concept of a part/element body outline layer (separate
   from the silk),  it could be used as a guide for part placement, not
   interfere with pads like
   the silk would, and could be checked with the DRC.  Another vote for
   general, non-copper layers I guess.
   Joe T.

References

   1. mailto:pc...@cam.ac.uk
   2. mailto:ine...@gmail.com
   3. mailto:geda-user@moria.seul.org
   4. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: Sub schematic power rails

2010-08-17 Thread joe tarantino
   On Tue, Aug 17, 2010 at 5:05 PM, kai-martin knaak
   [1]...@familieknaak.de wrote:

   Oliver King-Smith wrote:
1) It is useful for seeing the decoupling caps on various components
   and
checking they have been done to spec.
2) Often there are multiple power rails in the schematic, and it is
important to see which components are using which power rails both
   for
load and isolation.

 ack. Maybe my view is tilted because I am an analog guy who
 sometimes
 preaches his schematics to newbies :-)
 ---)kaimartin(---
 --
 Kai-Martin Knaak
 Öffentlicher PGP-Schlüssel:
 [2]http://pgp.mit.edu:11371/pks/lookup?op=getsearch=0x6C0B9F53
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   I completely agree.  Most designs nowadays require careful attention to
   power distribution.
   Make it obvious where your power is coming from.
   Joe T

References

   1. mailto:k...@familieknaak.de
   2. http://pgp.mit.edu:11371/pks/lookup?op=getsearch=0x6C0B9F53
   3. mailto:geda-user@moria.seul.org
   4. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: gsch2pcb (gnetlist) generates corrupted pcb output

2010-06-11 Thread joe tarantino
   May be unrelated, but I had a problem years ago running from a (samba)
   SMB share and having the files corrupted.  One thing I recall that made
   a difference was to alter (reduce or turn off) the caching that is
   normally engaged to improve performance.  You may want to experiment
   with that.  Unfortunately, I don't recall which of the (many) config
   values I played with.
   Joe T

   On Fri, Jun 11, 2010 at 3:42 AM, Stefan Salewski [1]m...@ssalewski.de
   wrote:

   On Thu, 2010-06-10 at 21:24 -0700, Matthew Lai wrote:
Fixed. Sort of.
   
This is very strange.
   
My files were on a SMB share (on another Linux box).
   
Copied it to /tmp, didn't change anything, and both the test case and
   my
original board worked.
   
No idea why...
   

 May some automatic character conversion by SMB be a problem, i.e.
 end-of-line or unicode transformation?
 You have compiled your gEDA suite yourself -- maybe there is old
 stuff/
 old libs/ old configuration files from earlier versions of gEDA
 still on
 your disk?
 Sorry, I have no better idea.

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References

   1. mailto:m...@ssalewski.de
   2. mailto:geda-user@moria.seul.org
   3. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: More flexible rotated text for 1.6.0, font-sizes etc..

2009-06-08 Thread joe tarantino

   Flipping the anchor at 180 degrees rotation is IMHO unwanted and
   unexpected magic.  I think I remember being annoyed by this in the
   past.  What happens when you do this in a batch mode?  Can it be
   reversed?
   It would be better if the on-screen font size matched the printed
   size.  Legibility of silkscreen would be more predictable.
   I'm surprised the font is bigger than it claims to be.  My experience
   is the other way around because the font size sometimes defines the
   cell size that the character fits into (accounting for pitch etc.)
   rather than the size of the character itself.
   I'd be leery of automatically bumping the font size if it would make a
   schematic composed if new and old symbols look inconsistent.  If (2)
   addresses this then it may be ok.
   Joe T

   On Mon, Jun 8, 2009 at 6:32 PM, Peter Clifton [1]pc...@cam.ac.uk
   wrote:

 Any objections to removing the 0,90,180,270 limits to rotated text?
 [2]http://www2.eng.cam.ac.uk/~pcjc2/geda/screenshots/gschem_rotated
 _text.png
 Need to teach the print output to handle it of course, but that
 shouldn't be too hard.
 The only grief comes with the currently magic behaviour at 180
 degrees,
 which basically resets to 0 degrees rotation, and flips the anchor
 point
 to the opposite corner of the text box.
 I'm thinking that it should be possible to seamlessly transform any
 old
 schematic which used a 180 degree rotation on load (based on
 file-format
 version number).
 Font sizes give some grief as well. It would be nice if the
 on-screen
 font size matched the print font - which means that I drop the
 magic
 constant in o_text.c to 1.0 - matching the font's size in points
 to
 the requested font size in the file-format. (The old gEDA font is
 about
 1.3x taller than it claims to be).
 Since auto-magically bumping people's text sizes on load (which
 will no
 doubt include some rounding), seems like an evil thing to do, I'm
 considering the idea of adding a couple of adjustment processes:
 1. Within gschem - possibly via some nasty popup dialog / wizard
 when
 you load an old file.
 2. Command line based - so old designs can be (if desired) batch
 updated.
 Or.. we could just declare that we don't really care about updating
 users' schematics. In any case, I'm tempted to bump the shipped
 symbol
 library font sizes - to give consistent before/after on-screen
 rendering.
 Or.. do we accept the on-screen shrinkage, and place greater value
 on
 consistency of .ps printed output from existing schematics?
 Best regards,
 --
 Peter Clifton
 Electrical Engineering Division,
 Engineering Department,
 University of Cambridge,
 9, JJ Thomson Avenue,
 Cambridge
 CB3 0FA
 Tel: +44 (0)7729 980173 - (No signal in the lab!)
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References

   1. mailto:pc...@cam.ac.uk
   2. 
http://www2.eng.cam.ac.uk/%7Epcjc2/geda/screenshots/gschem_rotated_text.png
   3. mailto:geda-user@moria.seul.org
   4. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

2009-04-28 Thread joe tarantino

   I think a few small holes are better than one large one.  What you are
   trying to achieve is a path for heat and maybe flux, but not solder.
   To get solder to the part, either pre-tin the pad or use paste.  Then
   you are just heating the pad to re-flow the solder.  Trying to apply
   solder from the back risks shorting other pins.  You should be able to
   come up with a footprint (w/vias) that works for hand soldering and
   doesn't annoy the production soldering process too much.
   Joe T

   On Tue, Apr 28, 2009 at 5:33 AM, Stefan Salewski
   [1]m...@ssalewski.de wrote:

   On Mon, 2009-04-27 at 22:55 -0500, Bill Gatliff wrote:
Guys:
   
   
Got any recommendations for how to hand-solder a QFN package that
   has an
exposed bottom pad?  At the moment, all I have is a soldering iron.
   
Do you think I could just put a plated-through via underneath the
   pad,
and then flow solder through that from the back side?
   
   
b.g.
   

 Hello,
 I will have the same problem soon, when the layout of my DSO board
 is
 finished. Your suggestion plated-through via underneath the pad
 should
 work (indeed is does, some people did it). I am not sure if I
 should
 make a large hole so that the tip of the soldering fits in it, or
 only a
 smaller, which I may fill with a piece of copper wire to conduct
 heat.
 The problem is to control/see when the solder flows -- to prevent
 heating to long. And one problem may be that too much solder may
 flow in
 making connections to other pins. And of course fixing the device
 at the
 right position is difficult when soldering from the backside.
 For cheap, small PCB boards heating the whole PCB with a heating
 plate
 may be fine, but I do not like to do this with my expensive board.
 I think I will have to do some experiments...
 Best regards
 Stefan Salewski

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References

   1. mailto:m...@ssalewski.de
   2. mailto:geda-user@moria.seul.org
   3. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

2009-04-28 Thread joe tarantino

   Be careful mounting a part like this upside down.  If the back side
   pad on the part is critical to grounding or heat removal (like some
   switching power supply controllers) you could easily cause the part to
   malfunction or worse yet, fail altogether.
   Joe T

   On Tue, Apr 28, 2009 at 12:15 PM, William Estrada
   [1]mrumun...@popdial.com wrote:

 Use a plcc adapter. Or use the dead bug design, glue it upside down
 to a piece of plastic then solder the wires to the chip.
  Message: 11
  Date: Mon, 27 Apr 2009 22:55:17 -0500
  From: Bill Gatliff [2]b...@billgatliff.com
  Subject: gEDA-user: OT: soldering QFN packages with exposed
 bottom
  pad?
  To: gEDA user mailing list [3]geda-u...@moria.seul.org
  Message-ID: [4]49f67e25.1010...@billgatliff.com
  Content-Type: text/plain; charset=ISO-8859-1; format=flowed

   
Guys:
   
Got any recommendations for how to hand-solder a QFN package that
   has an
exposed bottom pad?  At the moment, all I have is a soldering iron.
   
Do you think I could just put a plated-through via underneath the
   pad,
and then flow solder through that from the back side?
   
   

b.g.
   
-- Bill Gatliff [5]b...@billgatliff.com

 --
 William Estrada
 [6]mrumun...@popdial.com
 Mt-Umunhum-Wireless.net ( [7]http://64.124.13.3 )
 Ymessenger: MrUmunhum

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References

   1. mailto:mrumun...@popdial.com
   2. mailto:b...@billgatliff.com
   3. mailto:geda-user@moria.seul.org
   4. mailto:49f67e25.1010...@billgatliff.com
   5. mailto:b...@billgatliff.com
   6. mailto:mrumun...@popdial.com
   7. http://64.124.13.3/
   8. mailto:geda-user@moria.seul.org
   9. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

2009-04-28 Thread joe tarantino

   If the balls haven't been deformed, the surface tension of the solder
   does help the part align.  It's interesting to see the part get pulled
   into position as the solder melts.
   I've seen a switcher chip (can't remember the p/n at the moment) that
   has on the order of 80 balls, most of which are ground.  Both for
   current and heat sinking.  It's a small part, but is able to get rid
   of whatever heat it needs to as it is switching about 30W @ ~ 400 kHz
   as I recall.
   Joe T

   On Tue, Apr 28, 2009 at 12:58 PM, John Griessen
   [1]j...@ecosensory.com wrote:

   I'm going to look into methods of dealing with BGAs in prototypes

 since Bob's tech says they're less trouble after a learning curve.

   I've heard and can imagine the way they pull themselves to alignment
   by surface tension between the grid of chip balls and the grid of
   lands on the pcb.

 Do BGAs use zones of balls to dissipate heat?
 John

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References

   1. mailto:j...@ecosensory.com
   2. mailto:geda-user@moria.seul.org
   3. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

2009-04-27 Thread joe tarantino

   I've done this, but not always with success.
   First, get some fine solder paste and a flux pen.
   When you do the layout, put a pad on the other side of the board,
   connect with a few vias to the part's bottom pad.  Be sure to have a
   solder resist opening on the back side pad.
   Apply flux to the large pad only, on both sides of the board.  Then
   paste the pad, both sides.  Then place the part.  When you heat the
   back with the iron, the part may want to move.  It often helps to
   tack-solder a couple of the other pads on the QFN (farthest away from
   the large pad) to keep it from moving.  Solder the remaining small
   pins last.
   Good luck -
   Joe T

   On Mon, Apr 27, 2009 at 8:59 PM, DJ Delorie [1...@delorie.com wrote:

Got any recommendations for how to hand-solder a QFN package that
has an exposed bottom pad?  At the moment, all I have is a soldering
iron.

 Spend $20 and buy a cheap hotplate :-)
 Not sure what you'd do about solder paste; perhaps put solder dots
 on
 the pcb with your iron, add flux, and reflow it.

Do you think I could just put a plated-through via underneath the
pad, and then flow solder through that from the back side?

 I've done that as well, but beware you need a pretty hefty iron to
 generate enough heat to melt the solder.

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References

   1. mailto:d...@delorie.com
   2. mailto:geda-user@moria.seul.org
   3. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: more board fab discussion (was Re: Interesting board defect)

2009-02-17 Thread joe tarantino

   I just sent out a board which I had quoted on FR4 and Rogers 4350.
   The Rogers material was more expensive, but for sure not 4x more.  I
   won't get the boards back for a couple days yet, but I've seen other
   proto's they did for us (on .031 Rogers 4350 w/ immersion silver
   plating) and they looked good.  The shop we used is Prototron.  They
   have fabs in Redmond WA and Tucson, but I think maybe only the Tucson
   shop has the Rogers material in stock.   I know for sure that it is
   only the Tucson shop that can do the immersion silver.
   Joe T

   On Tue, Feb 17, 2009 at 7:11 AM, Larry Doolittle
   [1]ldool...@recycle.lbl.gov wrote:

 Gabriel -
 On Tue, Feb 17, 2009 at 03:47:10PM +0100, Gabriel Paubert wrote:
  Did not nee for this, and my RF designs use Rogers' substrates
 which
  are much more reproducible than FR4 at frequencies above 2GHz.
 I'm currently searching for a U.S. fab for prototype quantity
 of Rogers' boards that doesn't charge 4X what I'm used to for FR4.
 I have some leads, but a lot of places I expected to be reasonable
 are not.  Have you or others on this list found such a place?
  - Larry
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References

   1. mailto:ldool...@recycle.lbl.gov
   2. mailto:geda-user@moria.seul.org
   3. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: Trace impedance calculations in PCB

2009-02-12 Thread joe tarantino
I generally do this kind of analysis separate from my layout tool (PCB
or whatever) because many of the other parameters needed for the
calculation are not usually tracked or updated by the layout tool
(dielectric constant, dielectric thickness, stackup, copper thickness,
distance from external conductors, etc.).  What would help would be a
easy and readable way to extract trace lengths and spacings from PCB,
like a distance tool that returns the width and length of a trace
section and spacing from another trace section (for differential or
CPW lines).

Joe T.

On 2/12/09, Jeffrey Gregory jagre...@umich.edu wrote:
 Are there any plans to add trace impedance calculations to PCB?  If
 not, is there an argument against it or just that no one has time and
 interest?  What alternatives do people use?

 Best Regards,
 Jeff


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Re: gEDA-user: Newbie -- How to properly associate DNI or Do Not Populate to component

2008-10-21 Thread joe tarantino

   I took a different approach which is a little more work.  I added a
   field to my symbols called loadstatus which I mark for no load,
   through hole, or blank.  Blank is the default, and means a SMT part
   that is loaded.  It's not hard to use gnetlist -g bom2 (if I remember
   correctly) to slice out this field on your report to the board
   stuffer.  Sort the resulting list to put the no-load parts at the
   bottom so that they're easy to ignore.  I don't like the idea of
   stepping on the value field since then the schematic loses it's
   knowledge of what you might want to load at a later date.
   Be sure to include this field in your attib file so gnetlist grabs
   it as desired.
   Joe T

   On Mon, Oct 20, 2008 at 10:26 PM, Duncan Drennan
   [EMAIL PROTECTED] wrote:

OTOH, if you're just looking for a NO FIT type instruction, where
   I
_do_ want the footprint on the PCB board - just empty, I typically
   just
add the attribute value=NO FIT to that component. The assembly
   house I
use seem to understand what I mean, and didn't complain that it
   appeared
in the XY file used for programing the pick'n'place machine.

 Or you can just set value=NO FIT (or DNP, DNI, etc.) and delete
 the
 relevant lines from the XY file by searching for that termor
 write
 a script which post-processes the XY file and removes the DNP
 lines.

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References

   1. mailto:[EMAIL PROTECTED]
   2. mailto:geda-user@moria.seul.org
   3. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user


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Re: gEDA-user: pcb, question to crosshair to grid snapping

2008-10-21 Thread joe tarantino

   On Tue, Oct 21, 2008 at 9:02 AM, Stefan Salewski
   [EMAIL PROTECTED] wrote:

 Sometimes the crosshair snaps to center of grid, overlapping grid
 points, which are in inverse video in this case. But sometimes
 crosshair
 snaps to a position close to grid points, but not overlapping.
 Seems to be not related to mm grid only, similar behavior with mil.
 For me this is irritating -- but maybe its a feature?
 Best regards
 Stefan Salewski

   Is the crosshair inside of a pad when you notice this snapping
   behavior?
   Joe T

References

   1. mailto:[EMAIL PROTECTED]


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Re: gEDA-user: sot23 diode symbol

2008-08-05 Thread joe tarantino
I've always handled this by making the symbol and footprint match.  In other
words - you need a 3-pin symbol to match your 3-pin footprint.  There is a
NC gschem symbol in the library for this purpose.  You do have to be
careful of how gnetlist handles the NC net.  It should not appear in the
netlist given to PCB.

Joe T

On Tue, Aug 5, 2008 at 9:42 PM, Ed  Angie S. [EMAIL PROTECTED] wrote:

  I know through the years there has been a lot of discussion on this issue
 but I haven't been able to find the answer to my problem after searching the
 archives.  I'm wondering how to refer to a 3 pin footprint with a two pin
 schematic symbol as is the case for a sot23 diode.  My actual question is
 probably simple for the experts out there.  I've already created a special
 symbol for a sot23 diode.  The actual symbol graphic is a normal diode that
 has 2 pins, pin 1 and pin3.  I believe I need to specify a pin 2 in the
 symbol textually somehow so that PCB layout software will match its 3 pin
 footprint to a schematically defined 3 pin device.  How do I annotate the
 gschem symbol for a pin 2 without a graphical entity to assign the pin to.
 It's a no connect or unused pin so it needs no graphic but the symbol does
 need to have 3 pins when the netlist is generated for layout.

 Thanks

 Ed



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Re: gEDA-user: Ground +5V confusion

2008-06-15 Thread joe tarantino
How many +5 and gound net connections are there in your design?

Joe T

On Sat, Jun 14, 2008 at 11:45 PM, Ben Jackson [EMAIL PROTECTED] wrote:

 On Sat, Jun 14, 2008 at 12:34:55PM -0400, Ian Chapman wrote:
  I have a ground plane and I keep connecting 5V to it because the rats
  show up as an orange ring on both.

 I'm not sure I understand your question.  The default color scheme includes
 a light brownish color for rats, and a true orange for shorted nets so
 I can't tell which you are referring to.

 Here's how I route power/gnd:  Mouse over a known net (ends of a polarized
 cap are often easy) and then hit 'F'.  This 'finds' the matching nets and
 turns them bright green.  This includes the matching rats.  This makes it
 easy to see which ones to route.  If you have the netlist window up, the
 'f'ind will also highlight the net in that window.

 --
 Ben Jackson AD7GD
 [EMAIL PROTECTED]
 http://www.ben.com/


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Re: gEDA-user: gschem, selecting multiple symbols problem

2008-06-15 Thread joe tarantino
I think it has always worked this way.  However, it would be nice if there
was a filter for the area selection rectangle.  Having it default to
grabbing only instances of symbols would solve your problem, but there are
often times when you might want to grab a bunch of text or attributes and
that default would be undesirable.

Joe T

On Fri, Jun 13, 2008 at 7:54 PM, Stefan Salewski [EMAIL PROTECTED] wrote:

 I think there is a little problem with multi-selection in gschem 1.4.0:

 When I do multi-selection by drawing a selection rectangle (holding down
 left mouse button) it may occur that I get selection of a few symbols
 (as desired) and get additional, undesired selection of a text attribute
 of an other symbol. Now I may move the selected symbols, and with a side
 effect I move the text attribute away. So it may occur that text
 attributes are moved far away from symbols. I think similar results can
 occur if one selects a group of some symbols in order to delete them.

 When I started with gschem I had sometimes symbols with missing value or
 refdes attributes -- I think this was a result of the above behavior.

 My suggestion: Multi-Selection-Rectangle should not select a combination
 of whole symbols and attributes of unselected symbols.

 Comments?

 Stefan Salewski




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Re: gEDA-user: Converting RS274D to RS274X

2008-04-13 Thread joe tarantino
Some gerber generators and viewers have a means to specify the number of
significant digits past the decimal point in their co-ordinates (e.g. X.XXX
or something like it).  Check to see if that is set correctly.

Regarding the hpgl reference - is this a means to convert to the HPGL vector
format that many plotters used to use?  I've used devices that plot on a
resist film as you mention, and also convert to the path programming that a
milling machine would use.  Filling large copper areas this way can be a
little tedious, but it can be really handy for prototyping RF circuits.

Joe T

On Sun, Apr 13, 2008 at 3:45 PM, Ormund Williams [EMAIL PROTECTED] wrote:

 On Sun, 2008-04-13 at 17:53 -0400, Dan McMahill wrote:
  ok, it was easier to find than I thought.  google for 'pads-d2x' and
  you'll find a post to this list from our very own Larry Doolittle.  Note
  that as others have mentioned, there doesn't seem to be a standard
  aperture list format used with RS274-D.  The primary thing you need to
  do to convert from RS274-D to RS274-X is to take the aperture list that
  goes with your RS274-D files and turn that into the codes which define
  the apertures in RS274-X.  The other differences between D and X don't
  really matter because I believe X has all the features of D and then
 some.
 
 First thank you, but needs work.  After adding two more aperture types
 to the script and concatenating the plot data, gerbv loaded it but all I
 get is a large blob, it seems that the scale of the apertures and the
 plot data are orders of magnitude different.  I also have other files
 with very different aperture report formats, Oh well...

 I'll play with it later, thanks again.

 __
 Ormund




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Re: gEDA-user: mainstream GUI guidelines to consider for gEDA tools

2008-03-14 Thread joe tarantino
On Fri, Mar 14, 2008 at 7:16 AM, John Griessen [EMAIL PROTECTED] wrote:

 I came across this in a trade magazine, Chip Design, and copy excerpts
 that suggest what the best of breed tools can do.  The author sees the
 collection of abilities
 as most valuable, and it seems not to be a copyright conflict to use a
 similar collection of features,
 just common sense.

 The parts in quotes are from Clive (Max) Maxfield's article about
 Agilent's
 Advanced Design System 2008 software release:
 http://www.chipdesignmag.com/display.php?articleId=2011issueId=26
 --

 Does this sound familiar?, However, the part that really grabbed my
 attention was the fact that
 they've completely revamped the ADS graphical user interface (GUI). The
 reason I'm so interested
 in this area is that I spend so much of my time fighting with interfaces
 for other tools that appear
 to have been created by someone from another planet (or at least, someone
 who has never actually
 used the tool themselves).

 He likes integration and the new three-dimensional (3D)
 representation, both of which we see
 GPL methods for on the horizon.  By integration, I'm pretty sure he means
 interprocess communication, (IPC).

 He says, you control it using the same highly-intuitive usage model as
 for Google Earth,
 which confuses me -- I thought it was flat only...but I'm thinking the
 blender 3D mouse
 GUI is what he is talking about.  He says, Designs can be stretched in
 the vertical dimension as an aid to seeing what's going
 on inside the various planes.   I like the stretch idea for PCB stackup
 viewing.

 He notes, visualization engine also supports the ability to define and
 manipulate cut-planes.
 That's a thing that might be tough to code, but if any of the 3D
 code/toolkits used to make
 the view supported that, it would be valuable for quickly getting inputs
 for use by a two-D
 field solver.


I've often wanted the ability to unstack and cut through a PCB design like
this. As the article points out, it is only in the last few years that
graphics horsepower has allowed the 3D manipulation that this kind of
display requires.  If PCB could do this (some day) it would be great.



 So, that's all it takes today to be 5th ranked in EDA.


Lest we loose sight of the larger picture...   I think it takes a bit more
than this.  The main strength of ADS has (in my opinion) been its ability to
accurately model complex RF an u-wave circuits.  It's biggest drawback has
been the UI and to some extent the documentation.  I'm pleased to see they
finally addressed this shortcoming.  So, it's not as if making a fancy UI
allows you to be 5th ranked but rather that when you make the UI as good
as the rest of the tool you can have a 5th ranked solution.

(Full disclosure - I've used this program quite a bit in the past as a
former HP and Agilent employee.)

Joe T



 John Griessen




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Re: gEDA-user: [pcb] overlapping pin/pad -- won't form thermal

2008-03-10 Thread joe tarantino
On Mon, Mar 10, 2008 at 5:16 PM, Dave N6NZ [EMAIL PROTECTED] wrote:


 DJ Delorie wrote:
  PCB needs first class support for oblong through-holes.
 
  Yup.  I've talked about a multi-pin before; this is a pin with
  arbitrary shaped copper/soldermask/etc on each layer.
 
 Yes, when you get to multi layer boards you often want a different
 annulus on inner layers.

 I think it's time to think about an expansion to the footprint grammar
 to support more sophisticated pins and also more sophisticated paste
 specs.

 -dave

 Without piling on too much

- Expanding the grammar to support inner layer pad  outer layer pad would
be great.  (Would one geometry definition apply to all inner layers?)
- Also consider whatever would allow pins (and vias) with no connection to
some layers (maybe supporting blind and buried vias in the process?)
- Taking this too the limit, consider a shift to a more heirarchical
approach which would allow pad definitions to be included in a footprint
by reference rather than direct inclusion.
(My ignorance of the data structures now used by PCB may be evident here - I
don't know how difficult this would be).

Joe T


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Re: gEDA-user: PCB refdes selection problems... solved

2008-03-07 Thread joe tarantino
I've seen the same behavior going back several revisions.  At some point
certain refdes text becomes unselectable.  Sometimes restarting the program
helps, sometimes I can get it back by turning layers off and on as you
describe.

A related issue I've seen is that pcb sometimes has a preference for
selecting text on the opposite side of the board from the one I'm working
on.

And having silkscreen text in the area that is not a refdes can also make
the selection problem worse.

Joe T

On Fri, Mar 7, 2008 at 10:31 AM, Traylor Roger [EMAIL PROTECTED]
wrote:

 Guys,
  Thanks for the ideas and hints.  I apparently bumped into
  something that starting everything to work again.  It
  seems that turning off all visible layers and then silk
  only enabled me to grab the text.  I moved a few refdes,
  then enabled the other usual visible layers and it now
  works like before.  Strange.

  Surely there is some subtle bug under this, but characterizing
  or replicating it would be tough.

  Whatever, for now, back to work. Thanks for the help.

  Roger




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Re: gEDA-user: stack overflow with gnetlist -g drc

2008-03-07 Thread joe tarantino
If your netlist gets large enough you will hit this problem with several of
the scheme back-ends.  It has been discussed in the list before.  I don't
remember the exact syntax to fix it, but search the archives for stack
overflow 20 and I'll bet you find it.

Joe T

On Fri, Mar 7, 2008 at 7:13 PM, Kai-Martin Knaak [EMAIL PROTECTED]
wrote:


 An attempt to do a gnetlist -g drc on my current project yields a stack
 overflow error:

 /-
 [EMAIL PROTECTED]:~/geda/DL-strom$ gnetlist -g drc2 strom_0_master.sch -o
 drc_output.txt
 gEDA/gnetlist version 1.5.0.20080127
 gEDA/gnetlist comes with ABSOLUTELY NO WARRANTY; see COPYING for more
 details.
 This is free software, and you are welcome to redistribute it under
 certain
 conditions; please see the COPYING file for more details.

 Remember to check that your schematic has no errors using the drc2
 backend.
 You can do it running 'gnetlist -g drc2 your_schematic.sch -o
 drc_output.txt'
 and seeing the contents of the file drc_output.txt.

 Loading schematic [/home/kmk/lilalaser/geda/DL-strom/strom_0_master.sch]
 WARNING: Trying to rename something twice:
+Ub and +Ub
 are both a src and dest name
 This warning is okay if you have multiple levels of hierarchy!
 WARNING: Trying to rename something twice:
-Ub and -Ub
 are both a src and dest name
 This warning is okay if you have multiple levels of hierarchy!
 Backtrace:
 In /usr/local/geda/share/gEDA/scheme/gnet-drc2.scm:
  518: 883  (if (null? list) 0 (let ((comparison #)) (if comparison (+ 1 #)
 (+ 0 #
 ...
  525: 884  [+ 0 ...
  525: 885*  [drc2:count-reference-in-list H1 (1C101 1U105 1U104
 ...)]
  518: 886   (if (null? list) 0 ...)
  ...
  525: 887   [+ 0 ...
  525: 888*   [drc2:count-reference-in-list H1 (1U105 1U104 1R120
 ...)]
  518: 889(if (null? list) 0 ...)
   ...
  525: 890[+ 0 ...
  525: 891*[drc2:count-reference-in-list H1 (1U104 1R120 1R117
 1C108)]
  518: 892 (if (null? list) 0 ...)
...
  525: 893 [+ 0 ...
  525: 894* [drc2:count-reference-in-list H1 (1R120 1R117
 1C108)]
  518: 895  (if (null? list) 0 ...)
 ...
  525: 896  [+ 0 ...
  525: 897*  [drc2:count-reference-in-list H1 (1R117 1C108)]
  518: 898   (if (null? list) 0 ...)
  520: 899   (let ((comparison #)) (if comparison (+ 1 #) (+ 0 #)))
  520: 900*  (if (defined? #) (string-ci=? refdes #) (string=? refdes
 #))
  520: 901*  [defined? ...
  520: 902*   (quote case_insensitive)

 /usr/local/geda/share/gEDA/scheme/gnet-drc2.scm:520:58: In expression
 (quote case_insensitive):
 /usr/local/geda/share/gEDA/scheme/gnet-drc2.scm:520:58: Stack overflow
 \

 A run of gsch2pcb on the same schematic is successful. So I suspect
 it is a bug in gnetlist rather than in my schematic. Anything I can
 do to help diagnose this illness?

 ---(kaimartin)---
 --
 Kai-Martin Knaak
 http://lilalaser.de/blog



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Re: gEDA-user: pads net list problem

2008-02-25 Thread joe tarantino
The netlist output is fairly simple and is probably fields separated by
spaces, tabs, or commas.
What format is he using to read in the file?  Is he writing it our as the
same format? (.CSV?)
I've run into something like this and found that Excel was filtering out
extra spaces or putting quote marks around every field that it read in that
looked like text.
Look at the file in a real text editor if you can, and the filtering or
formatting that Excel is doing will probably be obvious.

Joe T

On Mon, Feb 25, 2008 at 8:05 AM, Steven Taylor 
[EMAIL PROTECTED] wrote:

 I have designed a circuit and created a pads netlist to send to the person
 who is doing my layout. He said that PADS will not accept the netlist file
 directly. He can get around the problem by first opening the file with
 Excel and then re-saving it. Then PADS will read it just fine. I will try
 to get more details about this, but for now, I was wondering if anybody
 else has run into this problem.

 Steve

 --
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Re: gEDA-user: sot-23 pin numbers

2008-02-06 Thread joe tarantino
My recollection is that pins (1) an (2) are on the same side of the
package.  Number CCW when viewed from top.  As DJ said, this seems to be
consistent for BJT and FET parts.  Diodes are another matter - when the part
contains a pair all arrangements are possible :).

Joe T

On Feb 6, 2008 8:21 AM, DJ Delorie [EMAIL PROTECTED] wrote:


 Based on my limited experience, I've found that the control (base,
 gate), power (emitter, source) and output (collector, drain) are
 always on the same pins on sot-shaped devices, regardless of fet/bjt
 or p/n.  The spec sheets always seem to number those pins the same
 too, but that doesn't mean that gschem/pcb does.


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Re: gEDA-user: Anybody had luck with QFN64 at PCBExpress et al?

2008-02-02 Thread joe tarantino
On Feb 2, 2008 11:23 AM, Jeffrey Baker [EMAIL PROTECTED] wrote:

 Nearly every major part I need for my latest project is packaged in a QFN
 (or LFCSP as they call it over at Analog Devices).  I'm worried because the
 parts have round leads and Sunstone, the PCB prototype shop, says they can't
 make radiused SMD pads.  Has anyone run into trouble with this, or are
 square pads OK?

 Generally speaking the .5mm-pitch QFN seems to be on the edge of or beyond
 the capabilities of a proto shop like Sunstone, but Sunstone has the best
 tolerances I've been able to find.

 -jwb



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I have had one of the Sunstone shops build boards with QFN32 and QFN48 as I
recall.  Results were pretty good.  They had square-ended pads.

-Be careful of solder resist floaters due to the little pieces between the
leads.  Best bet is to remove all resist between pads.
-You may want to check your gerber files to see how much solder paste will
be applied and check with Sunstone to see if it is sufficient (or too much).

Does your pad have a large heat sink pad on the back?  If so, you must
carefully construct this pad in the footprint (possibly out of multiple
squares).  Again, check the paste layer.

Joe T


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Re: gEDA-user: Silkscreen over pads again

2008-01-17 Thread joe tarantino
On Jan 17, 2008 11:01 AM, Levente [EMAIL PROTECTED] wrote:

 On Thu, 17 Jan 2008 12:38:08 -0500
 Dan McMahill [EMAIL PROTECTED] wrote:

  DJ Delorie wrote:
This was fixed at one point, such that pcb itself would remove
the silk over pins and pads, but I haven't migrated that code
into the HID version yet.
  
   We changed our minds about this.  We changed PCB so that it showed
   silk over pads if that's what your design calls for, so if you see
   silk over pads on the screen, you'll get silk over pads on the board.
  
   The magic we chose to go with to deal with the fabs that can't handle
   cuts is to convert all cuts to multiple polygons instead, so that we
   never have to use cuts or negative layers.  That was what we used to
   remove the silk, and too many fabs didn't like it.
  
   Which fab is it?  Are they unable to fix the problem themselves?
 
  A DRC check for silk on pads would probably be good.  In my past life,
  we always had in house reviews of the gerbers and weren't allowed to
  send them to a board vendor until there was no silk on the pads

 Yes. In the other hand however, it may be good to have code in PCB that
 optionally removes silkscreen from pads. For an example, please see this
 photo. What you can see is a power transistor, and a thermo-resistor.


 http://logonex.eu/gallery/tns/c4.html

 Best wishes,

 --
 Levente
 http://web.interware.hu/lekovacs

 I also believe that it would be good if PCB could remove overlapping
silkscreen although the fab house I've used seems to be able to do it
themselves.

I don't get the picture.  It looks like a power transistor and a diode, and
I don't see obvious silkscreen overlap.

Joe T


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Re: gEDA-user: Electronic tube assembly

2008-01-13 Thread joe tarantino
On Jan 12, 2008 10:18 AM, Dave McGuire [EMAIL PROTECTED] wrote:

 On Jan 12, 2008, at 10:11 AM, Dan McMahill wrote:
  This is very off topic, but I think one who likes tubes should visit
  this
  site.
 
  http://paillard.claude.free.fr/
 
  I don't speak french, but that video is really cool!

   That is BEYOND cool.  I so want to be able to do that!  Building
 simple tubes isn't that difficult, but that guy really does it at a
 professional level!

 -Dave

 --
 Dave McGuire
 Port Charlotte, FL


It also appears that he builds a lot of his other components (inductors,
housings, etc.), fixtures and jigs, while  still allowing for modern
components (like good electrolytic caps, and computer fans).
Forget the tubes - I jealous of the machine shop!

Joe T


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Re: gEDA-user: anyone using PCB .xy files?

2008-01-02 Thread joe tarantino
On Jan 2, 2008 6:31 PM, Dan McMahill [EMAIL PROTECTED] wrote:

 Is anyone using or has anyone used the centroid files (.xy files) that
 pcb exports?

 I'm asking because I just fixed a bug which has been there since the
 code was first written that flipped everything about the x-axis and also
 translated it in the y direction by the height of the board.

 I just fixed that bug, but it makes me wonder if anyone has ever
 actually used the output.

 This came up while one of the gerbv developers was fixing up the code
 for displaying pcb .xy files.



 If anyone is or has used these files, were there other issues that
 should be fixed?

 Thanks,
 -Dan



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I've  supplied the .xy files to our board stuffer, in some cases also
supplying them hints as to
the orientation and origin of the data (especially if the gerber files have
a different orientation).

They have always figured it out.

Joe T


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Re: gEDA-user: PCB Thermal finger width

2007-12-12 Thread joe tarantino
On Dec 11, 2007 1:43 PM, DJ Delorie [EMAIL PROTECTED] wrote:


 It currently uses the clearance.  I'm not sure which it *should* use,
 or if we should redesign it to be independently adjustable.


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Since annulus often scales roughly with the size of the pad/hole, the
thermal trace width should be independant of annulus width to give the user
the desired level of control.

Joe T


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Re: gEDA-user: gerbv - not reading format

2007-12-03 Thread joe tarantino
On Dec 2, 2007 9:08 PM, Julian [EMAIL PROTECTED] wrote:

 Frank,
It looks like the RS274x manual has sloppy code in it.  The G04 code
 in line 1 is supposed to end with a * at the end of the line to signal
 it is finished (see section on G-codes in the manual). gerbv keeps
 reading until it finds a *, which made it advance past the FS statement
 in the next line. If you add a final * to line 1, it should work.
Maybe we'll look into adding a fix for this problem and let a
 carriage return also work to finish out a G code, just to make sure we
 handle this type of malformed code.  Thanks for pointing this problem
 out.

 Cheers,
 Julian


You may want to check before allowing a CR/LF to end a command.  I recall
seeing gerber files many years ago that used fixed length records (80 char
or 255 char lines).  Hitting a CR/LF before a command was finished wold
happen all the time - and be legal syntax.

Joe T



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Re: gEDA-user: gEDA for mass production?

2007-12-03 Thread joe tarantino
...

 If the industry has its act together enough to make that fully
 automated, I'd be surprised and pleased.  I think that small-quantity
 prototype assembly doesn't even bother with all that and uses
 manually-guided pick and place machines.  Those would presumably zoom
 to the coordinates provided in the xy file but then the operator
 finishes the job with a joystick.


Very often they use a vision system that can detect the package boundary and
sometimes the pins locations as well.  As someone mentioned earlier, the
placement origin is usually the part centroid.  When the part is not
symmetric (e.g. D-PAK) then manual intervention is more likely.

Boards that we have had built lately (in runs of 4 to ~ 100) were done in a
time frame that would have been impossible if the precess were not mostly
automated.

Joe T



 I will know early next year what it takes to actually go beyond the
 quoting step.

...



 --
 Randall


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Re: gEDA-user: PCB needs alternate grid

2007-10-24 Thread joe tarantino
On 10/23/07, DJ Delorie [EMAIL PROTECTED] wrote:


  Only if snap to pin/pad is selected.  Otherwise just snap to the
  nearest grid point.

 Well, yeah.

  Are you saying if we're within one grid spacing of one of the defining
  points for the pin/pad...?  I'm just trying to be sure I understand how
 the
  current grid snapping works.

 Specifically, the crosshair snaps to a grid point or the pin center,
 whichever is closer to the X cursor.


No,  that was one of the points I was trying to make earlier:

The crosshair snaps to a grid point or pin center whichever is closer, but
it will snap to a
grid point or the nearest defining endpoint of a pad.  It will not snap to
a *pad* center.  (I wish it still did :( .)

Joe T

So, on average, you have to be within half a grid unit of the pin
 center to snap to it, but it depends on where the pin center is
 relative to the grid points.


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Re: gEDA-user: PCB needs alternate grid

2007-10-24 Thread joe tarantino
On 10/24/07, Kai-Martin Knaak [EMAIL PROTECTED] wrote:

 On Tue, 23 Oct 2007 19:00:27 -0700, joe tarantino wrote:

  A subtle point is that the snap to to pins/pads mode used to snap to
  the center point (midpoint of the line between the two defining points
  of the pad).

 Ouups. I was just about to add a feature request. Please add snaping to
 the middle of lines (in addition to the end points). Was the loss
 deliberate?


As I recall at the time I noticed the change, it was (according to Harry)
indeed deliberate.

Joe T

---(kaimartin)---
 --
 Kai-Martin Knaak  tel: +49-511-762-2895
 Universität Hannover, Inst. für Quantenoptik  fax: +49-511-762-2211
 Welfengarten 1, 30167 Hannover   http://www.iqo.uni-hannover.de
 GPG key:http://pgp.mit.edu:11371/pks/lookup?search=Knaak+kmkop=get



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Re: gEDA-user: sloppy rupper band mode

2007-10-20 Thread joe tarantino
On 10/20/07, Ben Jackson [EMAIL PROTECTED] wrote:

 On Fri, Oct 19, 2007 at 02:26:49PM +, Kai-Martin Knaak wrote:
  On Wed, 17 Oct 2007 16:16:23 -0700, Ben Jackson wrote:
 
   File a SF bug and point me at it and I'll see about fixing it.
 
  done. (ID 1816572)
 
  Looking forward to fix for this crippling non-feature,

 There are a few things going on here:

 1)  If you move a line or its endpoint:  For purposes of rubberbanding,
 it is considered connected to all of the line segments whose ends overlap
 the moving line's end(s).  The specific issue you report is due to the
 short diagonal segment being so short that the end lines overlap each
 other.  In fact, a line where both endpoints overlap the moving point (the
 joining line in your case) won't even necessarily pick the right end of
 the line.  That's easy to fix, but doesn't address the real problem.


That appears to be the problem: Either that it is picking the wrong segment
or that it is leaving one of the endpoints behind (unpicked) that belongs to
the short segment.  In the case that Kai-Martin showed earlier in this
thread, there are three segments and 4 endpoints in the pick region that
must be sorted through.  It seems as if one of the endpoints gets dropped.

I think you've found the issue with the lines overlapping (i.e. adjacent
vertices being closer together than the line width).  What about ignoring
the line width while choosing the proper endpoint in the case when the
endpoints are closer together than one or two line widths?

2)  If you move an element and one of the pads touches both ends of a
 line (easy to do if your line is narrower than the pad and you don't
 control where it jumps back onto the grid), only one end of the line
 will move.

 Now both of these things would be solved if touching both ends of a
 line just moved the whole segment.  Your tiny segment would not stretch,
 but instead it would remain in the same shape and the other long segment
 would stretch.  Not terrible, not fabulous.  For the pad case (or polygon
 case), this is probably the right thing.


Actually, there are many cases (most?) where I think this solution would
work quite well.  Having an easier way in general to move a segment (or
group of segments) while keeping the end points connected would be very
handy.

Maybe you pick the approach like this:

  If the endpoints are farther apart than one line width, then pick the
nearest one (easy case)

  If the the pick point is closer to a grid point that lies on the line (or
within one grid spacing to a point on the line) and more than one grid point
away from both end points, pick up the whole segment.

  If the line segment is very short (less than one line width and less than
2 grid point spacings long and the pick point is closer to one endpoint than
the other by at least one grid spacing then pick the nearest one.  (This is
the case that fails most often now when it picks up the endpoint on the
wrong line or doesn't move all the endpoints).

You might have to differentiate  between a tiny segment that is shorter
than one grid spacing vs. one that is longer than one grid spacing.  Quite
often I generate these short lines by routing with snap to pins/pads
turned on.  Then you are almost always guaranteed to cause a tiny segment to
occur right at the end (often inside the pad).  In this case, if there is
a point that is exactly on the pin or pad and the pin or pad is moved, only
the line endpoint exactly on the pin or pad should move.  (Yes, I realize
that this may be difficult to do given the way the data is stored.)

For the line case, another alternative would be to restrict the
 rubberbanding to exactly-connected lines.  However, it currently works
 in your favor if you make a hand-drawn line on-grid to an off-grid line
 and only overlap without joining using an explicit segment.


Does the data structure end up with an entry for the segment that covers
the short distance between the on-grid and off-grid point?  My preference in
this case would be to move the segment (the segment endpoints really) and
not any nearby points that are not on grid.  This would allow you to
stretch the short segment into one that you could later modify.  If both
endpoints move, you can't modify this intersection without deleting and
re-adding things.  (This is really a lot like the case I outlined above.)

It could also pick one BEST endpoint to connect to (closest eg, although
 the data structures are not really set up for this), but perhaps someone
 really cares about a 3+ line intersection case.  It could ignore points
 that are (perhaps exactly) connected to segments that are already going
 to rubberband, on the theory that one continuous line should only move
 one point.  This is also tricky because we don't know what order we'll
 see the lines (and the data structures are again not helpful).


The 3+ line intersection case would be farther down my list.  I don't
encounter that too often unless I'm building up 

Re: gEDA-user: [pcb] query about move to other side

2007-07-31 Thread joe tarantino
On 7/31/07, DJ Delorie [EMAIL PROTECTED] wrote:


 When an two-pin element is mirrored to the other side, it would be
 nice if the pins stay in the same spot on the board, regardless of the
 element's orientation (currently, the pins get swapped if the element
 is vertically-oriented).


Does this mean that the mirroring is about the x-axis by default?

Likewise, when a selection is mirrored to the other side, it's
 mirrored around the midline of the board, not the location of the
 cursor.

 I'm thinking we can try to apply some smarts to the mirroring code,
 but only if we redesign it all to keep track of the mirror point
 instead of just some Y offset.  But exactly how does the user expect
 it to work?

 'm' - mirror element under cursor.  2-pins (or N inline pins) are an
 easy guess, but what about DIP packages?  Should packages mirror about
 their centroids (i.e. the pins end up in the same exact spots for
 N-inline), or mirror about the cursor location?


 If you are mirroring one element, use it's origin.  This is *usually* pin 1
for through hole elements, or centroid for surface mount.  If the mark is
displayed at the part origin, the user will know exactly where the mirror
point is.  I would not, for example, want the mirror point to be the
centroid if the origin was somewhere else.  (Consider the case where you
want to mirror more than one part and maintain the positional relationship
between them.)

If you are mirroring a selection of elements, have it work like it does for
a copy buffer operation where the reference point for the copy is set by the
user.

mirror selection (i.e. multiple elements, traces, etc) - how to guess
 between Y flip and X flip?  Does it always mirror around the cursor
 point, or around the midpoint of the selection?  How do we guess
 between X and Y flips?


You don't.  Other packages I worked with in the past allow mirroring about
either axis.  You add a command but remove lots of ambiguity.

Joe T

So PCB users, let me know how you think mirror to other side should
 work!


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Re: gEDA-user: [pcb] bucket o' patches

2007-07-31 Thread joe tarantino
DJ,

Good stuff!

I can see a use for thindraw with ps output.  For gerber output however, it
makes little sense.

Joe T

On 7/31/07, DJ Delorie [EMAIL PROTECTED] wrote:


 Just checked these in, some of them correspond to sourceforge tracker
 bugs, but I haven't annotated those yet.  Feedback on the new drill
 helper and the swap active when swap board, even when both visible
 change (before, it only swapped if the back side layer was invisible).

 ps, gerber - don't honor thindraw

 ps - fix bug when layer draws arcs first (i.e. drill)

 ps - change drill helper to be simply a smaller hole.

 lesstif - when flip, scroll bars flip also.

 lesstif - protect against empty :command.

 lesstif - when flip, always swap comp/solder active, even if both
 visible.

 When boards are loaded, the component layer is brought to the top and
 made active.

 When boards are loaded, the first route style is automatically
 selected if the old style doesn't happen to match any styles.

 Fix references to RouteStyleChanged (it's RouteStylesChanged).
 Call it when :RouteStyle is called.

 Fixed a bug in flags_to_string where the LOCALREF pcb flag (use local
 reference for moves) would be discarded.


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Re: gEDA-user: Bug in cvs pcb concerning polygons

2007-07-24 Thread joe tarantino

On 7/24/07, DJ Delorie [EMAIL PROTECTED] wrote:




http://www-nw.uni-regensburg.de/~.grr06742.back.physik.uni-regensburg.de/PCB/GPS_BUG.PCB

I reproduced it.

 If I try to draw a copper rectangle on GND-comp it either doesn't
 draw one at all or scrambles it in the lower left corner. Smaller
 areas work fine though.  When zooming it sometimes appears again but
 in the printout it's never right.  I get the messages :

I've reported this before, but Harry hasn't offered a fix for it.
He's the only one who really knows how the clipper works.

With sufficient zooming/scrolling, you can make pcb segfault too.



I just ran into this same issue  when I was displaying a plane layer where a
polygon covers most of the board.  When there are a lot of perforations in
the polygon due to vias and pins I get a segfault after sufficient
scrolling.

Joe T

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Re: gEDA-user: PCB zoom/panning slow when using copper pour

2007-07-10 Thread joe tarantino

I've noticed the same thing.  Any time planes are shown, the redraw is ~ 10x
slower than it used to be.  Is this a consequence of the new polygon
clipping code?  If so, is there a way to turn it off or configure/build so
that it isn't being used?  What would I lose?

I've also seen warning messages from a gerber file viewer (ViewMaster) that
complains about malformed polygons.  Presumably this due to a polygon which
is folded over on itself.

Joe T


On 7/9/07, DJ Delorie [EMAIL PROTECTED] wrote:



 Beware that this also affects export, including gerbers.

Yeah, not sure if that's a good thing or not ;-)

But I was mostly interested in hearing if it were faster, that will
help narrow down where the slowdown is.


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gEDA-user: Stack Overflow in gnetlist

2007-06-25 Thread joe tarantino

Per the instructions, I often run gnetlist -g drc2  to check my
schematics.  I've noticed recently that I get a stack overflow message
shortly after it has read in all the files.  It still produces the drc
output, but without any clue as to what caused the stack overflow.  The
overflow seems to be tied to the size of the input data.  My design covers 7
schematic pages.  If I load only 3 or 4 of them there is no stack overflow
message (although I'll get errors about unconnected nets -  as expected).
Loading all 7 pages produces the error.

Running gnetlist with -g PCB or any of the other back end processing
options I've tried does not produce the message.  The netlists I get out
appear to be correct.

Any hints as to where this is occurring?

Thanks -

Joe T


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Re: gEDA-user: How's my footprint?

2007-06-02 Thread joe tarantino

I've used this part and several others in the same package.  My $.02
worth...

- I would also recommend using the .01 mil resolution co-ordinate syntax.

- My experience is that most shops like the part co-ordinate origin to be
the centroid, not on pin 1.  I've also had problems setting the mark or at
least always seeing it, but you should place the origin at the centroid
regardless.

- Regarding the copper clearance - you can probably default it - especially
if there is no outside layer ground plane.  I would not default the solder
mask opening however.  These leads are close together.   If your pin spacing
would result in thin slivers of resist between pins you should explicitly
set the solder mask openings to that they overlap.  Having no resist between
pins is actually preferred over having a sliver of mask floating around and
landing on some other pad where it doesn't belong.  (I've heard this from
several fab shops.)

- Another hint.  Consider connecting Vin to a really large trace or piece of
copper.  This will help in reducing the temperature rise of the part - this
package has very high thermal resistance.

Joe T


On 6/2/07, Steve Meier [EMAIL PROTECTED] wrote:


Bert,

A high end (Diamond Quality) fab and assembly shop uses the ascii file
to program their flying probe tester. There is an existing standard
which I have an example off at the office which is based upon the pads
file format. If you are interested I can probably get you an example
early next week.

Steve Meier

L.J.H. Timmerman wrote:
 Hi Steve and all,

 So if I understand this correctly, you are asking for someone to write
 an exporter for pcb which outputs a file with XY-values of pads(pins)
 with an ID-reference to be able to check for copper conductivity etc.
 and maybe even frequency related impedance/capacitance (nelma ?).

 Something like (a csv file):
 example
 #Id  X  Y  top/bottom
 C1-1,100.50,50.20,top
 C1-2,100.50,50.25,top
 /example

 or

 example
 #refdes  pad  X  Y  top/bottom
 C1,1,100.50,50.20,top
 C1,2,100.50,50.25,top
 /example

 Or does a defacto standard format already exist ?

 Together with a netlist of connecting traces this would give enough
 information for testing conductity in an automated fashion.

 I think the BOM/XY exporter would be a good candidate to be extended for
 this functionality, as it already calculates all the XY values of
 pins/pads in some fashion.

 Hmm, I should probably X-post this one to geda-dev.

 Just my EUR 0.02

 Kind regards,

 bert Timmerman.

 On Fri, 2007-06-01 at 21:54 -0700, Steve Meier wrote:

 [snip]
 This is an issue that we need to address as board shops that have the
 ability to do point to point probing are asking for files that define
 the locations of each pad.

 Steve M.





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Re: gEDA-user: thermal vias in pcb

2007-03-07 Thread joe tarantino

On 3/7/07, Peter Baxendale [EMAIL PROTECTED] wrote:


On Tue, 2007-03-06 at 22:02 -0800, Dave N6NZ wrote:
 What is the easiest way to create thermal vias? Not a via with a
 thermal relief -- I can do that :) .. but a via with no thermal relief
 punched into polygons on both sides of the board that ends up getting
 filled with solder to help create a large thermal mass to be used as a
 heat sink.
I thought you just put a thermal relief on the via and then shift
clicked on it to cycle through to the one with no relief. Or isn't that
what you meant?



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Depends on how new your version of PCB is.  Peter's suggestion is
appropriate for recent releases since this feature was added not too long
ago.  I'm running 20060822.  If Dave is using an older version, then my
suggestion is appropriate.

Joe T


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Re: gEDA-user: thermal vias in pcb

2007-03-06 Thread joe tarantino

I use a number of parts with backside thermal pads.  Draw the rectangle as
you describe to comfortably surround the vias.  Then with the mouse over the
rectangle hit 's'.  This will flood the thermal reliefs on the vias.  If you
want to ever de-solder the part from the back, make sure the pad on the
opposite side has the solder resist cleared.

Joe T


On 3/6/07, Dave N6NZ [EMAIL PROTECTED] wrote:


What is the easiest way to create thermal vias? Not a via with a
thermal relief -- I can do that :) .. but a via with no thermal relief
punched into polygons on both sides of the board that ends up getting
filled with solder to help create a large thermal mass to be used as a
heat sink.

The application I am targeting is surface mount motor control and
voltage regulator IC's.  So, a typical part will have a large bottom
contact that is to be connected to large pad in the footprint.  Then, on
the front and the back, as convenient, there are polygons that are also
part of the ground plane, the top one overlaps and contacts the
footprint pad.  Now, the trick: there is a field of small holes drilled
into the polygons, with *no* thermal reliefs.  Drill size is chosen such
that the vias wick up lots of solder and you end up with a nice metal
mass.  See Freescale Ap-Note AN4005.

So, anyway, should I specify some kind of pin with clearance smaller
than the pad?  How can I keep pcb's DRC from whining?  I'm sure the
answer is simple but I'm not sure how to approach it.

TIA,
dave


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Re: gEDA-user: PCB missing grid on far side?

2006-09-26 Thread joe tarantino
Werner, Dan, ..Seems like the original issue I asked about got lost in this thread...What I see is that the problem with the grid not being drawn is repeatable. Any clue as to where this might be happening?
Werner asked if this should be submitted as a bug so it can be tracked. Should it?Thanks,JoeOn 9/26/06, Werner Hoch 
[EMAIL PROTECTED] wrote:Hi Dan,it compiles now. See below.On Tuesday 26 September 2006 18:04, Dan McMahill wrote:
 Werner Hoch wrote:  unfortunatly not:    checking for gdlib-config... /usr/bin/gdlib-config  checking for libgd cflags... -I/usr/include  checking for libgd libs... -L/usr/lib64 -Wl,-rpath,/usr/lib64
  -L/usr/X11R6/lib64 -lXpm -lX11 -ljpeg -lfontconfig -lfreetype  -lpng12 -lz -lm -lgd  checking gd.h usability... yes  checking gd.h presence... yes  checking for 
gd.h... yes  checking if GIF output from the png HID is desired... no  checking if JPEG output from the png HID is desired... no  checking if PNG output from the png HID is desired... yes
  checking for gdImagePng... no  configure: error: Your gd installation does not appear to include  PNG support.  You may need to update your installation of gd or disable
  PNG export with --disable-png  error: Bad exit status from /var/tmp/rpm-tmp.38962 (%build)   could you send me the complete config.log (either to the list or privately)?
here is the relevant section of config.log:--configure:8681: $? = 0configure:8684: test -s conftest.oconfigure:8687: $? = 0configure:8697: result: yesconfigure:8701: checking 
gd.h presenceconfigure:8711: gcc -E -march=i586 -mtune=i686 -fmessage-length=0-D_FORTIFY_SOURCE=2 -O2-I/usr/X11R6/include -I/usr/include conftest.cconfigure:8717: $? = 0configure:8737: result: yesconfigure:8772: checking for 
gd.hconfigure:8779: result: yesconfigure:8813: checking if GIF output from the png HID is desiredconfigure:8824: result: noconfigure:8950: checking if JPEG output from the png HID is desiredconfigure:8961: result: no
configure:9088: checking if PNG output from the png HID is desiredconfigure:9106: result: yesconfigure:9116: checking for gdImagePngconfigure:9173: gcc -o conftest -march=i586 -mtune=i686-fmessage-length=0 -D_FORTIFY_SOURCE=2 -O2 -I/usr/include -march=i586
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/usr/lib/gcc/i586-suse-linux/4.0.2/../../../../i586-suse-linux/bin/ld:cannot find -ljpegcollect2: ld returned 1 exit statusconfigure:9179: $? = 1--The checking for gdImage... requires the libjpeg-devel rpm which was
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Re: gEDA-user: Duplicate pull-down menu buttons in gschem

2006-09-26 Thread joe tarantino
Ales,I didn't make a copy of the system-gschemrc file, but a previous installation did - and this was indeed the cause (good call!). This of course leads to the obvious question: How do I customize settings for the gschemrc file? If duplicating (some of) the initialization from system-gschemrc breaks things, what is the recommended approach? Is there any guidance regarding which keywords I can safely re-define in my local rc file?
On a related note, the checking of GEDADATA and GEDADATARC could be more robust. If GEDADATA is defined but empty, gschem won't start.Thanks,JoeOn 9/26/06, 
Ales Hvezda [EMAIL PROTECTED] wrote:
[snip]Across the top of my gschem main window I see two sets of labels for thepull-down menus:File Edit . Options Help File Edit .. Options HelpOnly the right hand set is sctive.The left hand set just brings up a
little box which brings up a tiny X window when I click it.That doesn't sound/look good.Could you post a gschem.log filethat is created when you run gschem?Running on SuSe 
9.3, gEDA/gschem version 20060906How did you install this?You don't by chance copy system-gschemrcfile to ~/.gEDA/gschemrc or a local gschemrc file?-Ales
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gEDA-user: PCB missing grid on far side?

2006-09-25 Thread joe tarantino
I don't recall seeing anyone mention this...The grid disappears when I view the back side of the board. Changing the grid size, color, or toggling it on and off don't seem to help.I'm using the 20060822 snapshot under SuSe 
9.3Thanks,Joe


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Re: gEDA-user: PCB missing grid on far side?

2006-09-25 Thread joe tarantino
DJ,I picked up the rpm that Werner put together a few weeks ago. I presume that it is the gtk hid based on where it came from and it's similarity to what I was running (which was gtk). Any hints for a non-developer such as myself how to tell for sure?
Thanks,JoeOn 9/25/06, DJ Delorie [EMAIL PROTECTED] wrote:
 The grid disappears when I view the back side of the board.Changing the grid size, color, or toggling it on and off don't seem to help.Which hid?Lesstif or gtk?___
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Re: gEDA-user: PCB missing grid on far side?

2006-09-25 Thread joe tarantino
With this install, the binary landed in /usr/bin. It used to be in /usr/local/bin (when I built the previous version from source). And ldd says:... libgtk-x11-2.0.so.0 = /opt/gnome/lib/libgtk-x11-2.0.so.0
 (0x40055000)libgdk-x11-2.0.so.0 = /opt/gnome/lib/libgdk-x11-2.0.so.0 (0x4031d000)...(among other things)So is the missing grid related to what exporters are config'd? The problem is not printing - it's on-screen.
JoeOn 9/25/06, Werner Hoch [EMAIL PROTECTED] wrote:
Hi Joe and all,On Monday 25 September 2006 21:27, joe tarantino wrote: I picked up the rpm that Werner put together a few weeks ago.I presume that it is the gtk hid based on where it came from and it's
 similarity to what I was running (which was gtk).Any hints for a non-developer such as myself how to tell for sure?The compile options are:%build%configure --with-exporters=bom gerber ps
%{__make}I've disabled only the bitmap export (png, ...) of pcb due to thecrashes on SuSE 10.1 and build problems on 9.3 and 10.0.As the default hid is gtk, Joe has the gtk version.regards
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Re: gEDA-user: Fiducial

2006-09-11 Thread joe tarantino
Another version you might try - uses the newer pcb file format:--Element[ Fiducial mark, no drill, .050 diameter pad  FID 116000 354000 2000 2000 0 80 ]
( Pad[-1 0 1 0 5000 5000 1  1 ] ElementArc [0 0 7500 7500 0 360 1000] )-- This one has a silkscreen circle around it.
Put this part (which I call FID) in whatever directory you use for local symbols, which may be something like:pcb-install-directory/newlib/your-local-symbols/FIDJoe
On 9/12/06, Xtian Xultz [EMAIL PROTECTED] wrote:
Well, I am still using the last Xaw version of pcb, but here is my symbol forfiducial:Element[0x715000 634500 6500 2000 0 100 0x](Pad[0 0 0 0 6000 2000 12800 F1 1 0x]
)Works fine... I use the dimensions from a document that a assembler firm sentto me, I checked out some other documents explaining about fiducialdimensions, and all was about the same.I think this one would help.
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