RE: Monitoring Random ESD events

2003-07-09 Thread Pommerenke, David

Brent,

Please contact Trek, they have a very nice product that measures and
logs ESD events. It measures voltage (on contact) but it has ports for
external sensors.

The product has been designed for Hewlett Packard a few years ago.

David Pommerenke


From: brent.dew...@us.datex-ohmeda.com
[mailto:brent.dew...@us.datex-ohmeda.com] 
Sent: Tuesday, July 08, 2003 5:38 PM
To: Eric Penne
Cc: emc-p...@majordomo.ieee.org; owner-emc-p...@majordomo.ieee.org
Subject: Re: Monitoring Random ESD events



If you can get near the sensors (1 inch), 3M makes a static field meter.
Their Model 718 is a non-contact device and has an analog output
proportional to the field for logging.

Best of luck,

Brent DeWitt




 

Eric Penne

epe...@ieee.org To:
emc-p...@majordomo.ieee.org 
Sent by:  cc:

owner-emc-pstc@majordom   Subject:
Monitoring Random ESD events 
o.ieee.org

 

 

08-07-03 02:38 PM

Please respond to Eric

Penne

 

 






I'm pretty new to the EMC scene and I need to monitor a product to see
what kind of ESD events it generates on its own.  The customer wants me
to
attach my oscope to their sensors and see what kind of ESD voltages
their
sensors see in daily operation.

I know that I don't want to directly connect the oscope to the sensors
while the machine is running.  I was trying to figure out a way to
isolate the signals on the sensors from the oscope but still get a
value
that is useful.  I was thinking of some sort of current loop around the
sensor wires.  How would I correlate the current loop measurement to an
ESD voltage?

I'm probably not providing enough information but I'm not really sure
what
information will be needed.

Thank you,
Eric Penne
epe...@ieee.org




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RE: ESD Problem

2003-05-27 Thread Pommerenke, David

My hand is up.

David Pommerenke


From: Luke Turnbull [mailto:luke.turnb...@trw.com] 
Sent: Tuesday, May 27, 2003 8:23 AM
To: emc-p...@ieee.org
Subject: ESD Problem


Would the gentleman who is on the 61000-4-2 committee please put his
hand up?

Thanks,

Luke Turnbull




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RE: HV relay

2003-05-15 Thread Pommerenke, David

Dave,
 
The voltage drop accoss a relay (same is true for an ESD protection spark gap, 
or a non-linear polymer ESD protector) contact after it sparked over is often 
in the range of 25 V (I have no data on mecury wetted relays) or so for 
currents in the 1-20A range. It is very difficult to measure it, as the step 
response of the measurement system must settle extremly fast (2 ns after a 1000 
V drop you want to measure with +/-5 V accuracy). The physics of the 25 V are 
not well understood in my opinion. Obviously, it cannot be 0 V, as some field 
is needed to drive the charge carriers over the gap. For larger current arcs, 
over larger distances, at later times (microseconds) the situation of Anode 
layer and Cathode layer etc. is better understood.
 
If anyone knows a theory why there is about 25 V drop for a small distance, 
medium current spark gap, please let me know.
 
David Pommerenke
University Missouri Rolla

-Original Message- 
From: drcuthb...@micron.com [mailto:drcuthb...@micron.com] 
Sent: Wed 5/14/2003 5:38 PM 
To: Pommerenke, David; drcuthb...@micron.com; 
emc-p...@majordomo.ieee.org 
Cc: 
Subject: RE: HV relay




David,

thanks for the great information! This is the theory we're subscribing 
to. The arc mechanism takes place at the negative electrode. I just tested a 
mercury wetted coaxial relay, from 0 to 500 volts and it exhibits a 10 volt 
drop across the arc. It is not polarity sensitive, which surprised me a bit. I 
expected a difference between electron emission from the reed (tungsten?) and 
from the mercury pool. I guess that in this case the mercury arc dominates 
things. I'll see what happens if I heat the relay to raise the mercury pressure 
and ion mobility.

I will order the SF-6 filled relay that you recommend and give it a 
try. I might experiment with contacts immersed in FC-40. The runt pulses are 
not a show stopper but are an annoyance.

Dave Cuthbert
Micron Technology

-Original Message-
From: Pommerenke, David [mailto:davi...@umr.edu]
Sent: Wednesday, May 14, 2003 3:48 PM
To: drcuthb...@micron.com; emc-p...@majordomo.ieee.org
Subject: RE: HV relay


Dear Dave,

You are working on a difficult issue.

Every HV relay will breakdown before the contacts touch. The reason is
as follows:
   When the contacts come closer the surface field strength
   Increases. The field strength will increase so much, such
   that the field emission current reaches current densities
   sufficient to melt the surface material. This melting
   surface material will create a conductive path. The process
   is called Explosive Electron Emission and takes place
   in Vacuum and in gas filled relays.

   Now there are some particularities for gas filled relays.
   i the pressure of the gas is not that high, the field
   eission or other processes might initiate a gas breakdown.
   
   At least for high pressure relays and for Vacuum relays,
   nrmally the breakdown is caused by surface explosions.

Now, after the initial breakdown and some current the arc might
extinguish again. This will show up as bouncing in the current pulse
and times of 50 to a few hundred nanoseconds are typically. There are
many influencing factors, some of them are:
   - Speed of approach of the electrodes
   - External current
   - Gas filling
   - Surface materials

After the contact meet, the contacts might bounce, leading to
interruptions or changes in the current in the us or ms range.

Regarding the Vacuum breakdown strength. There is no
'Vacuum breakdown, it is all a surface process.

In general, I suggest to think about using N2-SF6 filled relays. The
HC-5 from Kilovac is a good choice up to about 10 kV, if mounted in
epoxy. You can reduce the drive current or shape the drive current to
reduce the problem of bouncing.

David Pommerenke
University Missouri Rolla


-Original Message-
From: drcuthb...@micron.com [mailto:drcuthb...@micron.com]
Sent: Wednesday, May 14, 2003 11:09 AM
To: emc-p...@majordomo.ieee.org
Subject: HV relay


I'm designing some ESD test equipment for in-house use and need some
suggestions on relays. I am experimenting with a 5 kV COTO vacuum relay
and notice that I get some runt pulses. It appears that the contacts
arc before they touch and then the arc extinguishes after 50 ns and then
reignites. About half the time

RE: HV relay

2003-05-14 Thread Pommerenke, David

Dear Dave,

You are working on a difficult issue.

Every HV relay will breakdown before the contacts touch. The reason is
as follows:
   When the contacts come closer the surface field strength
   Increases. The field strength will increase so much, such
   that the field emission current reaches current densities
   sufficient to melt the surface material. This melting
   surface material will create a conductive path. The process
   is called Explosive Electron Emission and takes place
   in Vacuum and in gas filled relays.

   Now there are some particularities for gas filled relays.
   i the pressure of the gas is not that high, the field
   eission or other processes might initiate a gas breakdown.

   At least for high pressure relays and for Vacuum relays, 
   nrmally the breakdown is caused by surface explosions.

Now, after the initial breakdown and some current the arc might
extinguish again. This will show up as bouncing in the current pulse
and times of 50 to a few hundred nanoseconds are typically. There are
many influencing factors, some of them are:
   - Speed of approach of the electrodes
   - External current
   - Gas filling
   - Surface materials 

After the contact meet, the contacts might bounce, leading to
interruptions or changes in the current in the us or ms range.

Regarding the Vacuum breakdown strength. There is no 
'Vacuum breakdown, it is all a surface process.

In general, I suggest to think about using N2-SF6 filled relays. The
HC-5 from Kilovac is a good choice up to about 10 kV, if mounted in
epoxy. You can reduce the drive current or shape the drive current to
reduce the problem of bouncing.

David Pommerenke
University Missouri Rolla



From: drcuthb...@micron.com [mailto:drcuthb...@micron.com] 
Sent: Wednesday, May 14, 2003 11:09 AM
To: emc-p...@majordomo.ieee.org
Subject: HV relay


I'm designing some ESD test equipment for in-house use and need some
suggestions on relays. I am experimenting with a 5 kV COTO vacuum relay
and notice that I get some runt pulses. It appears that the contacts
arc before they touch and then the arc extinguishes after 50 ns and then
reignites. About half the time it the contacts appear to make physical
contact before arcing. If I remember correctly, the strength of a hard
vacuum is 200 kV/cm. So, at 5 kV the contacts can arc when they are 25
microns apart (actually further apart due to field enhancement). Are
there any vacuum relays that do not exhibit runt pulses?

Dave Cuthbert
Micron Technology



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Monotonic and Non-monotonic EUT response in ESD testing

2003-05-13 Thread Pommerenke, David

Dear Group,

There has been a discussion in EMC-PSTC on EUT response to different ESD
test voltage levels. Let me explain whay I understand about this
problem:


An EUT may respond monotonic:  More stress, never reduces the EUT
response.
 or
An EUT may show a non-monotonic response:  It fails at a lower level,
but passes at a higher level.

To understand the possible reasons one needs to needs to distinguish
between effects 
  - of the source (excitation)
  - of ESD protection networks 
  - of the circuit (except the ESD protection networks).



1) Is the excitation function linear and/or monotonic?
   ==
   For contact mode the current waveform is (nearly) proportional to
   the voltage. One can reasonable assume that the stress is
proportional
   to voltage. 
   
   For air discharge mode, the average rise time is shorter for lower
   Voltages. So an EUT that responses to rise time (or high frequency,
   content or dI/dt) may fail at a lower voltage but pass at a higher
   voltage.

   Of course, EUTs can react to: Energy, Charge, current, Current
derivative,
   Electrostatic fields, High-impedance fields, Magnetic fields, high
   frequency ( 1GHz) components of fields etc. So an ESD test is 
   actually a test to many different physical phenomena.

Looking at each stress parameter of real ESD and of Air discharge ESD we
see:

Energy  - proportional to voltage^2   = Monotonic
Charge  - proportional to voltage = Monotonic
Electrostatic field - proportional to voltage = Monotonic
Low freq content of the current - Proportional to voltage = Monotonic.
Low freq mag field of current   - Proportional to voltage = Monotonic
Rise time of current - in AVERAGE: increases with voltage  =
Non-Monotonic
High Freqs of fields - in AVERAGE: decrease with voltage  =
Non-Monotonic
Peak current - in AVERAGE: Increases with voltage, 
   but not linear = non linear,
but 
 Monotonic

   = Conclusion #1:  For air discharge, lower levels always need
  to be tested, even if the EUT has a monotonic
  electrical stress - EUT reaction response.


2) Are ESD protection networks linear or at least monotonic?
     

   a) RC network as low pass filter (or other low pass filters).
  They are linear and of course monotonic.

   b) Clamping diodes, Varistors etc.
  They are non-linear, but monotonic. So they would not cause
  a fail at lower levels, but a pass at higher levels.

   c) Snap-back devices (e.g., Spark gaps, Some transistor circuits)
  They can cause a pass at high levels (snap back occurs) but 
  a fail at lower levels (not enough excitation to snap-back).


3) Is the circuit response monotonic?
   =  
   In most cases: Yes. Meaning if the stress is increased, the 
   effect is not reduced. But there are exceptions. I will name 
   an example:
 a) An ESD causes a pulse on a reset line (assume contact mode,
meaning linear excitation). For lower voltages, the pulse
is large enough to reset some ICs, but not all that are on
the reset tree. Consequence: The EUT will get stuck in
an incomplete reset. For higher voltages, the EUT would
perform a full reset that might lead to a pass in the test
(depending on the EUT of course).

 = Conclusion #2: For discharges to grounded areas (e.g., chassis)
   These discharges usually lead to soft-errors. ESD-
   protection circuits are normally either low pass
   filters (linear anyway) or overvoltage protection
   devices. The later may have snap-back. But discharges
   to the chassis usually do not trigger snap-back
   devices, as they are there to protect against direct
   discharges to PINs.

   Non-monotonic responses in contact mode testing
   are rare, but they may occur. In most contact
   mode testing an increase of the stress (=voltage)
will
   not reduce the EUT response.
   
=  Conclusion #3:  For discharges to PINs or other non-grounded areas
(e.g.,
an LED, such that the spark hits the board)
snap-back
devices may trigger leading to a non-monotonic EUT
response.


Now to access the overall risk to the customer, one needs to take into
consideration what the risk of low voltage ESD is relative to high
voltage ESD. 

Very roughly one can say:

  Lets say, an EUT will see 1000 ESDs up to 3000 V a year. Then we 
  can roughly say: It will see 100 ESDs from 3000 - 6000 V
It will see 10 ESDs  from 6000 - 9000V
 

RE: ESD gun verification

2003-05-09 Thread Pommerenke, David

Dear Chris,

Why not a Spectrum Analyzer?

For none-traceble verification it is a very good tool. 

For tracable measurements there are the following problems:
   - The amplitude uncertainty is about +/- 1.5 dB  =about 15 %
   
   - The pulse is repeated let's say 20 times a second, but the
 pulse is only 100 ns wide. So the requirements for the linearity
 of the mixer is very high.

David Pommerenke
   


From: Chris Maxwell [mailto:chris.maxw...@nettest.com] 
Sent: Friday, May 09, 2003 7:28 AM
To: Pommerenke, David; John Woodgate; emc-p...@majordomo.ieee.org
Subject: RE: ESD gun verification

One question that struck me is:  Why isn't a spectrum analyzer used to
verify the waveform?  Most labs don't have a 4Ghz oscilloscope; but they
almost all have a 10Ghz spectrum analyzer.  It seems that the spectrum
of the waveform should be just as traceable and repeatable as the
waveform itself.

From my own experience, I use this method to quickly verify our EFT
generator in our own lab (although I'm just a manufacturer, not a third
party lab).  We have the EFT generator calibrated yearly; and whenever I
use it, I turn on the spectrum analyzer and read the spectrum just to
make sure that it's working.

Chris Maxwell | Design Engineer - Optical Division
email chris.maxw...@nettest.com | dir +1 315 266 5128 | fax +1 315 797
8024

NetTest | 6 Rhoads Drive, Utica, NY 13502 | USA
web www.nettest.com | tel +1 315 797 4449 | 




 -Original Message-
 From: Pommerenke, David [SMTP:davi...@umr.edu]
 Sent: Thursday, May 08, 2003 5:46 PM
 To:   John Woodgate; emc-p...@majordomo.ieee.org
 Subject:  RE: ESD gun verification
 
 
 John,
 
 The IEC TC77b WG-9 made clarification for what was intended to be
 understood as verification and what was intended to be a
 calibration. Different words are used now, but the new version of he
 standard 77b/378/CDV tries to eliminate the misunderstanding by some
 metrologists. They think that the present standard requires a traceble
 calibration as a daily or weekly test, not only a yearly calibration.
 
 David Pommerenke
 
 
 
 
 -Original Message-
 From: John Woodgate [mailto:j...@jmwa.demon.co.uk] 
 Sent: Thursday, May 08, 2003 1:25 PM
 To: emc-p...@majordomo.ieee.org
 Subject: Re: ESD gun verification
 
 
 I read in !emc-pstc that Pommerenke, David davi...@umr.edu wrote (in
 a5d66e6b6f478b48a3cef22aa4b9fca378e...@umr-mail1.umr.edu) about 'ESD
 gun verification' on Wed, 7 May 2003:
 
 Brain,
 
 Spelling!
 
 I like to repeat: For verification you do not need calibrated
 equipment or full bandwidth. The verification is just a method to
 increase trust in the calibration. If you use some homemade current
 target and a 500 MHz scope, you will get a pretty good picture of the
 waveform and detect most changes in an ESD generator.
 
 A comb-generator run on an OATS is not a NSA calibration, still it
 establishes trust in the antennas, cables and the spectrum analyzer.
 
 Quite right and sensible, but tell that to a UK metrologist! If it's
not
 200% accurate, it's not believable.(;-)
 -- 
 Regards, John Woodgate, OOO - Own Opinions Only.
 http://www.jmwa.demon.co.uk 
 Interested in professional sound reinforcement and distribution? Then
go
 to 
 http://www.isce.org.uk
 PLEASE do NOT copy news posts to me by E-MAIL!
 
 ---
 This message is from the IEEE EMC Society Product Safety
 Technical Committee emc-pstc discussion list.
 
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 http://www.ieeecommunities.org/emc-pstc
 
 
 ---
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This message is from the IEEE EMC Society Product Safety

RE: ESD gun verification

2003-05-08 Thread Pommerenke, David

John,

The IEC TC77b WG-9 made clarification for what was intended to be
understood as verification and what was intended to be a
calibration. Different words are used now, but the new version of he
standard 77b/378/CDV tries to eliminate the misunderstanding by some
metrologists. They think that the present standard requires a traceble
calibration as a daily or weekly test, not only a yearly calibration.

David Pommerenke





From: John Woodgate [mailto:j...@jmwa.demon.co.uk] 
Sent: Thursday, May 08, 2003 1:25 PM
To: emc-p...@majordomo.ieee.org
Subject: Re: ESD gun verification


I read in !emc-pstc that Pommerenke, David davi...@umr.edu wrote (in
a5d66e6b6f478b48a3cef22aa4b9fca378e...@umr-mail1.umr.edu) about 'ESD
gun verification' on Wed, 7 May 2003:

Brain,

Spelling!

I like to repeat: For verification you do not need calibrated
equipment or full bandwidth. The verification is just a method to
increase trust in the calibration. If you use some homemade current
target and a 500 MHz scope, you will get a pretty good picture of the
waveform and detect most changes in an ESD generator.

A comb-generator run on an OATS is not a NSA calibration, still it
establishes trust in the antennas, cables and the spectrum analyzer.

Quite right and sensible, but tell that to a UK metrologist! If it's not
200% accurate, it's not believable.(;-)
-- 
Regards, John Woodgate, OOO - Own Opinions Only.
http://www.jmwa.demon.co.uk 
Interested in professional sound reinforcement and distribution? Then go
to 
http://www.isce.org.uk
PLEASE do NOT copy news posts to me by E-MAIL!


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ESD test standard - present CDV - justification for changes

2003-05-08 Thread Pommerenke, David

Dear Jim,

Thanks for taking the time to read the standard. Let me expand on the
justification of the changes.

Table of Content
 
1) New current target
2) On the correlation problems with ESD testing
3) Specific answers to your points (marked by ### in your email)

David Pommerenke
University Missouri Rolla


1) New current target
=
If you accept that a larger calibration bandwidth is needed (see my
point (2)) then there is a need for a new target. The present target is
only useful up to 1 GHz. Above 1 GHz targets that are build the same
way differ a lot. The present target also has a high input impedance in
the RF range (it reaches kOhm), so that the current is disturbed
relative to a large ground plane.

Now a target also needs to be calibrated, as one needs to determine if
it fulfills its specification. This requires a 
  either
a network analyzer 
or a spectrum analyzer with tracking 
or a signal generator and a power meter. 
or a TDR in TDT arrangement.

The good news is that this is only relevant for the manufacturer of the
target, NOT FOR THE USER of the target. 

Now the construction of the new target is quite simple. I have made
about 10 in the last years. There are also other constructions possible
that are more simple. Note the target information is information, i.e.,
everyone can make their own target, as long as it measures correctly the
construction does not matter.



2) On the correlation problems with ESD testing.

Every ESD test is a combination of many physical tests. Disruption or
disturbance can be caused by:
  a) dielectric breakdown
  b) Current (ohmic loss - thermal)
  c) Induction - voltage - oxid breakdown
  d) Induction - current - thermal
  e) Induction - disturbance
  f) Ohmic voltage drop - disturbance
  g) Inductive voltage drop - disturbance

And there are many more. For each of them the question:

- Is an ESD test reproducible?

Will have a different answer. For example, the dielectric breakdown is
strongly related to the voltage, and the voltage of ESD generators is
well controlled.

Now modern ICs can react to pulses of about 50ps width (just look at
your PC). Now, induction is a differentiation process, e.g., it is a
high-pass filter. The high frequency components of the current and the
transient fields will dominate the circuit response (in this case:
mostly disturbance, not destruction). 

If you compare the high frequency components of different ESD generator
currents and fields, you will see differences larger than 20dB. As a
consequence, failure levels for fast ICs (disturbance) will vary as much
as 1:5 if ONLY the ESD generator is changed.

This has been observed in many Industry applications and tests and is
the main driving force for improving the standard.

We are in the process of publishing results of such correlation under
well controlled conditions and the analysis of the reasons (correlation:
ESD generator parameters vs. disturbance failure levels). 

The paper is in the review-process of the IEEE Transactions on EMC. I
will not post it here while it is in review, but I can email a pre-print
version to interested individuals.






From: Jim Ericson [mailto:jde...@nas.com] 
Sent: Tuesday, May 06, 2003 12:02 AM
To: Pommerenke, David; emcpost
Subject: Re: current-sensing transducer photos

David:

Thank you for the Committee Draft Version of the new ESD Standard.  The
committee is to be commended for producing such a thoroughly researched
document that aims at improving test reproducibility of such a complex
event as electrostatic discharge.

While I am personally fascinated with the scientific aspects of ESD, I
must say that the CDV rather took my breath away ... from the standpoint
of
ESD Current Target/Conical Adapter Line mechanical complexity ... to the
cost implications for the EMC Laboratories and their clients.  4 GHz
Current
Targets, Network Analyzers, Oscilloscopes, and Electrostatic Voltmeters
are
far from trivial expenditures for any Laboratory.

# Most test labs neither build ESD-current targets, not do they
calibrate ESD generators themselves. For ESD-target and ESD-generator
manufacturers, it is quire reasonable to expect that they can
characterize the device they are building or calibrating. 
#





I guess what I am missing is the underlying justification of need to
change
from the current 1 GHz approach.
##  Please see my text above. There are more references that should
be part of the CDV, they may also be in a justification document.#

I don't mean to beat this subject into a dead horse.  I am not qualified
to
do that (even if I wanted to) either from experience or education.  I
would
only make the following comments from my perceptions based on 7 years
with
an EMC Lab, and 18 years building, testing, and evaluating Silicon for a
couple of semiconductor
manufacturers:

1.  In the several years of performing (or directly

RE: ESD gun verification

2003-05-07 Thread Pommerenke, David

Brain,

I like to repeat: For verification you do not need calibrated
equipment or full bandwidth. The verification is just a method to
increase trust in the calibration. If you use some homemade current
target and a 500 MHz scope, you will get a pretty good picture of the
waveform and detect most changes in an ESD generator.

A comb-generator run on an OATS is not a NSA calibration, still it
establishes trust in the antennas, cables and the spectrum analyzer.

David Pommerenke
University Missouri Rolla




From: brian_ku...@leco.com [mailto:brian_ku...@leco.com] 
Sent: Monday, May 05, 2003 1:04 PM
To: emc-p...@ieee.org
Subject: Re:ESD gun verification


John,

First I would like to say how impressed I am with Jim for building his
own
target.  Reading through his detailed description of all he went through
made me
think the $2000 is well worth it.  I wish I had the skill and resources
to do
stuff like that.  

Years ago we used to just air discharge our ESD gun to make sure it was
working
ok.  We never performed a verification test. This we thought was
covered by
the annual calibration and assumed that the ESD gun was designed solid
enough to
not have to worry about it.  It wasn't until some of these Laboratory
Accreditation organizations got popular that daily verification of
your ESD
gun required the verification of the current waveform.  This makes a
fairly
inexpensive test very expensive for most labs.

In addition to the $5000-$8000 for the ESD gun, now you have to have the
equipment to do verification.  For us this was a $2000 target, a
faraday cage,
and a $20,000 1Ghz bandwidth digital storage scope.  If you are testing
everyday
your very expensive scope is for the most part dedicated for this
purpose.  You
can use cheaper scopes, but it has to have a high bandwidth and storage
capabilities.  A huge investment no doubt if you want to do it right.
BTW,
don't you also have to verify your scope is working correctly?  Hmmm.

The other issue is with the time involved with performing the
verification test.
To look at all the details of the current waveform for just a few
voltages both
positive and negative polarity plus the time to document and keep
records of it
takes time many customers don't want to pay for.  Somehow you have to
work in
the cost because time is money and someone has to pay for it.  To test
every
voltage level and polarity can take more time than the ESD test itself.
So a
happy reasonable medium has to be found.

In a perfect world someone would invent a little box I can discharge my
ESD gun
into and a little green light would come on to tell me it is operating
OK. If
someone could invent such a box and keep it inexpensive, I would buy
one. Of
course it would probably cost a fortune to get the box calibrated and
how do I
verify the box is working correctly?  Hmmm.

Brian

Reply Separator
Subject:ESD gun verification
Author: jde...@nas.com
List-Post: emc-pstc@listserv.ieee.org
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Date:   5/05/03 12:02 PM


John:

I faced the same problem about six years ago.  I needed to do
verification
in between the expensive annual calibrations.  I first explored the
option
of buying a Pelligrini Target.  As I recall, the quotes I received were
around $2000.  That seemed outrageous, so I decided to build one myself.
I'll bet it took me at least 3 days to make sense of those goofy
mechanical
drawings in 61000-4-2.  If only they had included a photograph or good
cross-section in the Standard!

Anyway, I finally figured it out, translated the drawings into something
understandable by a U.S. machine shop, and got all the brass parts
fabricated locally.  It took several in-process consulting sessions with
the
machinist, but I finally got all the brass parts done for around $300.
Then, I purchased a $25 silver electroplating kit.  It was like Science
Fair
time in my workshop!  Some hours of painstaking soldering later, the
target
was completed.  I mounted it over a specially-drilled hole in the brass
wall
panel of our anechoic chamber (you need a Faraday Cage of some sort, and
this seemed the easiest).  I did a quick check using our Tektronix 1 GHz
analog oscilloscope ... and the risetimes and overall waveforms measured
within spec!  Then, I sent the target to Haefely-Trench for a
calibration
(against their standard Pelligrini target).  The results were very, very
close.

Having performed many verifications at this point, my advice (if you
want
fairly accurate and repeatable results):

1.Make (or buy) something resembling the 61000-4-2 target.
2.Use a Faraday Cage.
3.Be aware how important the POSITION of the ESD Gun Grounding Strap
is
to these measurements ... especially to risetime measurements.  I always
take a photograph of the setup, including the shape of the Grounding
Strap
and where it is attached.  If you don't do this, you'll 

RE: ESD gun verification

2003-05-01 Thread Pommerenke, David

Dear John,

It depends on what you want.

But at first we need to discuss one issue of definition of
verificaiton, calibration or all kinds of similar words.

I define a calibration as a traceble measurement and a verification
as a measurement that helps to establish confidence that some instrument
is still OK. A verification by this definition is not traceble. In
EMC, using a comb-generator daily to check you emissions equipment
(antenna + amp + cable + SA) is a verification. 


1) If you are going to do a formal calibration, you have to follow the
standard and have to have a bandwidth of at least 1 GHz.

2) If you are just doing a verification, you can build your own current
target, even if it only works so and so. Then you take some
oscilloscope, e.g., 500 MHz bandwidth and do a reference measurement
after the ESD generator has been calibrated (see above for
definition). From that day on, you dischare the generator into your
self-made structure and compare to the reference. Now you need to derive
some useful criteria to handle diviations. But in general, your aim is
just to establish more confidence in the ESD generator's calibration
status. So your measurement do not need to capture all parameters in
good fidelity.

Of course, you have to do your traceble calibration, e.g., every year or
so.

The present ESD standard is not very clear in the use of verification
and calibration. But the definitions above are the ones that
TC77b-WG-9 intended. The new version of the standard, that is in a CDV
stage, clarifies this better.

David Pommerenke
University Missouri Rolla








From: John Harrington [mailto:jharring...@f2labs.com] 
Sent: Thursday, May 01, 2003 1:46 PM
To: 'emc-p...@majordomo.ieee.org'
Subject: ESD gun verification


Hello All

Does any one have a quick and dirty (and hopefully cheap) way to verify
the
performance of an ESD gun.

Please, no one suggest building the current sensing system described in
the
back of IEC 61000-4-2.  I don't understand the drawings let alone have
the
workshop or materials to consider it.  Although, I may pay someone to
build
it for me... 

I am desperate enough to consider buying something off the shelf (if I
could
find said shelf).

All help appreciated

John Harrington
EMC Technical Manager
F-Squared Laboratories


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RE: equipment question

2003-02-11 Thread Pommerenke, David

Dear Chet,

Modeling the frequency response is not a totally trivial task. In
general, there are two different design strategies:

  1) Gauss-roll off
 This scopes have an approximately Gauss-roll off with frequency. As
a 
 Consequence the ratio of F_sample  to F_bandwidth has to be at
least 
 4:1 to avoid alaising.
 This scope design results in a good (no overshoot) step response
for
 in-band signals (rise-time of the original signal is such that 
 most frequency components are within the 2 GHz bandwidth) and a
good
 step response for out of band signals (very fast risetime, much
 faster than the scope's risetime).
 For sine-wave measurements of in-band sine wave frequencies, 
 of course, this scopes will be influenced by the roll-off
  

  2) Flat frequency response.
 This scopes have a flat frequency response up to about
F_sample/2.5.
 Then the frequency response rolls-off very sharply.

 This scope yield good data for in-band sine wave and in-band step 
 waves. But for out of band step waves (very fast risetime), the
 step response of the scope may show pre-shoot, overshoot and
ringing.

There is some literature on the frequency response of scopes, you most
likely find it in the transactions on instrumentation and measurements.

Now the issues are much more tricky than from a pure analoge, linear
system analysis. Many scopes have an adaptive interpolation method. The
method tries to find out if the signal was in-band or out of band.
Now depending on that it will use a different interpolation method.

Next aspect to take into account is that the input impedance match is
often not very good. So for detailed work, you have to take reflections
and multple reflections into account.

If you do not use the 50 Ohm input, please also take into accuont that
the 1Mohm/10 pF setting has a much more complex input equivalent circuit
that these values. For higher frequencies the impedance would be very
low, so the manufactureres add some series resistance in the 10 pF. As a
consequence, each passive probe will react differently to the scope
input, i.e., you do not only have to compensate the low frequency, but
also adjust the other potentiometers and capacitors inside the probe
(they are often hidden) to obtain a flat frequency response at higher
frequencies, if the probe was not made for that specific oscilloscope.

Secondly, the frequency response is often effected by the mV/div
setting. So ist he input impedance of some scopes.

I do not know what you are intending to do with the frequency response,
but if you intend to do some deconvolution (correction of the frequency
response, or correction of measured data) I need to warn you. You may
introduce more problems by over-compensating, so that the overall
measurement uncertainty is increased.

The web-sites of LeCroy, Agilent and Tektronix have all kinds of very
good information on the frequency response. 


Regards,

   David Pommerenke






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RE: ESD Contact discharge fitted connector

2003-01-22 Thread Pommerenke, David

Kris,

In my reading of the standard, and the next modificaiton will include
that clearly, you need to test discharges to the shell of the USB
connector, as there will not be a connector in there all the time.

There is another strong arguemnt: The user might plug a charged (e.g.
hand-held) device into the USB port.

Of course, the main criteria is survival, as you cannot test
connectivity if there is no USB device.

But if you have multiple USB connectors, another USB device might loose
connection when discharging to a different USB connector.

David Pommerenke





From: Carpentier Kristiaan [mailto:carpenti...@thmulti.com] 
Sent: Wednesday, January 22, 2003 10:48 AM
To: emc-p...@majordomo.ieee.org
Subject: ESD Contact discharge fitted connector


Hello group,

A Class II product has 3 interfaces.
2 interfaces have plastic connectors, with no metal shell.
3rd interface is USB plastic connector but with metal shell.

The housing of the product is plastic (non conductive)
The USB connector is fitted with a USB plug molded in plastic.

Test set-up for immunity testing (ESD) is done with all interface plugs
connected to verify performance of all interfaces.
Consequently, no conductive parts are accessible and contact discharge
must
not be applied.
But the product can also used without USB connection; the USB connector
shell becomes then accessible.

Question:
Is ESD Contact test required on USB connector without plug taken into
account that USB performance cannot be monitored at that time (and the
other
interfaces must be verified in another way)?

More generic: can we exclude ESD contact testing by fitting all
connectors
with plugs on a product ?

FYI:
IEC61000-4-5+A1+A2 states that Contact ESD is not required (par 8.3.1 c)
for
those points and surfaces of equipment which are no longer accessibel
after
FIXED installation or after following the instructions for use.

Regards,
Kris



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RE: Changes to IEEE emc-pstc web-based services

2003-01-01 Thread Pommerenke, David

Dear Group,

My experience is that with WEB-based systems there will be significantly
less participation. Posting of large documents, as people will not
carefully think about file size, compression down-sampling etc will make
it worse for people on dial-up connections. Discussions will be based on
the knowledge of those documents.

Without strong reason the present system should not be changed. I am not
aware of those strong reasons.

David Pommerenke



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RE: ESD Testing Method

2002-12-03 Thread Pommerenke, David

Dear Alex McNeil,

The intend of the standard is that each discharge is an individual
event. This means:

Electromagnetic consequence
===
All charges need to be drained before the next discharge is applied. You
may use an Ionizer, a conductive brush, a ground wire etc. to remove the
charge from the EUT. Be aware: An Ionizer may change the test results
for air discharges a lot. 


Software consequence

It is not the aim to apply an discharge while the EUT is still in some
error correcting algorithm. So one can apply discharges at a fast rate,
e.g., 20 pulses a sec to up the number of discharges (with 10 discharges
the ESD test result uncertainty may be dominated by the time dependence
of the susceptability function). Still, one needs to make sure that the
EUT is back to its original software status before the next ESD is
applied.

David Pommerenke




-Original Message-
From: Alex McNeil [mailto:alex.mcn...@ingenicofortronic.com] 
Sent: Tuesday, December 03, 2002 10:16 AM
To: 'emc-p...@majordomo.ieee.org'
Subject: ESD Testing Method


Hi Guys,
1. For double insulated products (non-earthed) is it correct to state
that
the ESD test point, for Contact Discharge (CD) tests, should be
discharged
prior to applying the next discharge (I am sure I read this somewhere,
but)?
2. As a follow on from the first question, I have a product that will
pass
+8KV Contact Discharge (CD) in +2KV steps. It will also pass -8KV CD in
-2KV
steps. However, if I test +XKV (50 zaps) followed by -XKV (1 zap) it
will
fail. What is the correct procedure as the standard does not say if +CD
should follow -CD or vice versa or step up with the same polarity? 

In my opinion it would be unlikely in a particular customer environment
that
the +XKV would be quickly followed by a -XKV (or vice versa).

I look forward, as per usual, to your kind and expert responses.

Kind Regards
Alex McNeil
Principal Engineer
Tel: +44 (0)131 479 8375
Fax:+44 (0)131 479 8321
email: alex.mcn...@ingenicofortronic.com


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RE: Circuit pack ESD drain

2002-11-01 Thread Pommerenke, David

Dave,

If you can give me the dimensions we can numerically calculate or
analytically estimate the waveform.

David Pommerenke


-Original Message-
From: David Heald [mailto:dhe...@tellium.com] 
Sent: Thursday, October 31, 2002 4:58 PM
To: 'emc-p...@majordomo.ieee.org'
Subject: Circuit pack ESD drain


All,
  Does anyone know of a sample waveform or general characteristics for
worst
case VI on an ESD drain pin when a circuit pack is inserted into an
equipment shelf?  This is an odd question I know, but my management
asked
for the info and I really have no idea (and it shouldn't happen anyway
;o)

I guess even a typical maximum charge that can be expected to be on a
circuit pack would be sufficient information.

Thanks in advance!

Dave Heald

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AW: An ESD question

2002-06-12 Thread Pommerenke, David

Dear Group,

In dry conditions, not only the charging processes are enhancec, but the 
severity (less risetime, higher peak current) is enhanced in general. For both 
reasons, it is not uncommen to see ESD problems move around the world with the 
local seasons.

Still, I would always try to debug the problem in contact mode. The effect on 
humidity on the electromagnetic properties is in general very small. Aim of the 
debugging should be to identify the traces, nets of PINs that are effected. 

Locally injecting pulses via direct, capacitive, inductive or differential 
injection has prooved to be an effective tool for achieving this.

David




-Ursprüngliche Nachricht-
Von:Gibling, Vic [mailto:vic.gibl...@marconi.com]
Gesendet:   Mi 12.06.2002 02:26
An: emc-p...@majordomo.ieee.org
Cc: 
Betreff:An ESD question



Dear Group 

I tried to find David Pommerenke article's in the Journal of ESD on the Web
but alas no downloadable version was found, so may I ask the group a
question?

We have an ESD field failure which is occurring in dry hot countries ( no
surprise )which can be recreated with an ESD of -800V. In an attempt to get
a high incidence of discharges we used a dehumidifier to create a dry
environment. The result was a reduction in discharges. 

Thinking the problem through -now- as a dry atmosphere will encourage the
production of high level ESD and a humid environment inhibits the charge to
a lesser level, presumably because it 'leaks' away. Then is it wrong for us
to attempt to 'dry' the local atmosphere in the hope of gaining consistent
ESD from an ESD gun, that is to say the more humid the environment the more
efficiently the discharge will transfer to the victim?

Incidentally, to add to the thread regarding intermediate level testing for
ESD and EFT. This exercise has revealed different failure mechanisms at
different ESD levels.

Your views would be appreciated.

Vic Gibling
Compliance Engineer
Marconi Applied Technologies

 

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RE: IEC 61000-4-2 ESD 61000-4-5 Surge lower levels

2002-06-11 Thread Pommerenke, David

Dear Group,

The physics of air discharge (= the reason for the variatins, the effect of 
humidity, speed of approach) is quite well explained in

D. Pommerenke, 'ESD: Transient Fields, Arc Simulation and Rise Time Limit' , 
Journal of Electrostatics 1995 36 (1995), pp. 31 - 54

David Pommerenke


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RE: IEC 61000-4-2 ESD 61000-4-5 Surge lower levels

2002-06-11 Thread Pommerenke, David
Dear Scott,
 
(1)
I have looked at quite a bit of literature that plots
 
   Failure propatibility   vs.  Stress level in contact mode like testing
 
and have seen very few none-monotonic EUTs that show the none-monotonic 
behavior over a larger voltage range.
 
(2)
In my five year test practise at HP, I have only seen one EUT that failed at 
lower levels and passed at higher levels in contact mode.
 
 
If you have data that showsAs others have said, I have seen numerous failures 
at less than the maximum required test voltage while the same system passes at 
the max required voltage. please share that data with me if it is in contact 
mode and if the number of discharges at each level is large enough to obtain an 
acceptable confidence level.
 
Regards
 
   David Pommerenke
 
 
 

[Pommerenke, David]  -Original Message-
From: Scott Douglas [mailto:dougl...@naradnetworks.com]
Sent: Monday, June 10, 2002 4:46 PM
To: emc-p...@majordomo.ieee.org
Subject: RE: IEC 61000-4-2 ESD  61000-4-5 Surge lower levels



David,

I disagree with you here. As others have said, I have seen numerous failures at 
less than the maximum required test voltage while the same system passes at the 
max required voltage. It seems to me the intent was / is / should be to verify 
product performance up to a maximum level, not just at that level. The logic 
here would be that the standards writing group would make the test cover 
reasonable ground up to some limit because it is quite common that anything up 
to that limit could happen. The reason for the limit is because it is uncommon 
for things larger / higher than the limit to happen. Contact discharge is the 
only way to make reliable and repeatable tests for ESD. No approach speed 
issues, etc. So testing at low levels and working up to a maximum limit is a 
reasonable test method.

On the other hand, I find air discharge to be a difficult and not very 
repeatable test to do which causes me to question its usefulness. Yes, I agree 
that people interacting with products will more often see air discharge rather 
than contact discharge. But I also find it impossible to reliably repeat air 
discharge test results. The old approach speed, distance and coordinates of 
contact point issue. Until someone can make an automated air discharge tester 
that keeps human interactions out of the process, I can't see it being 
corrected. That said, testing at lower levels is just as necessary here.

Regards,
Scott Douglas


Senior Compliance Engineer
Narad Networks
515 Groton Road 
Westford, MA 01886
office:  978 589-1869
cell: 978-239-0693
dougl...@naradnetworks.com
www.naradnetworks.com http://www.naradnetworks.com/ 

At 08:36 AM 6/10/02 -0500, Pommerenke, David wrote:




Dear Group,

For most EUTs there is no need to do lower level testing in contact mode ESD. 
The time is better spend (meaning a better test results uncertainty is 
achieved) if the number of discharges is increased at the highest test level 
(hundreds is a good number). Although it is possible that a system fails at 
e.g., 2 kV contact mode (e.g., incomplete reset) and passes at 4 kV contact 
mode (full self-recovering quick reset) the likelyhood of that happening is not 
that large to require it in a standard.

For air discharge lower level testing is needed, as the risetime is often much 
lower at lower voltages. Of course, if no discharge occurs, no further testing 
at even lower levels makes sense.

I do know that what I am saying violates the present IEC 61000-4-2 standard. ut 
it reflects the coming version of IEC 61000-4-2. The standard does not intend 
to protect agains every possible ESD failure. 

I would like to receive your input, as I am one of the US-representatives in 
IEC TC77b WG-9 (ESD).

David Pommerenke








RE: IEC 61000-4-2 ESD 61000-4-5 Surge lower levels

2002-06-10 Thread Pommerenke, David

Dear Group,

For most EUTs there is no need to do lower level testing in contact mode ESD. 
The time is better spend (meaning a better test results uncertainty is 
achieved) if the number of discharges is increased at the highest test level 
(hundreds is a good number). Although it is possible that a system fails at 
e.g., 2 kV contact mode (e.g., incomplete reset) and passes at 4 kV contact 
mode (full self-recovering quick reset) the likelyhood of that happening is not 
that large to require it in a standard.

For air discharge lower level testing is needed, as the risetime is often much 
lower at lower voltages. Of course, if no discharge occurs, no further testing 
at even lower levels makes sense.

I do know that what I am saying violates the present IEC 61000-4-2 standard. ut 
it reflects the coming version of IEC 61000-4-2. The standard does not intend 
to protect agains every possible ESD failure. 

I would like to receive your input, as I am one of the US-representatives in 
IEC TC77b WG-9 (ESD).

David Pommerenke





-Original Message-
From: Neil Helsby [mailto:nei...@solid-state-logic.com]
Sent: Monday, June 10, 2002 4:56 AM
To: emc-p...@majordomo.ieee.org
Cc: kro...@yahoo.com
Subject: Re: IEC 61000-4-2 ESD  61000-4-5 Surge lower levels



I think there are two points here.

1)  If you believe that in the environment in which it will be 
used, your product may be subject to levels in excess of that defined 
in the standard, you must test to that higher level.

2)  Yes, failures can occur at mid range levels. We have just 
recently experienced this problem with ESD. Below about 3.5 kV and 
above about 4.5 kV the product worked fine. But at 4 kV we 
experienced a failure mode. If we had only tested at 8 kV we would 
have missed the problem.

I also had a problem some years ago with mains voltage dips 
to 0V. Having a test set that enabled the period to be varied in ms 
increments, I discovered a problem affecting a voltage regulator. 
When the mains dip was between about 16 ms and 35 ms, the regulator 
went into a bistable mode switching on then off at each pulse. 
Outside these periods, it worked satisfactorily, eventually losing 
output when the period was extended.

The problem with investigating these types of failure is determining 
the size of step between measurements. Too short a step and you will 
be testing forever, too long and you could miss a narrow band of 
problem.

Regards,

Neil Helsby


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RE: Suitable CDN for IEC61000-4-6 ethernet 10/100

2002-04-19 Thread Pommerenke, David

What you should take into account is the failure criteria for 61000-4-6 as seen 
by the EU: No degradation beyond manufactueres specification. 

Depending on the EUT just a few additional bit-errors at any of the tested 
frequencies may be a fail. It may not be sufficient to just look at loss of 
link. In many cases, a low level LAN-analyzer is needed to do this test. 
Otherwise, effects of lessere severeness than loosing link will not be 
detected, although they may be a fail of the test.

David Pommerenke

-Original Message-
From: Chris Maxwell [mailto:chris.maxw...@nettest.com]
Sent: Friday, April 19, 2002 7:53 AM
To: emc-p...@majordomo.ieee.org
Subject: RE: Suitable CDN for IEC61000-4-6 ethernet 10/100



From David Sterner's message:
Most people use the EM clamp.  We test to EN50130-4 alarm
system limits:
10V, pulsed and AM modulated.  The test is trivial because of
the inherent
immunity of Ethernet;  be sure you understand the EUT and AE
port
partitioning algorithms.

What!  The test is trivial because of the inherent immunity of Ethernet.

The last product that I took through the lab couldn't even take
3V...heck, the Ethernet cable couldn't even take 3V being put on some of
the other cables in the chassis.

Now, before everybody sends me design tips for Ethernet immunity...save
your breath... the chassis was a purchased computer.  It was EMC tested
(with only a dummy ethernet cable and no traffic, mind you).  And I have
no design control of the ethernet circuit.  We ended up using shielded
Ethernet cables and invoking the 3meter rule.

The point that I'm trying to make is...I'm glad that this test is
trivial for your products.  Obviously, you have a good design
there(Where were you when we were looking for a compliant mainframe
to use with our system?)  But this type of immunity performance cannot
be attributed to all Ethernet ports in general or to the Ethernet
protocol in general.

Best regards,

Chris Maxwell | Design Engineer - Optical Division
email chris.maxw...@nettest.com | dir +1 315 266 5128 | fax +1 315 797
8024

NetTest | 6 Rhoads Drive, Utica, NY 13502 | USA
web www.nettest.com | tel +1 315 797 4449 | 





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RE: ESD Generator confidence test - Pelligrini Target

2002-02-26 Thread Pommerenke, David

Just one comment on the Pelligrini Target:

We compared different Pelligrini Targets that were all made to the 
specifications.
 - Up to 1 GHz they perform reasonably close
 - Above 1 GHz large differences show up, although they are all made to the 
drawings.
 - All of them show resonances in their S21 above 1 GHz.
 - The input impedance goes up into the kOHm range, i.e., the current that is 
injected
   is very different from the current that would be injected into a large 
ground plane.

Consequence
===
If you use a scope with 1 GHz bandwidth, the Pelligrini Target is good. That is 
what it was designed for.

If you use a scope with  1GHz bandwidth, you should use a better target AND 
characterize the frequency response
of the target - attenuator - cable chain. The differences between a good target 
and the Pelligrini target will get worsen if:
  - you use larger bandwidth
  - you analyze the current derivative or the ringing on the rising edge.

Regards

David Pommerenke

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RE: ESD Generator confidence test

2002-02-25 Thread Pommerenke, David
Dear Group,
 
There is a big misunderstanding about verification, calibration, daily 
check etc. 
 
I am member of IEC TC77B WG-9 (ESD). We discussed what we want the user to do 
and the present opinion is as follows (A new draft of the ESD standard will 
reflect this position):
 
(1) Formal calibration
===
Every year (or any other interval set by the quality system) a formal 
calibration of the ESD simulator is done. This requires using calibrated 
equipment and tracebility.
 
 
(2) Tests done to gain confidence that the simulator is still within specs
===
At intervals totally determined by the user a quick check is done. This does 
NOT require tracebility. For example, if the user uses a 500 MHz (too slow for 
an official calibration) scope to check the waveform at one level and one 
polarity. Now the user compares the waveform from the 500 MHz scope to the a 
waveform obtained after the last formal calibration. Using engineering 
judgement, the user can not determine if the ESD generator is probably still 
OK. 
 
What is important to note: Only for the formal calibration calibrated equipment 
is needed. Typically, this is done once a year. Every other method to gain 
confidence in the ESD simulator status does NOT have to be traceble. 
 
For example, for a quick check (weekly) at some HP sites a system (Has been 
published in Compliance Engineering) is used that measures the peak current and 
its pulse-to-pulse variations (using an extremly fast peak detector). Now if 
the peak current is OK, the assumption is made that the generator is still OK. 
This assumption is based on the experience that most failures in an ESD 
simulator will show up as a change of the peak current. The method has been 
accpeted by A2LA, DATech and other accreditation agencies.
 
Still, this is not an official statement by IEC.
 
Regards
 
David Pommerenke
 

-Original Message-
From: Michael Taylor [mailto:mtay...@hach.com]
Sent: Monday, February 25, 2002 12:32 PM
To: 'Kevin Harris'; 'vic.gibl...@raytheon.co.uk'; emc-p...@majordomo.ieee.org
Subject: RE: ESD Generator confidence test



We looked at the unit and almost purchased one.  However, we discovered the 
annual cost to ship it back to Belgium + the calibration costs amounted to 
almost 78% of the purchase price.  It just was not economical.  If someone in 
the USA could calibrate it at lower cost it's a great product.

Michael Taylor 
Still shoveling snow in Colorado 

-Original Message- 
From: Kevin Harris [ mailto:harr...@dscltd.com] 
Sent: Monday, February 25, 2002 7:59 AM 
To: 'vic.gibl...@raytheon.co.uk'; emc-p...@majordomo.ieee.org 
Subject: RE: ESD Generator confidence test 



Vic, 

A couple of years back at the Seattle IEEE EMC show a go/ no go confidence 
tester for static testing was discussed and demonstrated. I'm not sure if 
that still is commercially available but if you email Ivan Hendrikx at 
i...@hevrox.be he will be able to tell you more I'm sure. 

Best Regards, 


Kevin Harris 
Manager, Approval Services 
Digital Security Controls 
3301 Langstaff Road 
Concord, Ontario 
CANADA 
L4K 4L2 

Tel: +1 905 760 3000 Ext. 2378 
Fax +1 905 760 3020 

Email: harr...@dscltd.com 


-Original Message- 
From: vic.gibl...@raytheon.co.uk [ mailto:vic.gibl...@raytheon.co.uk] 
Sent: Monday, February 25, 2002 9:00 AM 
To: emc-p...@majordomo.ieee.org 
Subject: ESD Generator confidence test 



The ESD standard IEC 61000-4-2 gives details for the manufacture of a 
current target, used for verifying the ESD waveform. 

I appreciate this could be used as a confidence check before administering 
the test, but does anyone have another approach that they would be willing 
to share. 

Many thanks 

Vic Gibling 

EMC Engineer 

Raytheon Systems Limited 


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RE: Using PCB traces as transient voltage suppressor

2002-02-20 Thread Pommerenke, David

Gabi,

The topic of an air-discharge spark gap is a little bit more complicated. 

1) The breakdown voltage in air for a homogeneous field is given by the 
Paschen-equations, providing
   that the breakdown is a gas discharge process, not an explosive surface 
process (happens at
   high pressure, distances less than about 5um and if the gap is highly 
overvoltaged)
   Even for a homogenous field, the breakdown fieldstrength is a strong 
function of voltage.

2) A spark gap will need some time to turn on. There are two processes:
   Statistical time lag: this is the time it takes before the first electron 
appears that can start the avalange
   process. Time lags may be ps to seconds, depending on the field strength and 
many other factors.

3) Formative time: The time the spark needs from its start until its impedance 
is low. The time may be ns to us.
   

4) Clamping voltage. Typically spark gaps clamp at about 25 V for currents of 
less than 100 A in time frames
   of 10ns to a few hundred ns. I do not know the physical reason for the 25 V. 
If anyone knows, please let me know.

5) In my experience a PCB using the footprint of an 0805 part (not loaded) will 
break down at about 2000-3000V.

6) It is not easy to get breakdown voltages consistantly below 500 V with spark 
gap structures in air. The needed
   distances are so small that surface properties, contamination etc. start to 
dominate.

Regards

David Pommerenke
Associate Professor 
Electromagnetic Compatibility Laboratory
ECE Department
University of Missouri-Rolla
1870 Miner Circle
Rolla, MO 65409-0040

pommere...@ece.umr.edu
Phone: (573) 341-4531
Home:  (573) 341 5835
FAX:   (573) 341-4532






-Original Message-
From: Gabi Hoffknecht [mailto:gab...@simex.ca]
Sent: Wednesday, February 20, 2002 10:33 AM
To: emc-p...@majordomo.ieee.org
Subject: Using PCB traces as transient voltage suppressor



Hi all,

I have seen PCB designs with two triangular shaped copper pads pointed
towards each other at very close proximity, meant as an air gap discharge
path for transients. Does anyone have information about such designs,
whether they work and how well ? At a breakdown voltage for air of 1
Megavolt per meter, they should theoretically work: 10mil distance would
have a breakdown voltage of only 254V. Such a PCB design basically comes for
free, so I was thinking of adding it on top of my already existing series
impedance - TVS network. 
Thanks in advance for your comments.

Best regards,
Gabi Hoffknecht

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RE: ESD Simulator Evaluation

2001-12-04 Thread Pommerenke, David

Richard,

There are two reasons for this: 

Physical reason
===
1) When you are approaching with an ESD simulator there is a distance at
which a spark MAY occur. This distance can be calculated ONLY for a
homogenious field quite well, using Paschen's equation. In a homogeneous
field those values are:
  30 kV  - 1 cm
  10 kV  - 2.8 mm
   5 kV  - 1.1 mm
   3 kV  - 0.55 mm

for sea-level air pressur. Humidity has hardly any influence on this value.

For in-homogenous field, the values are longer, but not easy to calculate.
As you said 1 inch at 30 kV the field must have been inhomogenous. 

Never mind: Just remember: If you approach there is a certain distance at
which a breakdown MAY occur, if you wait long enough.

Now as you are approaching and passing this distance there MUST not be a
breakdown. The breakdown will only happen if there are initial charge
carriers that initiated the breakdown. If there is a lack of such charge
carriers, the distance between the tip and ground will be further reduced,
until the breakdown is initiated.

So in your case that may be the reason: Using fast approach the voltage was
OK, but the shorter sparks are caused by a delayed onset.

The delay of the onset is a statistical process (called statistical time
lag) and the reason for the bad reproducibility of air discharge testing. 


Instrumentation reason
==
2) The voltage was not OK. I doubt that, as the voltage will not be
dependent on the approach speed. The voltage may depend on corona, but if
the the tip is not pointed, there will probably not be corona.



David Pommerenke
Associate Professor 
Electromagnetic Compatibility Laboratory
ECE Department
University of Missouri-Rolla
1870 Miner Circle
Rolla, MO 65409-0040

pommere...@ece.umr.edu
Phone: (573) 341-4531
Home:  (573) 341 5835
FAX:   (573) 341-4532





-Original Message-
From: richwo...@tycoint.com [mailto:richwo...@tycoint.com]
Sent: Tuesday, December 04, 2001 9:32 AM
To: emc-p...@majordomo.ieee.org
Subject: ESD Simulator Evaluation



An engineer was evaluating ESD simulators and observed an interesting
phenomenon.  

 The air discharge tip was placed at a fixed distance of about 1 inch from
 a ground reference plane with the simulator set for 30 kV and a healthy
 spark was launched by all of the simulators.  
 
 HOWEVER, when he started from some distance and rapidly approached the
 grp, one of the simulators appeared to have lost 2/3 of the charge.  The
 other 3 did not.  He base the conclusion on the fact that the spark
 launched from about 1 inch for 3 simulators, but launched from about 1/3
 inch from one unit when using the rapid approach air discharge method.
 Any suggestions on what is happening here?
 
 Evaluation of simulators is specified using a target with the tip
 contacting the target.  We 
 did not see a parameter in the standard that allows one to evaluate the
 ability of a simulator tip to hold a charge.  Did we miss something?
 
Richard Woods
Sensormatic Electronics
Tyco International

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RE: Pre-amps

2001-11-16 Thread Pommerenke, David

Ken,

The added uncertainty is exactly as large as if you have a piece of cable
(assume too short to have relevant losses) inbetween.

David Pommerenke

-Original Message-
From: Ken Javor [mailto:ken.ja...@emccompliance.com]
Sent: Friday, November 16, 2001 12:05 PM
To: Pommerenke, David; 'ravinder ajmani'; marti...@appliedbiosystems.com
Cc: emc-p...@majordomo.ieee.org
Subject: Re: Pre-amps


Note I am replying to all.  What is the measurement inaccuracy associated 
with a mismatch if the transmission line is vanishingly short (relative to a
wavelength)?

--
From: Pommerenke, David davi...@ece.umr.edu
To: 'Ken Javor' ken.ja...@emccompliance.com, 'Ravinder Ajmani'
ajm...@us.ibm.com, marti...@appliedbiosystems.com
Cc: emc-p...@majordomo.ieee.org
Subject: RE: Pre-amps
Date: Fri, Nov 16, 2001, 8:10 AM


 Dear Ken,

 I am thinking you are missing something (hope that I am correct).
 If you simply shorten the cable to zero, the problem of the missmatch, and
 the effect of an error that is not corrected for by the antenna factor
still
 remains.

 David Pommerenke

 -Original Message-
 From: Ken Javor [mailto:ken.ja...@emccompliance.com]
 Sent: Thursday, November 15, 2001 5:51 PM
 To: Pommerenke, David; 'Ravinder Ajmani'; marti...@appliedbiosystems.com
 Cc: emc-p...@majordomo.ieee.org
 Subject: Re: Pre-amps


 If input VSWR for preamp and output VSWR for antenna are both bad, then it
 seems a simple solution is to connect preamp input to antenna output and
let
 50 Ohm output of preamp drive cable, solving two problems at once.  Am I
 missing something?

 --
From: Pommerenke, David davi...@ece.umr.edu
To: 'Ravinder Ajmani' ajm...@us.ibm.com,
marti...@appliedbiosystems.com
Cc: emc-p...@majordomo.ieee.org
Subject: RE: Pre-amps
Date: Thu, Nov 15, 2001, 7:49 AM



 On the amps:

 For emissions there are the following electrical criteria:

  - Noise figure  expect about 4 dB for a broadband amp 30 MHz - 2 GHz.
The noise figure is often larger at the lower frequencies if the
 amplifier goes up to many GHz.

  - Input SWR. This is important. Most broadband amps (especially if they
 go
 up to many GHz)
have a bad input match at low frequencies. As the log-per antennas
have
 a
 bad mismatch too,
you will have multiple reflections on the cable between the antenna
and
 the pre-amp.
This reflections will influence your measurement and cannot be
 corrected
 for by the antenna
factor. They may be as large as a few dB below 100 MHz. For that
 reason,
 you may be forced
to add a 3 dB attenuatore at the antenna. This increases your noise
 figure by 3 dB.

  - Gain. Of course, you need only as much gain as is needed to overcome
 the
 cable loss (cable to
the spectrum analyzer) and the noise figure of the spectrum analyzer.
 More gain will not help
you.

 David Pommerenke

 -Original Message-
 From: Ravinder Ajmani [mailto:ajm...@us.ibm.com]
 Sent: Wednesday, November 14, 2001 1:27 PM
 To: marti...@appliedbiosystems.com
 Cc: emc-p...@majordomo.ieee.org
 Subject: Re: Pre-amps




 Joe,
 HP (Agilent) make good Pre-amps for different frequency ranges.  If you
 are
 looking for an economical solution then you may try Com Power Corp. at
 (949) 587-9800.

 Regards, Ravinder
 PCB Development and Design Department
 IBM Corporation
 Email: ajm...@us.ibm.com


***
 Always do right.  This will gratify some people and astonish the rest.
  Mark Twain





 MartinJP@appliedbiosyst

 ems.com   To:
 emc-p...@majordomo.ieee.org
 Sent by:  cc:

 owner-emc-pstc@majordom   Subject: Pre-amps

 o.ieee.org





 11/14/2001 10:14 AM

 Please respond to

 MartinJP









 I am having some difficulties locating manufacturers that provide preamps
 with a 20-22dB gain.

 What manufacturer/model do you recommend? Why?

 Your assistance is appreciated.

 Regards

 Joe Martin
 Applied Biosystems


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RE: Pre-amps

2001-11-15 Thread Pommerenke, David

On the amps:

For emissions there are the following electrical criteria:

 - Noise figure  expect about 4 dB for a broadband amp 30 MHz - 2 GHz.
   The noise figure is often larger at the lower frequencies if the
amplifier goes up to many GHz.

 - Input SWR. This is important. Most broadband amps (especially if they go
up to many GHz)
   have a bad input match at low frequencies. As the log-per antennas have a
bad mismatch too,
   you will have multiple reflections on the cable between the antenna and
the pre-amp.
   This reflections will influence your measurement and cannot be corrected
for by the antenna 
   factor. They may be as large as a few dB below 100 MHz. For that reason,
you may be forced
   to add a 3 dB attenuatore at the antenna. This increases your noise
figure by 3 dB.
 
 - Gain. Of course, you need only as much gain as is needed to overcome the
cable loss (cable to
   the spectrum analyzer) and the noise figure of the spectrum analyzer.
More gain will not help
   you.

David Pommerenke

-Original Message-
From: Ravinder Ajmani [mailto:ajm...@us.ibm.com]
Sent: Wednesday, November 14, 2001 1:27 PM
To: marti...@appliedbiosystems.com
Cc: emc-p...@majordomo.ieee.org
Subject: Re: Pre-amps




Joe,
HP (Agilent) make good Pre-amps for different frequency ranges.  If you are
looking for an economical solution then you may try Com Power Corp. at
(949) 587-9800.

Regards, Ravinder
PCB Development and Design Department
IBM Corporation
Email: ajm...@us.ibm.com
***
Always do right.  This will gratify some people and astonish the rest.
 Mark Twain



 

MartinJP@appliedbiosyst

ems.com   To:
emc-p...@majordomo.ieee.org 
Sent by:  cc:

owner-emc-pstc@majordom   Subject: Pre-amps

o.ieee.org

 

 

11/14/2001 10:14 AM

Please respond to

MartinJP

 

 





I am having some difficulties locating manufacturers that provide preamps
with a 20-22dB gain.

What manufacturer/model do you recommend? Why?

Your assistance is appreciated.

Regards

Joe Martin
Applied Biosystems


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RE: EMC test table construction plans

2001-11-02 Thread Pommerenke, David

John,

You are arguing

Should the test conditions not reflect the actual environment in use of
the product, rather than employ these unusual materials?

The problem is that we do not know the actual conditions. So we need to
define the test conditions. If everyone use be using the SAME wooden table,
it would be fine. But that is not the case and there are large variations
between different wooden tables, surface materials etc.

So if one uses a wooden table, its influence must be taken into the
uncertainty calculation. This adds a few more dBs, much more above 1 GHz. In
radiated immunity it is even worse, as there is no maximization done.

David Pommerenke





-Original Message-
From: John Woodgate [mailto:j...@jmwa.demon.co.uk]
Sent: Friday, November 02, 2001 1:34 AM
To: emc-p...@majordomo.ieee.org
Subject: Re: EMC test table construction plans



I read in !emc-pstc that Pommerenke, David davi...@ece.umr.edu wrote
(in 9da8d24b915bd1118911006094516eaf0ba31...@umr-mail02.cc.umr.edu)
about 'EMC test table construction plans', on Thu, 1 Nov 2001:
For emissions and immunity you should not use any wood in the table. It
will
significantly (+/-2 dB up to 1 GHz for emissions , more above, +/-10 dB for
immunity up to 1 GHz) change the test result. My experience has shown that
Styrofoam is basicly the best material. 

You mean that it gives the worst-case results?

There are a couple of published
papers on this issue. As surface material the following worked out fine:

  - Foamed PVC (rather stiff, low dielectric constant due to the foamed
nature), maybe 4 mm thick.

  - PE sheet, maybe 2 mm thick.

Should the test conditions not reflect the actual environment in use of
the product, rather than employ these unusual materials?
-- 
Regards, John Woodgate, OOO - Own Opinions Only. http://www.jmwa.demon.co.uk

Eat mink and be dreary!

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RE: EMC test table construction plans

2001-11-01 Thread Pommerenke, David

Doug,

For emissions and immunity you should not use any wood in the table. It will
significantly (+/-2 dB up to 1 GHz for emissions , more above, +/-10 dB for
immunity up to 1 GHz) change the test result. My experience has shown that
Styrofoam is basicly the best material. There are a couple of published
papers on this issue. As surface material the following worked out fine:

  - Foamed PVC (rather stiff, low dielectric constant due to the foamed
nature), maybe 4 mm thick.

  - PE sheet, maybe 2 mm thick.

David Pommerenke



-Original Message-
From: POWELL, DOUG [mailto:doug.pow...@aei.com]
Sent: Thursday, November 01, 2001 11:38 AM
To: EMC-PSTC (E-mail)
Subject: EMC test table construction plans



Hello all,

I plan to construct my own insulated EMC test table for a 5 meter chamber.
Seems simple enough to do and I could easily come up with something.  I
thought I might first ask for input from those of you in the discussion
group who have experience or maybe even construction plans.  Here are some
features I want:

1) I will be testing products that weight up to 200 Lbs (91 kg).

2) I want to minimize metalic fastners.

3) I would like to make it a pivoting table (not motorized).

4) Height is 80 cm.

5) The surface should be replacable if it gets badly worn or scarred.  I'm
thinking of using hardboard.

6) Suggestions on length  width?

-doug

---
Douglas E. Powell, Compliance Engineer
Advanced Energy Industries, Inc.
Mail stop: 203024
1626 Sharp Point Drive
Ft. Collins, CO 80525

970.407.6410 (phone)
970-407.5410 (fax)
mailto:doug.pow...@aei.com
---



_ 

This message, including any attachments, may contain information that is
confidential and proprietary information of Advanced Energy Industries, Inc.
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ESD simulators

2001-10-08 Thread Pommerenke, David



I like to compile a list of all commercially available ESD simualtors for
system level tests to 61000-4-2:

In my list I have:

   KeyTek Minizap
   KeyTek KeyTek 2000
 
   Schaffner  435 
   Schaffner  432
 
   EM-TestESD-30c
   EM-TestESD unit to universal tester UCS 500

   EMC-partner  TRA 2000

   Hotek Tech  ESDC - 30

   Haefely SESD 200 ESD SIMULATOR SYSTEM


Is anyone aware of other models ?

Thanks

David Pommerenke
Associate Professor 
Electromagnetic Compatibility Laboratory
ECE Department
University of Missouri-Rolla
1870 Miner Circle
Rolla, MO 65409-0040

pommere...@ece.umr.edu
Phone: (573) 341-4531
Home:  (573) 341 5835
FAX:   (573) 341-4532



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RE: ESD Immunity Testing

2001-09-29 Thread Pommerenke, David

John,

Quite true. 

But on the other side: If a softerror occurs in the field, it is very hard
to determine what caused it. Thus, we probably do not know how many
ESD-softerrors occur on consumer products in the field. But often there is
'No trouble found' on customer returns. This does not prove that it was ESD.

The problem is more the repeatability of test results between companies with
an OEM relationship or between different test labs within the same company
then field failures. The IEC standard never intended to prevent field
failures, e.g., for safety or medical devices there are many discharge
possibilities (e.g, Charged Cable Event, furniture ESD, very fast risetimes)
that are not covered by the standard, no matter how many discharges one
uses.



David Pommerenke
Associate Professor 
Electromagnetic Compatibility Laboratory
ECE Department
University of Missouri-Rolla
1870 Miner Circle
Rolla, MO 65409-0040

pommere...@ece.umr.edu
Phone: (573) 341-4531
Home:  (573) 341 5835
FAX:   (573) 341-4532





-Original Message-
From: John Woodgate [mailto:j...@jmwa.demon.co.uk]
Sent: Friday, September 28, 2001 11:47 AM
To: emc-p...@majordomo.ieee.org
Subject: Re: ESD Immunity Testing



I read in !emc-pstc that wo...@sensormatic.com wrote (in 846BF526A205F8
4BA2B6045BBF7E9A6A43A3C9@flbocexu05) about 'ESD Immunity Testing', on
Fri, 28 Sep 2001:
So here is my question to those of you involved in the EN/IEC standards -
why have these statistical test processes not been  acknowledged in the
standards?

Perhaps because products that pass the tests, however minimal, prove
sufficiently immune in practice. I feel sure that if tested products
were falling over in the field in large numbers, there would be swift
moves to make the test more stringent.
-- 
Regards, John Woodgate, OOO - Own Opinions Only. http://www.jmwa.demon.co.uk

Eat mink and be dreary!

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RE: ESD Immunity Testing

2001-09-28 Thread Pommerenke, David

Richard,

Presently, the IEC 61000-4-2 standard is being revised. The main aim of the
revision is:

   Improve the repeatability of test results !


This includes a discussion on the number of discharges. But increasing them
is meeting lots or resistance: 

  People simply do not want to increase the test time. 

To some extend this can be avoided by using a faster rep-rate. But there are
failure mechanisms that only show up at faster rates. Thus, if something
fails at 20 pulses a second (contact mode) it may not fail at 1 pulse a
second. Now a decision has to be made: Is the pass/fail based on the 1 or
the 20 Pulse per second result. I think, it should be based on the 1 pulse
per second result. In the standard, it is assumed that each pulse is
independent of all previous, i.e., that the system has returned to its
normal condition from a software and from a electrostatic point of view. 

There are also other arguments against increasing the number of discharges.
   
   - Time dependence of the sensitivity is mainly relevant to soft-errors,
but not to hard errors.
 Thus, if the failure mode at some test point is a harderror, then there
would be no reason
 to apply this statistical method. Even worse, if the ESD hits some sort
of a protection circuit
 it may damage the protection circuit, while in reality, that test point
would not see very
 many ESDs during the life of the product.

  -  The IEC 61000-4-2 standards are basic standards. They do not intend to
provide a perfect protection,
 but only a minimal level. Now one can argue, that using only 10 pulses,
the minimal level can
 not be determined. Thus, using the procedure in the standard, noone can
make a decision about
 pass and fail.

  -  For failure mechanisms related to dielectric breakdown, a different
statistical method is needed.
 But the number of discharges can be much less than a few hundred to
obtain good data on the dielectric
 breakdown probability of a certain air-gap.

Many company ESD standards require more discharges than the IEC 61000-4-2
requirement.


David Pommerenke
Associate Professor 
Electromagnetic Compatibility Laboratory
ECE Department
University of Missouri-Rolla
1870 Miner Circle
Rolla, MO 65409-0040

pommere...@ece.umr.edu
Phone: (573) 341-4531
Home:  (573) 341 5835
FAX:   (573) 341-4532







-Original Message-
From: wo...@sensormatic.com [mailto:wo...@sensormatic.com]
Sent: Friday, September 28, 2001 7:28 AM
To: emc-p...@majordomo.ieee.org
Subject: ESD Immunity Testing



Since my last posting on trying to find an ESD expert, I have had to become
that expert. After reading the ANSI ESD standard and its references, it is
clear that ESD experts are mostly in agreement on how to correctly perform
ESD immunity testing. It is also clear test methods in the EN/IEC
specifications do not follow that advice.

ESD testing is a statistical process, so the test methods and the analysis
of the results must be based upon statistics. There are three basic causes.

1) The distribution of ESD events in the operating environment has a
non-uniform distribution where the number of expected events per hour is
inversely proportional to approximately the square of the voltage. This
implies in testing that the number of applied zaps in testing and their
levels should also follow this distribution.

2) Digital devices are state machines and some states may be less immune to
ESD than other states. This implies that each state should be tested.
However, most digital devices have a huge number of states and they change
very quickly; therefore, the only way to ensure that even most of the states
have been evaluated is to apply a very large number of zap. 

3) There may be a probability distribution for the locations on the machine
where an ESD discharge is likely to occur. That is, it is not always equally
likely that a person or an object will come in contact with any given point
on any given surface.

Statistics can be used to determine the voltage levels that should be
applied and the quantity required at each level in order to provide a
specified confidence level that a machine will have no more than a specified
number of errors per unit time. However, the number of zaps required is very
high, usually in the order of one to ten thousand. The drawback, of course,
it that the testing can be time consuming. However, applying in the order of
one hundred zaps to a machine according to the EN/IEC specifications will
provide such a very, very low confidence level that one cannot reasonably
predict the expected error rate in the field. Worst, the results are not
repeatable since some states may be tested during one test session and
others may be tested during another session. The only predictable case where
this might not occur would be with a machine with an ESD robustness level
for all states that are far above the actual test levels.

So here is my question to those of you involved in the 

RE: ESD Testing

2001-08-19 Thread Pommerenke, David

Dear Richard,

Hewlett Packard tests to more than 15 kV.

But please be aware: The severeness of an ESD tests does not always increase
with the test voltage. Depending on the physical  failure mechanism (energy,
current, derivative, fields, E-field, H-field, etc.) it will go down with
voltage for air discharge. 

Testing  15 kV is done for the following reasons:

  - An environment with a LAREG likelyhood of  15 kV: 
  All mobile environments.
  Spacecrafts (special case)
 
  - Low likelyhood of  15 kV ESDs but an EUT which needs to be very
reliable:
  Medical
  Safety related

  - The company wants to ensure that the EUT will pass 8 kV after some years
of usage. Changes are:
  Contamination
  Cracks in plastic joints etc.
  Moisture
  The effect of these parameters on the sparking length are not easy to
predict.

  - The company wants to ensure that it will pass 10 kV at high altidue.
Note that the breakdown distance
is somewhat 1/proportional to air pressure. If you pass 15 kV in San
Diego, you probably pass no more
than 10 kV in Denver.
 
  - Customer requirement.

  - To impress the customer.

  - As a company tradition.

In most cases  15 kV testing is done in air discharge. If you are looking
not only for survival, but for error-free operation, you should use contact
mode testing whereever possible. If you look for error-free operation, it is
also very important to test at a lower voltage in contact mode (e.g., 6kV)
using a fast risetime simualtor (e.g., 100 ps). 

There are a larger set of simulators which can do  15 kV. E.g.,

  KeyTek 2000
  NoiseKen
  some Schaffner (not sure)
  some EM-Test   (not sure)
  
Failure criteria depends on the product. 

David Pommerenke
University Missouri-Rolla, 1870 Minor Circle,  118 EECH
Rolla, MO 65409-0040
ph:  573 341 4531
home: 573 341 5835
fax: 573 341 4532  
email: pommere...@ece.umr.edu



-Original Message-
From: wo...@sensormatic.com [mailto:wo...@sensormatic.com]
Sent: Tuesday, August 14, 2001 8:56 AM
To: emc-p...@majordomo.ieee.org
Subject: ESD Testing



Do any of you perform ESD testing at or above 15 kV to improve product
robustness? I have the following questions.

o   What types of products
o   What type of user environment
o   What is the rational for testing above 15 kV
o   What test equipment is used above 15 kV
o   What test procedure is used above 15kV
o   What is the pass/fail criteria above 15 kV

Thanks, Richard Woods

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radiated immunity 2 GHz

2001-08-08 Thread Pommerenke, David

I upgraded a chamber at hp and looked at:

 1) How to pass the 16 point call up to 3 GHz
 2) How to upgrade /change add absorbers
 3) Which commercial antenna works best from 26 Mhz - 3 GHz
 4) How much power is needed.
 5) How well does the signal repeat.
 6) Field probes
 7) etc.

The lab is the Hewlett-Packard Roseville Hardware Test Lab.

On (2): It turned out that adding absorbers to the floor always spoiled the
low frequency (about 80-150MHz) if it improved the high frequency. No matter
which absorber type or arrangement on the ferrite-floor tried. 
But one topology worked very well:  Having 5 inch absorbers placed 60 cm
above the ground (on a Styrofoam support). Two of those absorbers were
placed between the antenna and the turntable. In this arrangement the 16
point cal was passed from 26 MHz to 2.9 GHz (I did not measure any higher).
The shadow of the absorber did not reduce the field strength at lower
frequencies below 0.8 m height a lot (although there is no regulation on the
field strength below 0.8 m).

I looked at different log-per antennas (needed power, effect on 16point cal,
robustness, weight, handling, SWR, etc.). None of them was a clear winner.
Gain wise (judging by needed [power to achieve a certain field strength in
this specific chamber), the EMC-Automation antenna was a little a head, but
it is also larger and quite heavy.

Cable loss is an important factor. Using 25 Watt and having about 3m cable
will allow 10 V/m, but there may already be some distortion in the
modulation. I think 25 Watts is the minimum for10 V/m from 1 GHz to 3 GHz.

Signal reproduction is not that bad, but mechanical positions of absorbers,
antenna etc. needs to be controlled very well.

All the field probes I tested had some problems. Some did not fulfill their
isotropicity specifications, some did not fulfill the frequency response
specifications some did not allow the promised number of measurements a
second. But for every probe there was a combination of position relative to
the field and sampling rate at which it provided good data.

If you need any further information, contact me.

If you want to use the chamber for immunity testing contact Ken Hall
ken_h...@hp.com

David Pommerenke

University Missouri-Rolla, 1870 Minor Circle,  118 EECH
Rolla, MO 65409-0040
ph:  573 341 4531
home: 573 341 5835
fax: 573 341 4532  
email: pommere...@ece.umr.edu


-Original Message-
From: wo...@sensormatic.com [mailto:wo...@sensormatic.com]
Sent: Tuesday, August 07, 2001 1:41 PM
To: emc-p...@majordomo.ieee.org
Subject: RE: ETSI EMC Standard



An ETSI representative told me that he thought that most all EU labs have
upgraded their chambers and equipment and are now ready to test. That same
person asked if the US labs were also ready? 

Let's hear from both sides of the Atlantic. Are you prepared?

Richard Woods

--
From:  umbdenst...@sensormatic.com
[SMTP:umbdenst...@sensormatic.com]
Sent:  Tuesday, August 07, 2001 1:20 PM
To:  emc-p...@majordomo.ieee.org
Subject:  RE: ETSI EMC Standard


Regarding the change in the standard, has anyone started to look
into an
upgrade to their compact chambers for stre-e-e-etching the frequency
to 2
GHz?  If so, what upgrades did you find most cost effective for 

*   signal generator
*   amplifier
*   antenna
*   sensor
*   e-field probe
*   chamber lining modifications

Perhaps we can develop a database of options and trade-offs before
we need
to spend the big bucks.

Don Umbdenstock
Sensormatic ?


 --
 From: wo...@sensormatic.com[SMTP:wo...@sensormatic.com]
 Reply To: wo...@sensormatic.com
 Sent: Tuesday, August 07, 2001 10:15 AM
 To:   emc-p...@majordomo.ieee.org
 Subject:  ETSI EMC Stadard
 
 
 The final draft of the proposed revision of ETSI EN 301 489-1 is
in the
 voting stage. This standard sets the emissions and immunity
requirements
 for
 most all transmitters. A major change has been made to the
radiated
 immunity
 requirements by adding the frequencies between 1400 MHz and 2000
MHz. I
 was
 told that this change is being driven by CISPR and may be based
upon a
 CISPR
 standard. Does anyone have any information in this regard?
 
 Richard Woods
 
 ---
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