At 12:43 PM +0100 1/7/00, Sidney Ho wrote:
>Holger [EMAIL PROTECTED] wrote:
>
>> This time I'm going to place some folded foil to make sure the G3 chip
>> is in good contact with the case heat sink. Anyone have any other
>> suggestions to keep the board running cooler?
>
>This is exactly what I did. My G3 240/512 now runs at 66C / 150F deg, If I
>recall correctly, previously it tended to run about 10-12C higher, even up
>to 175-180F.
One problem with the Newer 240/1M upgrade is that they skimped and
used G3 chips rated to operate at 85C maximum. (At least, that's the
way mine is.) If you were typically running close to 80C before, you
were uncomfortably close to exceeding the max temperature. I wish
they'd used the 105C version.
> Now it's winter so that surely influences the heat transfer
>rate somewhat. Heat dissipation seems much better with the foil lightly
>glued in place, more evenly distributed throughout the aluminum/aluminium
>pan, with less of a hot spot.
I think I started the foil shim thing, and I'm not sure you installed
yours the way I did. (That may or may not be a bad thing.) I don't
have any glue at all. The squarish aluminum heat transfer pad isn't
directly attached to the aluminum sheet metal covering most of the
bottom case. I inserted my folded aluminum foil shim between the
sheet metal and the heat transfer pad. Friction was plenty to keep
it held in place, so I didn't use any glue. (If any of you out there
do this, do not pull up very hard on the heat transfer pad, or you
will break the heat pipe it's attached to and hate yourself.)
Apple did something similar on the 2400/240, but instead of a plain
shim, it's a little spring.
Tim Seufert
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