Holger [EMAIL PROTECTED] wrote:
> This time I'm going to place some folded foil to make sure the G3 chip
> is in good contact with the case heat sink. Anyone have any other
> suggestions to keep the board running cooler?
This is exactly what I did. My G3 240/512 now runs at 66C / 150F deg, If I
recall correctly, previously it tended to run about 10-12C higher, even up
to 175-180F. Now it's winter so that surely influences the heat transfer
rate somewhat. Heat dissipation seems much better with the foil lightly
glued in place, more evenly distributed throughout the aluminum/aluminium
pan, with less of a hot spot.
I think most heat related failures are on the 240/1mb which likely runs
hotter. Even my 240/512 has shut down twice when accidentally left on a
black leather couch. The 2400 should have a little air passing underneath so
it's preferable put the little rubber feet on a hard surface. I absolutely
refuse to start hauling around cooling pads--Lombard or Pismo would be a
much better option.
---
Sidney Ho
[EMAIL PROTECTED]
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