the following snip is from the e-protos web site:
(http://www.eprotos.com/Design_help.pdf)
i never had a fab object or had any troubles w/ tenting, what do you all
think?
Suggestions for Tenting Via holes: If Liquid Photo Imageable (LPI)
solder mask is required, we advise that the via holes not be tented.
Tenting the via holes with LPI solder mask will result in the following
problems: incomplete encapsulation of the via hole, exposed copper/metal
on via holes Solder, on via hole pads and in holes, uncured solder mask
in the holes, which results in peeling of LPI and strapping
contamination in side the holes. The solder mask pads for via holes can
be made about 5 mils bigger than the via drill size. This will result in
deposition of solder in the via holes, reduce the possibility of
bridging problems during wave soldering operation. If the via plugging
is used to fill open holes with the solder mask to block air leakage
during In Circuit Test, via plugged one side is the best. We hope the
above mentioned is of some help to you. If you need additional
information or have any questions, suggestions, please feel free to
contact us at (847) 439-5447.
ds
_______________________________________________________________________
Integrated Controls, Inc. Tel: 415-647-0480 EXT 107
2851 21st Street Fax: 415-647-3003
San Francisco, CA 94110 www.integratedcontrolsinc.com
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