Timothy A. Seufert <[EMAIL PROTECTED]> wrote:

> At 12:43 PM +0100 1/7/00, Sidney Ho wrote:
>>Holger [EMAIL PROTECTED] wrote:
>>>  This time I'm going to place some folded foil to make sure the G3 chip
>>>  is in good contact with the case heat sink. Anyone have any other
>>>  suggestions to keep the board running cooler?

> I think I started the foil shim thing, and I'm not sure you installed
> yours the way I did.  (That may or may not be a bad thing.)  I don't
> have any glue at all.

Good point. I just used a small dab of rubber cement to hold the aluminum
foil on the rubber pad on the top of the CPU. I wanted to be sure the foil
was correctly placed when the MB was put back in place. Otherwise it's less
certain. It's easily removed and there's not enough glue to harm anything
even if it was melting. I didn't remember your post because I left my 2400
in pieces for the past 5-6 months--that's another story where my 2400 became
very unstable and was constantly corrupting the PRAM, which couldn't be
cleared by the usual button reset. I only put this 2400 back together
because I had 2 power supplies fail for another computer. Now I'm back to
2400 indefinitely. At reduced heat it's rock solid.

> The squarish aluminum heat transfer pad isn't
> directly attached to the aluminum sheet metal covering most of the
> bottom case.  I inserted my folded aluminum foil shim between the
> sheet metal and the heat transfer pad.  Friction was plenty to keep
> it held in place, so I didn't use any glue.

Actually I thought the squarish aluminum heat transfer pad was directly
attached to the aluminum sheet metal covering most of the bottom case, even
though hollow. I guess we did it differently. I believe there may be some
air between the CPU daughter card and the pad. If so, I figured a direct
aluminum conduction medium was much more efficient than hot air
conduction/convection. The addition of the foil shim presses these elements
together, so, at least theoretically, should increase the heat transfer
capacity. The squarish aluminum heat transfer pad is still hollow, and if
previously not directly attached to the aluminum sheet metal is at least now
much more firmly pressed to the bottom pan. In any case the CPU runs
noticeably cooler.


---
Sidney Ho
[EMAIL PROTECTED]
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